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MILPITAS, Calif. — December 3, 2018 — SEMI, the global industry association representing the electronics manufacturing supply chain, today reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11 percent higher than the same quarter a year ago.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 95 global equipment companies that provide data on a monthly basis.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

 

 

3Q2018

2Q2018

3Q2017

3Q18/2Q18
(Qtr-over-Qtr)

3Q18/3Q17
(Year-over-Year)

China

3.98

3.79

1.93

5%

106%

Korea

3.45

4.86

4.99

-29%

-31%

Taiwan

2.90

2.19

2.37

33%

23%

Japan

2.41

2.28

1.73

6%

40%

North America

1.27

1.47

1.50

-14%

-15%

Rest of World

0.98

0.96

0.74

2%

32%

Europe

0.85

1.18

1.06

-29%

-20%

Total

15.84

16.74

14.33

-5%

11%

Source: SEMI (www.semi.org) and SEAJ, December 2018

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.

About SEMI

SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.  For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org