BIOGRAPHY
Navas Kalandar is an accomplished professional with more than 25 years of experience in advanced semiconductor packaging, with a focus on technologies such as Flip chip, wirebond, 2.5D, and system in package. Currently holding the position of Lead Principal Engineer at Infineon Technologies in Austin, Navas has played a pivotal role in advancing semiconductor solutions, with over 10 patents filed/granted to his credit. Over the course of his career, he has authored 20 technical papers for conferences and journals, establishing himself as a thought leader in the field. Navas holds both a bachelor’s and master’s degree in mechanical engineering, providing him with a strong foundation for his work in the semiconductor industry. Prior to joining Infineon, he gained valuable experience at NXP Semiconductor and the Institute of Microelectronics in Singapore, further augmenting his expertise in semiconductor technologies.