Postponement of 2020 FLEX Japan/MEMS & SENSOR FORUM
I hope this finds you all well and healthy. With the developments of COVID-19 coronavirus outbreak and the resulting reschedule of Tokyo 2020 Olympic games, I have to inform you the postponement of this year’s FLEX Japan/MEMS & SENSOR FORUM to December 15 to 17, 2021 at Tokyo Big Sight.
On April 20, 2020, Tokyo Big Sight announced that due to the reschedule of the Tokyo 2020 Olympic and Paralympic Games, East Exhibition Hall of Tokyo Big Sight would be closed until the completion of move-out after the Games in 2021.
Receiving this announcement, SEMI has investigated the possibility to hold 2020 FLEX Japan/MEMS & SENSOR FORUM at a different venue or date but we concluded to postpone the event to 2021 because of the difficulty in securing a venue that can accommodate FLEX Japan/MEMS & SENSOR FORUM along with the co-locating SEMICON Japan even at the minimum necessary scale and an unacceptably high risk of coronavirus infections among the exhibitors and visitors.
Thus, 2020 FLEX Japan/MEMS & SENSOR FORUM is postponed to the next year and will be held as 2021 FLEX Japan/MEMS & SENSOR FORUM on December 15 to 17. Because there still be some uncertainties in the new schedule of Tokyo Olympic and Paralympic Games, I will inform you if a further change in the schedule occurs.
Please also be advised that SEMI concerns the lack of information sharing/exchange opportunities without FLEX Japan/MEMS & SENSOR FORUM and is planning a virtual conference to substitute the programs in early December this year. I will be happy to announce the details of this new event when its schedule and speaker information become available to you.
Thank you for your understanding and cooperation. I hope seeing you in December 2021 in Tokyo.
President of SEMI Japan
- Brings together related markets and technologies including US, Europe, Asia and Japan
- 2-days event focused on FHE,MEMS & SENSORS-related fields, with sessions, exhibitions and receptions
- Opportunity for wide-ranging cross-discipline networking with executives and engineers from semiconductors, module, IoT application, including FHE,MEMS & SENSORS technology
FHE stands for Flexible Hybrid Electronics and is a technology for building the systems that combines flexible substrates based on printed electronics technology or textile with existing semiconductors and MEMS (micro electromechanical systems). In 2015, SEMI formed a strategic partnership with FlexTech Alliance and began focusing on FHE, for which the market is expected to grow. SEMI Japan began activities in Japan in 2016.
2019FLEX Japan/MEMS SENSORS FORUM
2019 FLEX Japan was held at The Grand Hall on Wednesday, May 22 th - 23 th Thursday.