Insights From APHI Sessions Exploring The Interaction Between Advanced Materials, Imaging Fidelity, and Reliability
Advanced Imaging sessions at SEMICON West underscored a subtle but critical shift: imaging performance is increasingly constrained by materials behavior—particularly advanced dielectrics. As interconnect densities rise and line widths shrink, dielectric properties directly influence pattern fidelity, overlay accuracy, manufacturability, and long-term reliability.
Speakers from both equipment and materials perspectives emphasized that imaging and materials can no longer be optimized independently.
Dielectrics Actively Shape Imaging Outcomes
Low-k and advanced dielectric films introduce challenges such as stress, surface roughness, and pattern collapse, all of which narrow imaging process windows. These effects place new demands on imaging systems to compensate while maintaining tight tolerances.
Advances in deposition techniques—including atomic layer deposition (ALD) and plasma-enhanced chemical vapor deposition (PECVD)—were highlighted as key enablers, improving film uniformity and enabling more predictable imaging behavior at scale.
Cross-Disciplinary Optimization Becomes Mandatory
Presenters emphasized that imaging, materials, and reliability are now inseparable concerns. Decisions made during materials selection influence imaging contrast and defect detectability, while imaging limits increasingly determine which materials can be deployed in high-volume manufacturing.
This convergence is driving closer collaboration across traditionally siloed teams.
Why It Matters
- Dielectrics are no longer passive—they influence imaging and yield
- Misalignment between materials and imaging increases reliability risk
- Integrated optimization accelerates advanced packaging readiness
What to Watch
- Tighter collaboration between imaging and materials teams
- Imaging techniques tailored to next-generation dielectrics
- Earlier consideration of stress and warpage in imaging strategies
Source: “Afternoon Session: Building and Scaling AI: From Design to Productization,” SEMICON West 2025. Speakers: Ravi Mahajan (Intel); William Chen (IEEE EPS); PR Chidambaram (Qualcomm); C.P. Hung (ASE); Tim Lee (Boeing & IEEE); Ming Li (Lam Research); Jeff Pettinato (Intel Corporation). Panel moderator: Audrey Charles (Lam Research). Panelists: C.P. Hung (ASE); Tim Lee (Boeing & IEEE); Jeff Pettinato (Intel Corporation); Ming Li (Lam Research); PR Chidambaram (Qualcomm).
