Yole Developpement

MEMS and image sensors are shining stars in the chip industry as technology companies worldwide accelerate innovation in the fight against COVID-19. The tiny devices are behind advances in areas of electronics ranging from thermal imaging and faster point-of-care testing to microfluidics-based polymerase chain reaction (PCR) tools and techniques to detect SARS-CoV-2.SEMI recently spoke with Yole Développement analysts Dimitrios Damianos and Chenmeijing Liang about MEMS and imaging sensors market trends and how microelectronics-enhanced technologies are supporting the worldwide push to contain the spread of COVID-19.For additional insights on the technologies, join the SEMI MEMS Imaging Sensors Summit, held for the first time at SEMICON Europa, 12-13 November 2020 in Munich, Germany. Registration is open.SEMI: Despite the global pandemic, the MEMS and sensors market is still growing and is one of the healthiest industries, not only in Europe, but globally. What is driving this growth?Damianos: MEMS have been continuously evolving from the first sensors that were measuring pressure and acceleration to rotation sensing and visible light management followed by light sensing beyond visible and the expansion to ultrasound and multi-spectral. Now we are heading towards an era where we want to sense every aspect of our environment, with more processing and eventually analytics bringing more quality to the data.COVID-19 has impacted various global markets in very different ways. While automotive, mobility and civil aviation have suffered, the impact on telecommunications and medical has been positive. The effects on the consumer, mobile and industrial markets have been moderate. Moreover, COVID-19 is changing the perception of the current global supply chain in manufacturing, potentially leading to more localized value chains and further regionalization in order to minimize similar risks posed by the pandemic and the first lockdown.SEMI: Who are the main MEMS players based on your research? Damianos: For MEMS players, the picture in 2019 was not the same as 10 years ago, when Texas Instruments (TI) and Hewlett-Packard (HP) were leading the scene, with Bosch and ST Microelectronics following, all at comparable revenue levels. Now, Broadcom and Bosch lead with almost $1.4 billion in revenue each, and the rest of the MEMS key stakeholders compete in the $400 million to $600 million league. Microphone players profited from the voice interface adoption trend, while players active in MEMS for mobility and smartphones suffered slightly due to weak end-system demand.SEMI: What scenarios can we expect for each market with regard to the impact of COVID-19 on MEMS for 2020? Damianos: For 2020, at Yole Développement we expect the consumer market to contract slightly by 2.6%, with the automotive market to dip by 27.5%, and defense and aerospace by 20.5%. For the defense market, no major effect is expected, as all major programs still run for the year. The market may experience some slight delays in deliveries due to supply chain and logistics problems. However, sensors integrated in commercial/civil aerospace applications will suffer due to the general paralysis of the air travel industry. On the positive side, telecommunications could increase by 4.7%, medical applications by 10.6%, and industrial by 11.5%.Due to the global pandemic, some types of MEMS have spiked in demand this year. For example, demand for thermopiles and microbolometers used in temperature guns and thermal cameras has increased because of the need for contactless monitoring of people’s temperatures. Moreover, microfluidics for DNA sequencing and real-time polymerase chain reaction (PCR) diagnostic tests for detecting COVID-19 are gaining market relevance, with the latter serving as a premier method of detecting a bacteria or virus on the molecular level with high degrees of accuracy. Furthermore, pressure and flowmeters in ventilators will grow because of huge demand by hospital intensive care units (ICUs).SEMI: What growth trends do you predict for the long haul?Damianos: In the longer term, we expect global MEMS volumes to almost double, from 24.4 billion units in 2019 to 50.8 billion units in 2025, with a 13% CAGR during the same period. The global MEMS market could reach $17.7 billion in revenue by 2025.We see a trend to more wearable devices integrating a lot of sensors but also a move to a more consumer-oriented healthcare. Moreover, everything related to voice interfaces and voice/virtual-personal assistants (VPAs) will continue to see strong growth, increasing demand for MEMS mics with better quality and high-fidelity voice capture. MEMS devices are shifting to higher accuracy, ultra-low power, embedded intelligence and possibly some bio-compatibility for medical applications.MEMS players will try to escape the commoditization cycle and deliver more value by increasing the value of the data, either grouping many sensors to create sensor hubs or by adding processing, algorithms and software. Industry players are employing strategies such as adding extra processing close to the sensor (e.g. Knowles) or ameliorating the use cases of their applications of their clients (e.g. Bosch or ST). AI on the edge seems very alluring for extra value acquisition, with many startups already working on it. Some examples include always-on-sensing (Aspinity in collaboration with Infineon, Syntiant), echolocation (IMERAI) and predictive maintenance using inertial sensors (Cartesiam). This will be the next pit stop for MEMS technology for sure. SEMI: The CMOS Image Sensor (CIS) is a cornerstone technology in the development of devices powered by machine sensing and artificial intelligence (AI) for applications such as advanced driver assistance system (ADAS). CIS powers many of the ongoing revolutions in new technical products and use cases. What is the status of the image sensors industry? Liang: Last year was exceptional with a combination of high demand and high prices due to capacity limitations. Q4 2019 went way above the forecast, and, in the end, the CIS industry reached $19.3 billion for the full year. This year, we think it will return to normal, and, despite the pandemic impact, we expect significant growth in the range of 7% to 12%. Last year’s 25% year-over-year (YOY) growth was the highest we’ve seen over the past decade. Mobile still dominates the marketplace for CIS with 69% market share. Two markets, computing (8%) and consumer (5%), are adjacent to the mobile market but progressively losing ground due to the smartphone disruption.Security, at 6% market share, will probably be the second largest CIS market in the future. Although this is an area of excellence for the emerging Chinese players, unfortunately, they could be hit by the current trade war. The automotive market did very well from 2018 to 2019 because of the numerous applications recently developed for ADAS, viewing, and in-cabin applications. Lastly, the industrial camera applications benefited from large investments in automation, especially in the semiconductor and automotive industries, but here again many uncertainties remain as these markets will reshuffle in the post COVID-19 world. SEMI: Which CIS markets are most susceptible to seasonality and the impact of COVID-19?Liang: According to our quarterly CIS monitor, automotive and security were both negatively impacted by the pandemic