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Contamination Free Manufacturing – sponsored by Edwards Vacuum

Chairs: Jennifer Braggin, Entegris; Christopher Ebert, Linde; Christopher Long, IBM Research 

Session 13

13.1  Particle Defect Reduction Through YF3 Coated Remote Plasma Source for High Throughput Dry Cleaning Process  
Hyojeong Seo, Jeonghye Yang, Young Jae Ma, Jongwoo Park, Mi Kyoung Kim, David H. Seo, Sung Jin Yoon, Sang Jong Park, PSK Inc. 

13.2  Impact of Process Chambers Exhaust on Wafer Defectivity in Wet Clean Tools 
Kedari Matam, Brown Peethala, Charles Taft, Zachary Gardner, Michael Liefels, George Yang, Sankar Muthumanickam, Devika Sil, IBM Semiconductor Technology Research 

13.3  Formation and Removal of Tungsten Flake and Metallic Film Defects in Tungsten Contact CMP 
Bryan Egan, Robert Solan, Hong Jin Kim, GLOBALFOUNDRIES 

Session 5 - Poster

5.1  5000+ Wafers of 650 V Highly Reliable GaN HEMTs on Si Substrates: Wafer Breakage and Backside Contamination Results
Saurabh Chowdhury, YiFeng Wu, Likun Shen, Lee McCarthy, Primit Parikh, David Rhodes, Transphorm USA; Tsutomu Hosoda, Hoshiyuki Kotani, Kenji Imanishi, Yoshimori Asai, Tsutsumo Ogino, Kenji Kiuchi, Aizu Fujitsu Semiconductor Wafer Solutions (AFSW)

5.3 Back-Side Residue Analyses and Reduction in FinFET Middle of Line Wafers CFM: Contamination Free Manufacturing
Reshmi Mitra, Alper Konuk, Samsung Austin Semiconductor

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