Mingmei Wang currently works with TEL Technology Center, America LLC. (TTCA) as the Modeling and AI group manager in etch department. She received her PhD degree from Iowa State University majoring in Chemical Engineering in 2011 under supervision of Professor Mark J. Kushner. Her PhD thesis work focused on chamber scale modeling of CCPs using HPEM and feature scale modeling of high aspect ratio contact etch in fluorocarbon plasmas using MCFPM. She investigated charging caused twisting in HARC etch. She also demonstrated that DCS generated high energy electron beam can improve twisting. After graduation from ISU, Mingmei joined Globalfoundries US as a senior process engineer, where she worked on 20nm and 14nm BEOL thin wire dielectric etch process development and transfer. In November 2013, Mingmei joined TTCA and was promoted to manager in 2019. She mentors and leads a group of modeling scientists on various projects closely related to plasma etch process challenges in advanced technology nodes (5nm, 3nm and beyond). Her group is also involved in automation of etch process development and process control using machine learning techniques and physical modeling.