beyond what we expected in terms of seasonality. For computing, the situation improved just prior the lockdown. Q1 got a positive impact with high sales results for laptops and tablets, but no significant impact was seen for security equipment. For automotive, the demand for cameras was very high in Q1, which is seasonally normal, despite the decrease of car shipments that followed later. The automotive CIS market in 2020 should remain relatively flat compared to 2019 due to the higher attachment rates of cameras despite the lower number of cars produced. Consumer and industrial segments dropped in Q1, which is typical early in the year.The next five years might be a bit slow, and although we forecast growth for the next year, in the future the market share will be lower in mobile. In fact, mobile CIS growth will fall below the CIS growth average, but we will see an increase of market share for the security, automotive and industrial segments. The CIS market could reach $28 billion in 2025.At first, COVID-19 had a limited impact on the production side, as factories in China are usually closed for the New Year holiday, when the pandemic started. While supply is currently recovering, we still consider the limited impact on demand. Smartphone production for 2020 will be down 6%, but camera shipments for mobile should increase about 10% this year. Another positive trend for the mobile market is optical fingerprint implementation. Currently, high-end Android phones use this kind of technology. For 2023, we estimate optical fingerprint technology revenue to be over $1 billion.The roadmap for the automotive market is driven by camera proliferation. We’ll see 10 cameras per car and more for some high-end vehicles. Increasing demand for safety and convenience will mean more cameras per car in the future. With a strong attachment rate, the market average in automotive is around 2.0 cameras per car nowadays, and we expect the market average to reach 3.5 cameras per car in 2025. In security, Charge Coupled Device (CCD)-based cameras are nearly out of the market, as CMOS-based IP cameras are most important now.SEMI: What are current key technology trends?Liang: 3D semiconductor technology is the hot topic. CIS wafer staking technology is indeed at the center of the CIS technology race. Future applications could be AI analytics or recently developed applications on new types of CIS. So far, we have seen the introduction of variants of the CIS pixel. Global shutter (GS) and indirect Time of Flight (iToF) were recently introduced, and now direct time-of-flight (dTOF) pixels are being used in high volume. 3D semiconductor technology is a bonanza for the industry, as it allows to pack more value in a single chip. While the surface of silicon is still increasing, additional silicon is added through stacking.With COVID-19 still a problem, the endpoint for smartphones in 2020 remains uncertain. The short-term impact for CIS will be slower growth with respect to the 25% YoY of last year. The downturn in car production will be mitigated by an increased attachment rate for automotive cameras. The security market will also help maintain CIS growth.For more insights, see the following reports: Status of the MEMS Industry 2020 3D Imaging and Sensing 2020 CIS Market Monitor Q2 2020 Dimitrios Damianos is a technology and market analysts at Yole Développement covering MEMS, Sensors, Photonics and Imaging. Chenmeijing Liang is a technology and market analysts at Yole Développement covering Imaging. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

(The following is an excerpt of an article published by i-Micronews.)We are today entering a new era when sanitary checks will be regularly required to travel, do shopping, or have a social and cultural life. In this article and the related new Yole Développement (Yole) report, Thermal Imagers and Detectors 2020 – COVID-19 Outbreak Impact – Preliminary Report, we analyze how the COVID-19 outbreak could affect the thermal technology market and industrial landscape.To resume normal air traffic, air passenger screening to detect travelers with signs or symptoms of infectious disease will require new modalities. Thermal imagers could be used as a fast primary testing solution. This won’t be the first time actually. In the previous SARS, H1N1 and Ebola epidemics thermal cameras were used in some airports to screen travelers for fever. Of course, the size of the previous epidemics was not big enough to give this technology much attention. The way forward would be a triage process. Thermal imagers based on microbolometer technology can be installed at airports. If a fever is detected, then the traveler could be taken aside to get further tested with a more accurate handheld contactless thermometer. If the fever is proven, then they can be isolated for further examination, either a history check, and/or a diagnostics test, provided that it gives results in a reasonable amount of time.Airports are not the only places where thermal imagers can be the new norm. In April 2020, more than 50 Amazon warehouses had cases of COVID-19. Typically, workers were having their temperatures checked by handheld thermometers at the entrance. Amazon installed thermal cameras at some of their sites, which allows for faster screening. If needed, a secondary, forehead temperature check is performed if the employee is flagged from the camera, according to Reuters. Other companies that have explored using the thermal camera technology include Tyson Foods Inc and Intel Corp. Even some schools in China have started using them. This is an example of how businesses and infrastructure are turning to methods for containing the spread of virus by using technologies that previously went unnoticed by the general public.More businesses can adopt thermal cameras. In all countries, between 5% and 10% of enterprises employ more than 50 people, according to the OECD. To return to work, they could use thermal cameras to monitor body temperatures of employees as well. Here we are talking about cameras in the order of hundreds of thousands units.But this might not be enough. Everyone will probably want to have the ability to check their body temperature at any time. We have here a big market opportunity for integration of thermal imaging into smartphones or wearables. This integration has been in process for years. And it has long been perceived as the next sensor to be integrated in a mobile phone after pressure, inertial MEMS, or CMOS imagers. However, when 3D sensing technology was launched by Apple in 2017, all smartphone manufacturers focused their effort on this application, and were not interested in thermal imaging. Nowadays, because of the COVID-19 pandemic, people are much more sensitive to checking their own temperature and those of people around them, usually several times per day. Integration of a contactless thermometer could make sense. So there could be a revival of the use case of thermal imaging capability or temperature measurement in a smartphone or a wearable in the future.Click here to read the full article in i-Micronews.Eric Mounier Ph.D. is Fellow Analyst at Yole Développement (Yole). Dimitrios Damianos, Ph.D. is a Technology and Market Analyst at Yole Développement (Yole) working within the Photonics, Sensing Display division.Yole Développement is a member of SEMI and the MEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner.

Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on sensing devices require it since frequent recharging is the death knell of any electronic product. That’s why semiconductor companies are offering new ways to conserve power.“MEMS sensor suppliers have made significant strides in the power, size and performance of their devices,” said Aspinity CEO Tom Doyle. “Yet these gains deliver only incremental power improvements to the system.”Doyle advocates a new architectural model that uses an analog neuromorphic processor to analyze all sensor data at the start of the signal chain instead of sending it downstream so power-hungry chips such as DSPs can digitize it before analysis.“The technology industry wants to take advantage of the many benefits of always-on sensing applications,” said Doyle. “Before we can reach mass proliferation, however, we need to resolve the power issues that are deal-breakers for some applications. We believe the answer to this challenge is architectural. All the data gathered by always-on sensing systems is analog in nature, yet as soon as it’s captured, it’s digitized immediately for analysis. Determining which data is important up front eliminates the digitization and processing of irrelevant data so that voice-first devices such as smart speakers and wearables/hearables can run for long periods of time without requiring battery recharge.”Syntiant CTO Jeremy Holleman agreed that on-device intelligence is the future.“Did you just fall? Is your heartrate a bit off? Deep learning provides a toolset that yields vastly superior decisions,” said Holleman. “The problem is that deep learning is computationally intensive. The answer is a neural network that performs on-device edge inferencing.”Holleman added that Syntiant’s neural decision processor was recently certified as Amazon Voice Service (AVS)-compliant for wake-word detection, making it easier to design voice control in battery-powered devices such as earbuds and wearables.MSEC Technology Showcase WinnerWith the groundswell of interest in intelligence at the edge, it was no surprise that Cartesiam won top honors among all competitors in the MSEC Technology Showcase for its NanoEdge AI, software that brings AI to the edge of the signal chain, making it easier for designers to create intelligent objects that can learn and understand.“Unlike other AI algorithmic technologies for sensing devices, NanoEdge enables both learning and inference at the edge, providing accurate and adaptive intelligence,” said Cartesiam Managing Director and Co-founder Marc Dupaquier, who accepted the award. “It’s also the only tool of its kind that does not require data scientists on board for implementation, which saves a tremendous amount of money. Our clients can build a machine learning library and embed it into their own code within weeks to realize the same caliber of unsupervised neural network that was once the exclusive domain of AI cloud vendors.”MSIG 2019 Hall of FameAt this year’s conference, MSIG Director Carmelo Sansone recognized two longtime contributors to the commercialization of MEMS and sensors: Peter G. Hartwell, Ph.D., chief technology officer at InvenSense, a TDK group company; and Thomas Kenny, professor and senior associate dean of engineering at Stanford University.Hartwell leads technology strategy and the InvenSense advanced technology research group. He has more than 25 years’ experience commercializing silicon MEMS products, including advanced sensors and actuators, and developing MEMS testing techniques.Kenny’s academic accomplishments include authoring or co-authoring more than 250 scientific papers and holding 50 issued patents. He has also advised more than 50 graduated Ph.D. students from Stanford.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.Maria Vetrano is a public relations consultant at SEMI.

Part of 1 of 2-part series on MSEC 2019 highlights. Read Part 2. MEMS and sensors are proliferating across consumer, automotive, biomedical/healthcare, robotics, industrial and agriculture applications to harvest sensory data in a hyper-connected world and meet demand from consumers and organizations alike as they clamor for more intelligence in electronics.Take the ubiquitous iPhone. Shipped in 2007, Apple’s first iPhone sported five sensors. By contrast, the most feature-packed smartphones will embed up to 20 sensors by 2021, according to Yole Développement’s Jérôme Azémar. He estimates that the devices will feature four MEMS microphones, four CMOS image sensors (CIS), a RGB color sensor, a laser rangefinder, an infrared sensor, a gas sensor, a heart rate monitor and a fingerprint sensor, not to mention the MEMS inertial sensors that device users have come to know and trust.The MEMS market is expected to reach $18.5 billion in 2024 [1], up a whopping 60 percent from $11.6 billion in 2018, according to Azémar, who presented at MEMS Sensors Industry Group’s 15th annual MEMS Sensors Executive Congress (MSEC) in late October in Coronado, Calif. Add other types of sensors to the mix – CIS, environmental sensors, LiDARs, radars, ultrasonics, and fingerprint sensors – and the market will mushroom to $93 billion by 2024, said Azémar.Since MEMS Sensors Industry Group (MSIG) joined SEMI as a Strategic Association Partner three years ago, SEMI has expanded its MEMS and sensors programs to Europe and Asia while continuing to grow its U.S. conferences. “SEMI is continually investing in MEMS and sensors innovation across the supply chain,” said Dave Anderson, president of SEMI Americas and host of MSEC. “For example, MSIG is contributing to the development of the Heterogeneous Integration Roadmap, an initiative designed to drive heterogeneous integration technology development and accelerate electronics innovation. The roadmap spans device design, test and fabrication, ecosystem development, R D, equipment and materials. “At MSEC, executives and other speakers explored how AI and blockchain are remaking the food supply chain, air transportation and other sectors as MEMS and sensors improve the quality of our lives,” said Anderson.Sensing at the EdgeThe concept of artificial intelligence (AI), that a machine can harness intelligence that rivals or outperforms humans – and act without human intervention – has been a feature of the human imagination since at least the 1968 film 2001: A Space Odyssey. MEMS and sensors facilitate intelligence in a wide range of electronics such as smartphones, healthcare wearables, robots, industrial predictive maintenance systems, and cars. AI is sure to augment that functionality.MEMS and sensors are now in their third wave of evolution, a focus on edge AI, Bosch Sensortec CEO and General Manager Stefan Finkbeiner told MSEC attendees. For its part, Bosch is working to add AI to MEMS devices. The first wave integrated software with MEMS sensors, and the second, sensor fusion, enabled designers to allocate performance and power strategically to tune MEMS for resource-constrained devices. The third wave is “an active-learning phase in which MEMS facilitates real-time learning at the edge to promote greater personalization, environmental feedback, privacy of user data and improved battery life,” said Finkbeiner.Small sensor nodes with edge AI exemplify third-wave applications. Integrating low-power environmental sensors (e.g., gas, temperature, pressure, humidity and air-flow sensors), the nodes could be deployed in fire-prone forests to assess fire risk and support early detection. Access to this real-time environmental information could prove invaluable to residents and public-safety personnel alike.Google takes another tack, applying machine learning to resource-constrained devices, said Nick Kreeger, a senior software engineer at the Internet giant. The company’s Google Brain creates machine learning models that can run on inexpensive, low-power microcontrollers using Google’s TensorFlow Lite, an open-source machine learning tool that’s been deployed on a multitude of mobile devices. Inferencing is done at the device’s edge, rather than transmitted to the cloud.Meeting the power constraints of battery-powered sensing devices is another matter that starts with minimizing energy and data waste. “Deep learning is compute-bound and runs well on existing microcontrollers,” Kreeger said. “Because it’s all arithmetic, it’s low-power compared to storage access.”Already Google has worked with Plant Village, a research unit at Penn State University, and the International Institute of Tropical Agriculture (IITA) to help farmers improve food production by using machine learning and cheap sensors to spot and manage planet diseases in developing countries. And that production chain is in dire need of a boost, according to Rajendra Rao, general manager of IBM Food Trust, an enterprise-class blockchain solution.