Manufacturing Technology Development for Advanced Packaging
ABSTRACT COMING SOON
BIOGRAPHY
Loic Constantin received his PhDs in electrical engineering from the University of Nebraska Lincoln (USA) and in materials science from the university of Bordeaux (France). His research focused on developing new materials and processes for thermal management applications in microelectronics.
After graduating, he jointed Intel where he led a failure analysis team to enable the next generation 2.5D, 3D and advanced substrates. Currently, Loic is an Account Technologist at Applied Materials where he provides material and process solutions for 3D heterogenous integration.