“We are on the cusp of complete failure of the food system,” Rao said. “One out of 10 people gets sick each year from foodborne illness, 420,000 die from this annually, 80 percent of companies in the food supply chain have not digitized, one-third of all fresh food in the US is thrown away, and one in five seafood samples worldwide is mislabeled.”IBM Food Trust’s work with Sucafina, which manages a global green coffee supply chain, shows how sensors can trace food from the farm to the processing plant to the consumer. With the IBM Food Trust platform, Sucafina can track the origin of the beans used in a cup of coffee – a competitive differentiator to coffee drinkers eager to support fair-trade coffee roasters.ripe.io, one of Forbes’ 25 most innovative AgTech startups, is also tackling the challenges and complexities of the food supply chain.“Our secure blockchain platform creates a digital twin of food items, transparently aggregating foods’ journey in real-time, to provide a harmonized trustworthy platform for multiple stakeholders,” said Rachel Gabato, the company’s COO. The ripe.io blockchain-based platform collects data from various sensors – temperature, pressure, light, humidity and inertial MEMS sensors. Growers, distributors and end customers including sweetgreen – a U.S. restaurant chain that depends on fresh produce – use the information to trace the origin and quality of food.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.[1] Source: Status of the MEMS Industry report, Yole Développement, 2019Maria Vetrano is a public relations consultant at SEMI.

Automotive original equipment manufacturers (OEMs) and their direct suppliers of parts and systems share a vision: Next-generation vehicles will be more electric, autonomous and connected. At a market size of more than $1 trillion, automotive is steadily becoming a high-tech market as cars morph into advanced technology platforms with partially or fully autonomous features. Call them semiconductors on wheels. Big players such as Google and many carmakers are investing heavily in chip advances to help drive increases in silicon content in automobiles.At SEMICON Europa, Pierrick Boulay, Solid State Lighting and Lighting Systems analyst at Yole Développement, will provide a market update on autonomous automobile trends including the state of sensors, radars, cameras and LiDARs as the industry works to increase the level of autonomy and electrification.Autonomous vehicle design can only thrive with the development of an industry standard for chip and device traceability across the supply chain. The importance of chip traceability to the automotive industry is reflected in its central role in driving a chip traceability standard.According to Heidi Hoffman, senior director of technology communities marketing at SEMI, “chip traceability is one of the next big things for the technology industry. The benefits are enormous, and the upsides – including yield enhancements, counterfeiting safeguards, and support for new applications – are plentiful. But the implementation challenges of chip traceability are also big and will require considerable effort to overcome. The biggest hurdle of all? We need to transcend industry fears by demonstrating that we can secure IP when it is shared across the hardware supply chain.” The Importance of Standards, Data Collection and Collaboration Across the Supply ChainThe automotive industry has long embraced tracing the sources of defects. Now, as the automotive and semiconductor supply chains increasingly overlap, traceability has taken on greater importance in the semiconductor industry. SEMI committees, task forces and events such as the Smart Transportation Forum at SEMICON Europa are ideal platforms for collaborating to develop new standards and best practices for the automotive industry.Earlier this year, German luxury automobile maker Audi AG became the first automotive original equipment manufacturer (OEM) to join SEMI as member, strengthening alignment across automotive supply-chain segments. At SEMICON Europa, the SMART Transportation Forum and Pavilion, staged by the SEMI Global Automotive Advisory Council (GAAC) and bolstered by the Electronic System Design Alliance, a SEMI Strategic Association Partner, will gather key stakeholders across the automotive value chain, from design and semiconductor equipment to materials and carmakers, to explore innovation opportunities in automotive electronics. SEMI Global Automotive Advisory Council (GAAC) “If the industry wants to reach the goal of zero defects, a new collaborative approach is necessary,” observed Antoine Amade, senior regional director EMEA at Entegris. At SEMICON Europa, Amade will present new ways to collaborate in reducing chip defectivity and meet other challenges in the automotive industry.More than half of semiconductor failures on the automotive assembly line today (so-called 0km failures) are traced to semiconductor fab defectivity. “The increasing semiconductor content in automobiles – driven by growth in ADAS, electrification and autonomy – has put a growing focus on the quality and reliability of these devices and their implications for consumer safety and satisfaction,” said Oreste Donzella, senior vice president and CMO at KLA.The smart manufacturing (Industry 4.0) revolution is already spurring higher performance and great efficiencies throughout the supply chain and will also be crucial to driving innovation in automotive. Smart manufacturing makes possible significant improvements in factory key performance indicators (KPI) for cycle time, on-time delivery, overall equipment effectiveness, cost and product quality.“These KPI gains are key to meeting quality levels the automotive industry must reach to support the deployment of autonomous driving vehicles,” said John R. Behnke, general manager of Final Phase Systems at INFICON. In his talk at SEMICON Europa, Behnke will provide an overview of existing, in-progress, and future smart manufacturing solutions for the semiconductor industry and their impact on the automotive supply chain. The SMART Transportation Forum, 13 November, 2019 (9:30-15:30 at ICM Munich, room 14c) at SEMICON Europa is the premier platform for key stakeholders to connect, collaborate and innovate across the automotive value chain. Automotive and semiconductor industry experts will offer insights into trends in design, semiconductor equipment and materials, and automotive innovation and the roadmap to 2030. The SMART Transportation Forum will also showcase innovations in imaging, sensing, artificial intelligence (AI), smart manufacturing and L5 mobility.Other SEMICON Europa highlights: Advanced Packaging Conference: Packaging and Test Challenges Towards High Reliability (12-13 November 2019) 23rd Fab Management Forum: Game Changers for Semiconductor Operations(11-12 November 2019) Strategic Materials Conference: Strategic Materials Enabling Industry Roadmaps(12-13 November 2019) SEMICON Europa registration is open for visitors and exhibitors. For more details, please visit the SEMICON Europa website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (use #SEMICONEuropa).Learn more about the SEMI chip traceability standard – SEMI T23 - Specification for Single Device Traceability for the Supply Chain – and SEMI Technology Communities.Serena Brischetto is a marketing and communications manager at SEMI Europe.

Despite market saturation and stagnation saddling many business sectors, MEMS remains a shining star in the semiconductor industry. Opportunities in automotive, consumer electronics, mobile, medical are rising. What is supporting this industry growth? Who are the big players on the horizon?SEMI spoke with Dimitrios Damianos, Technology Market Analyst, Photonics, Sensing and Display division at Yole Développement, about MEMS market dynamics and future trends. Damianos shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet experts from Yole and many other key industry influencers. Registration is open.SEMI: MEMS and sensors is one of the healthiest industries not only in Europe but globally. Despite a global economic slowdown, the MEMS and sensors is still growing. What is fueling this growth?Damianos: The value of the global MEMS and sensor market will almost double from $48 billion in 2018 to $93 billion in 2024. In 2018 the MEMS and sensor market represented more than 10% of the total IC market, as more and more MEMS devices and sensors, such as MEMS, image sensors, and RF filters, are integrated in end products in consumer and automotive. In particular, the value of the MEMS-only market reached $11.6 billion in 2018, with consumer applications accounting for more than 60% of the total market. From 2019 to 2024 the MEMS market will grow 8.3% annually in value driven by pressure (for TPMS), RF (for V2X 5G communications), inertial (for ADAS) and future MEMS (such as pMUT for ultrasonic fingerprint) (Source: Status of the MEMS Industry report, Yole Développement, 2019). SEMI: How are MEMS shaping the semiconductor industry today? Damianos: MEMS have a make-smarter enabling capability. They are providing context for new applications and services in transportation, mobility, health, and security. Large companies such as Alibaba and Google are considering MEMS as a critical element in their business solution domains covering the upcoming smart home, smart campus, smart city and smart industry applications. MEMS have key features that correspond to these companies’ criteria for accuracy, small size (without performance degradation), low power and always on (e.g. microphones). Furthermore, with the advent of sensor fusion and edge computing, more sensor data can be processed, maximizing the qualitative and useful information about us and our surroundings. This has a huge impact in all markets, especially consumer.SEMI: MEMS foundries performed well thanks to the boom in industrial and medical applications. Who are the big players right now?Damianos: During 2018, all foundries saw their revenue increase. STMicroelectronics, Teledyne Dalsa, Silex, IMT, Micralyne and Philips Innovation Service are important MEMS foundry players that offer services for various MEMS devices used in medical and industrial markets, among others. On one hand, medical applications were driven mostly by microfluidics, flowmeters, pressure and inertial MEMS. On the other hand, industrial applications were driven by inkjet heads, microbolometers and pressure MEMS. The market prospect, however, is huge for RF MEMS and oscillators that will be used in next-generation 5G infrastructure. SEMI: What is the current status of MEMS for automotive applications? What are the related market drivers? Damianos: In automotive applications, accelerometers and pressure sensors still account for the lion’s share in units. Pressure sensors will grow at more than 8% with Tire Pressure Monitoring System (TPMS) implemented in Chinese vehicles in the near future. After 2019 and 2020, with the new Chinese standard, GB 2614, TPMS will become compulsory: 100% of all new vehicles will have TPMS. Also, automotive MEMS could grow quicker than the corresponding car market (currently at approximately 3%). The reason is a higher number of many different MEMS devices that are being integrated in cars, such as MEMS inertial measurement units (IMUs), TPMS, environmental MEMS for gas and particle monitoring in-cabin and microphones for hands-free voice commands.SEMI: After years of decline, the inkjet heads industry is growing again. What other segments are benefiting from MEMS technology applications? Can you name two examples?Damianos: RF MEMS (BAW filters) is also benefiting from applications in smartphones and will continue to benefit with the arrival of 5G. 5G means additional high frequency sub-6 GHz bands that can only be addressed by BAW filters. Moreover, new infrastructure approach using active antennas will create an expanding market for BAW.Another segment is inertial sensors. Inertial MEMS already have a high potential in wellness and fitness wearables and are gaining support for medical wearable applications to monitor patient activity, with the aim to prevent seizure in cases of epilepsy and other mental disorders. Compared to other types of sensors, MEMS is the golden technology for inertial sensors integrated into medical wearables. They are used for rehabilitation systems, activity trackers and assistance living/fall detection. Specifically, the IMU market will continue to grow for consumer and automotive applications as their price and form factor continue to shrink and they replace traditional standalone MEMS accelerometers and gyroscopes. However, the inertial sensor market will mostly grow for smartphone applications (mostly 6DOF, with 9DOF volumes being comparatively low).SEMI: Give us one prediction about the opportunities offered by the MEMS technology. Damianos: Sensor fusion is becoming more and more relevant since billions of MEMS sensors are made every year. The upcoming 5G revolution will make connectivity easier than ever, creating exponentially more data. To make these data meaningful, data processing is mandatory. Big data is an industry born of recent advancements in AI and machine learning, built upon and fueled by a wealth of new data from ever-expanding sensor applications. An upcoming trend is edge computing, with sensors and MEMS driving a new age of technology. Sensors are digitizing the human experience, and as the real and virtual worlds move closer together, it will be sensors that bind them, enabling new experiences for users everywhere. Running AI at the edge, coupled with sensor fusion, will open new applications for MEMS in audio, motion, olfactometry, and imaging. We also expect that new MEMS devices (microspeakers, ultrasonic fingerprint, pMUT) and piezoelectric MEMS technology could rejuvenate the MEMS market. SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why would you invite your peers to attend? Damianos: SEMI is organizing another very successful event, gathering experts from the Imaging and MEMS industries. We are at a turning point of innovation, with many technological advancements in AI, IoT, AR/VR, biometrics, and other areas where Imaging and MEMS technologies are paramount. Yole is excited to hear the thoughts of many high-profile experts on existing activities and future prospects within their organizations. If you are too, then it is an event that you shouldn’t miss!Dimitrios Damianos, Ph.D. is a Technology and Market Analyst in the Photonics, Sensing and Display division at Yole Développement (Yole). Damianos is a member of a Yole team that produces technology and market reports on the imaging industry including photonics and sensors. Damianos holds a MSc degree in Photonics from the University of Patras (Greece). After his research on theoretical and experimental quantum optics and laser light generation, Dimitrios pursued a Ph.D. in optical and electrical characterization of dielectric materials on silicon with applications in photovoltaics and image sensors, as well as SOI for microelectronics at Grenoble’s university (France). He has also authored and co-authored several scientific papers in international peer-reviewed journals. Learn more! Join the webinar on 5th September 2019. Registration is open! Serena Brischetto is a marketing and communications manager at SEMI Europe.

This article is the third in a series highlighting the vital importance of SEMI Standards to commemorate the publication of the 1000th SEMI Standard in July 2019. Find the entire series here.SEMI Standards are the bedrock of the modern microelectronics industry. Without standards for wafer dimensions – which SEMI Standards first defined through a collaborative process involving semiconductor manufacturers and wafer suppliers in 1972 – the semiconductor equipment industry as we know it would not exist today. The late Robert Noyce of Intel noted in this 1992 video “being good at producing semiconductors will mean we have better, more consistent, better controlled equipment than we have in the past. Standards are going to play a vital role in that. Standards saves money and time for everyone.” Noyce also called standards a bellwether to surges of innovation in critical process technology. This is still true today as, for example, important standards-setting activity is afoot in panel-level packaging, electron microscopy and energetic materials. Will a surge of innovation follow?Panel-level packaging: a chicken-egg scenarioFrom advanced materials to more efficient production tools, one hallmark of the microelectronics industry is our fearless exploration of new technologies that will spawn change across the industry by improving performance and reducing cost. Advanced packaging techniques, such as panel-level packaging (PLP) – which moves semiconductor packaging to a larger-panel format – is one of those critical catalysts. Citing PLP’s potential to shrink costs by improving efficiency and economies of scale, research firm Yole Développement predicts a remarkable 63% CAGR for PLP from 2017-2023.[i]It’s no stretch to say that we are close to realizing a burst of innovation in packaging. With a just-published SEMI Standard (SEMI 3D20) specifying panel sizes, equipment companies will find it economically viable to invest more in developing the much-needed production tools that enable PLP. “It is really important to create standards so we come together and work much more efficiently. Creating those fundamentals allows you to be more productive in the long term,” said Christina Chu, ASM Semiconductors, and co-leader of the Panel Level Packaging Task Force, and one of five industry leaders recognized for their outstanding accomplishments in developing SEMI Standards for the electronics and related industries at the recent 1000 SEMI Standards reception during SEMICON West 2019. “This effort came up from the trenches,” said Richard Allen, NIST Quantum Measurement Division, and a co-leader of both SEMI’s 3D Packaging and Integration Committee and its Panel Level Packaging Task Force. “Equipment vendors told us that they wanted to serve the market, but they couldn’t do so without some standards. To respond to their request, our committee surveyed the market and discovered at least 15 different panel sizes in development.”“As no vendor is going to make over a dozen unique tools for the same process, we worked with the manufacturers and tool companies to write a specification that standardizes on two of the most widely accepted sizes,” Allen said. “For the first time, the industry will have a real market for panel-level packaging tools, and that will spur commercialization of new technologies that never would have seen the light of the day without standardization.”Allen pointed out that evolution of standards in microelectronics reflects the dynamism of the microelectronics industry itself. “Given the rate of technology advancement in microelectronics, SEMI Standards committee and task force members know that a newly-published standard is often just a starting point, and change will likely follow,” he said. “The Panel Level Packaging Task Force, for example, is currently determining how to best support this packaging technology, whether through possible enhancements to 3D20 or by creating new PLP standards.”Process automation is key for TEMTransmission electron microscopy (TEM) is another area where industry cooperation will fuel progress.“People throw around the phrase ‘exponential growth,’” said James Amano, senior director, International Standards at SEMI. “It’s usually a gross exaggeration, but not when it comes to TEM data. That’s because demand for more TEM data, which uniquely enables innovations around smaller feature sizes, has exploded. At the same time, TEM data is a bottleneck in the fab. Operators literally use tweezers to carry around electron microscope samples by hand, and that is untenable.” TEM sampling standards are currently being formulated under the SEMI Standards development process. “Applying a model that we have employed successfully time and time again through SEMI Standards, we are gearing up for process automation in TEM,” Amano said. “We’ll start by establishing a grid carrier standard for electron microscopy. Through ongoing standards efforts, we may realize a fully automated TEM process within just a few years. That achievement will enable exponential growth in shrinking design geometries.”Energetic materials gain safety standardAlong with wafer-level packaging and design shrinks, the push for safety in materials’ usage is a hotbed of innovation. This is especially true with energetic materials, the potentially hazardous process chemicals used increasingly in semiconductor manufacturing to spur advances in materials purity, integrity and quality.“When you’re working with energetic materials, if you don’t get it right, you may face serious yield and cost issues, and most important of all, safety risks,” said Paul Trio, senior manager of strategic initiatives at SEMI. “This isn’t a theoretical concern. Real problems occurring in fabs have made an energetic-materials standard a high priority for the industry.”“After years of collaborating with companies across the supply chain to address this significant challenge, we recently published our 1000th SEMI Standard around safe usage of energetic materials,” Trio said. “Now manufacturers can turn to a new standard – which will evolve dynamically in response to industry changes – as they employ energetic materials in their quest to achieve higher yields while controlling costs and managing safety risks.” Whether it’s packaging, design shrinks, materials or other key innovations, standards are essential to progress in microelectronics. From equipment and materials suppliers that provide the most advanced, efficient and safest tools, materials, and processes to device manufacturers that get products to market, all stakeholders in the microelectronics ecosystem benefit from SEMI Standards. Are you curious about the areas of process technology where innovations are likely to occur? Would you like to get involved in standards efforts that could have an impact on your business? Take a look at the activity of SEMI Standards Committees and Task Forces. Because that’s where innovation, pragmatism and a commitment to harness industry resources come together.Use your voice to affect standardization in and around the microelectronics industry. Learn about SEMI Standards – and become part of the solution. Heidi Hoffman is senior director of technology communities marketing at SEMI. Hoffman and her team shine a spotlight on the work of the more than 20 technology communities under the SEMI electronics manufacturing supply chain collaboration platform. Actively engaging community members in marketing programs that showcase their unique value, Hoffman’s team helps companies to grow and prosper through the power of connection, collaboration and innovation. [i] Status of Panel Level Packaging report, Yole Développement, 2018

2017 was a good year for the MEMS and sensors business, and that upward trend should continue. We forecast extended strong growth for the sensors and actuators market, reaching more than $100 billion in 2023 for a total of 185 billion units. Optical sensors, especially CMOS image sensors, will have the lion’s share with almost 40 percent of market value. MEMS will also play an important role in that growth: During 2018–2023, the MEMS market will experience 17.5 percent growth in value and 26.7 percent growth in units, with the consumer market accounting for more than 50 percent(1) share overall. Evolution of SensorsSensors were first developed and used for physical sensing: shock, pressure, then acceleration and rotation. Greater investment in R D spurred MEMS’ expansion from physical sensing to light management (e.g., micromirrors) and then to uncooled infrared sensing (e.g., microbolometers). From sensing light to sensing sound, MEMS microphones formed the next wave of MEMS development. MEMS and sensors are entering a new and exciting phase of evolution as they transcend human perception, progressing toward ultrasonic, infrared and hyperspectral sensing.Sensors can help us to compensate when our physical or emotional sensing is limited in some way. Higher-performance MEMS microphones are already helping the hearing-impaired. Researchers at Arizona State University are among those developing cochlear implants — featuring piezoelectric MEMS sensors — which may one day restore hearing to those with significant hearing loss. The visually impaired may take heart in knowing that researchers at Stanford University are collaborating on silicon retinal implants. Pixium Vision began clinical trials in humans in 2017 with its silicon retinal implants.It’s not science fiction to think that we will use future generations of sensors for emotion/empathy sensing. Augmenting our reality, such sensing could have many uses, perhaps even aiding the ability of people on the autism spectrum to more easily interpret the emotions of others.Through my years in the MEMS industry, I have identified three distinct eras in MEMS’ evolution: The “detection era” in the very first years, when we used simple sensors to detect a shock. The “measuring era” when sensors could not only sense and detect but also measure (e.g., a rotation). The “global-perception awareness era” when we increasingly use sensors to map the environment. We conduct 3D imaging with Lidar for autonomous vehicles. We monitor air quality using environmental sensors. We recognize gestures using accelerometers and/or ultrasonics. We implement biometry with fingerprint and facial recognition sensors. This is possible thanks to sensor fusion of multiple parameters, together with artificial intelligence. Numerous technological breakthroughs are responsible for this steady stream of advancements: new sensor design, new processes and materials, new integration approaches, new packaging, sensor fusion, and new detection principles.Global Awareness SensingThe era of global awareness sensing is upon us. We can either view global awareness as an extension of human sensing capabilities (e.g., adding infrared imaging to visible) or as beyond-human sensing capabilities (e.g., machines with superior environmental perception, such as Lidar in a robotic vehicle). Think about Professor X in Marvel’s universe, and you can imagine how human perception could evolve in the future! Some companies envisioned global awareness from the start. Movea (now part of TDK InvenSense), for example, began their development with inertial MEMS. Others implemented global awareness by combining optical sensors such as Lidar and night-vision sensors for robotic cars. A third contingent grouped environmental sensors (gas, particle, pressure, temperature) to check air quality. The newest entrant in this group, the particle sensor, could play an especially important role in air-quality sensing, particularly in wearable devices.Driven by increasing societal concern over mounting evidence of global air-quality deterioration, air pollution has become a major topic in our society. Studies show that there is no safe level of particulates. Instead, for every increase in concentration of PM10 or PM2.5 inhalable particles in the air, the lung cancer rate is rising proportionately. Combining a particle sensor with a mapping application in a wearable could allow us to identify the locations of the most polluted urban zones.The Need for Artificial Intelligence To realize global awareness, we also need artificial intelligence (AI), but first, we have challenges to solve. Activity tracking, for example, requires accurate live classification of AI data. Relegating all AI processing to a main processor, however, would consume significant CPU resources, reducing available processing power. Likewise, storing all AI data on the device would push up storage costs. To marry AI with MEMS, we must do the following: Decouple feature processing from the execution of the classification engine to a more powerful external processor. Reduce storage and processing demands by deploying only the features required for accurate activity recognition. Install low-power MEMS sensors that can incorporate data from multiple sensors (sensor fusion) and enable pre-processing for always-on execution. Retrain the model with system-supported data that can accurately identify the user’s activities. There are two ways to add AI and software in mobile and automotive applications. The first is a centralized approach, where sensor data is processed in the auxiliary power unit (APU) that contains the software. The second is a decentralized approach, where the sensor chip is localized in the same package, close to the software and the AI (in the DSP for a CMOS image sensor, for example). Whatever the approach, MEMS and sensors manufacturers need to understand AI, although they are unlikely to gain much value at the sensor-chip level.Heading to an Augmented WorldWe have achieved massive progress in sensor development over the years and are now reaching the point when sensors can mimic or augment most of our perception: vision, hearing, touch, smell and even emotion/empathy as well as some aesthetic senses. We should realize that humans are not the only ones to benefit from these developments. Enhanced perception will also allow robots to help us in our daily lives (through smart transportation, better medical care, contextually aware environments and more). We need to couple smart sensors’ development with AI to further enhance our experiences with the people, places and things in our lives.About the authorWith almost 20 years’ experience in MEMS, sensors and photonics applications, markets, and technology analyses, Dr. Eric Mounier provides in-depth industry insight into current and future trends. As a Principal Analyst, Technology Markets, MEMS Photonics, in the Photonics, Sensing Display Division, he contributes daily to the development of MEMS and photonics activities at Yole Développement (Yole). He is involved with a large collection of market and technology reports, as well as multiple custom consulting projects: business strategy, identification of investment or acquisition targets, due diligence (buy/sell side), market and technology analyses, cost modeling, and technology scouting, etc.Previously, Mounier held R D and marketing positions at CEA Leti (France). He has spoken in numerous international conferences and has authored or co-authored more than 100 papers. Mounier has a Semiconductor Engineering Degree and a PhD in Optoelectronics from the National Polytechnic Institute of Grenoble (France).Mounier is a featured speaker at SEMI-MSIG European MEMS Sensors Summit, September 20, 2018 in Grenoble, France. (1) Source: Status of the MEMS Industry report, Yole Développement, 2018

Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, Taiwan’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the world’s next market goldmine. But breaking into the self-driving vehicle industry can be a steep uphill climb. Semiconductor players hungry to secure their piece of the potentially massive market must know how to navigate the automotive industry’s unique ecosystem of suppliers, not to mention its lofty standards for safety and reliability.To explore opportunities and challenges in the automotive semiconductor market, SEMI recently organized Mobility Tech Talk – a gathering of experts from Strategy Analysis, Yole Développement, Renesas, X-FAB and IHS Markit who examined the evolution of sensors for autonomous cars, advanced driver-assisted system (ADAS) applications, and new energy vehicles (NEVs) in China. Nearly 200 participants exchanged in-depth, forward-looking insights and perspectives as the event helped forge stronger relations among various market segments. Here are four key takeaways from the conference. Lidar: The Hottest Sensing Technology for Smart AutomotiveLidar, mmWave radar, cameras and inertial measurement units (IMUs) are critical sensing devices for autonomous cars. With sensor and high-speed computing technologies maturing at their current pace, some 350,000 self-driving vehicles are expected to hit the road by 2027. But before a single autonomous vehicle takes to the roadways, self-driving technology must become expert at monitoring a vehicle’s environment.That’s where Lidar, the hottest of all sensing technologies and the key to the holy grail of safe self-driving, comes into the picture. Lidar’s versatility supports multiple essential functions such as mapping, object detection and object movement. The problem is that mass production is still impossible due to the technology's high costs. What’s more, technical issues must still be sorted out with solid-state lidar, mechanical lidar and MEMS. Both startups and traditional tier-1 semiconductor manufacturers are aggressively investing in related research and development in hopes of fulfilling lidar's promise and seizing the market opportunity. Smart Automotive Sets New Quality and Safety StandardsAs cars become smarter, so too must silicon. Chips must support vastly more data generated by in-vehicle connectivity, ADAS, electrification, autonomous driving and an array of other functions that rely on advanced automotive electronics components. With demand for smarter silicon surging, Taiwan semiconductor companies are turning to the automotive chip industry for expertise and serving as OEMs for major automakers.Quality and safety for automotive applications is paramount. In-vehicle semiconductors must meet strict requirements for vehicle control, robustness, liability, cost and quality management to meet the automotive specifications necessary to securing certifications. Smart silicon must also pass all AEC-Q liability standards promoted by North America automakers and score “zero defect” for the ISO/TS 16949 Automotive Quality Management System.China’s New Energy Vehicles To Fuel Semiconductor GrowthTo promote NEVs and reduce fuel consumption of cars with internal combustion engines (ICEs), late last year the Chinese government introduced the Measures for the Parallel Administration of the Average Fuel Consumption and New Energy Vehicle Credits of Passenger Vehicle Enterprises. With China the world’s largest market for NEVs, the policy is forcing automakers in Japan, the U.S. and Europe to accelerate moves towards NEVs that, in turn, will fuel growth in the semiconductor and automotive battery industries. NEVs in China are expected to number 2 million by 2020 before more than doubling to 4.9 million by 2025. Today, most cars still run on ICEs as environmentally friendly motor drives are still under development. In unit shipments, motor drives are expected to surpass ICEs by 2025.Cross-field Collaboration is KeyThe rise of smarter, fully autonomous vehicles – a disruptive Car 2.0 – is unlikely to happen overnight. Rapid growth of the global automotive semiconductor market will continue, with safety and powertrain applications driving the strongest chip demand. Meanwhile, automakers are focusing more on innovations from startups and non-traditional suppliers, and some have even started to develop their own IP and solutions. These paradigm industry shifts are diversifying the automotive supply chain into a cross-domain collaborative network of suppliers, pushing the closed, one-way automotive supply chain into lesser relevance. In the near future, rivals and partners may become indistinguishable as traditional turf wars begin to wane. As ADAS and autonomous cars evolve, and the era of electric cars nears, automotive semiconductors are emerging as the engine of growth for the global semiconductor industry. The automotive semiconductor market is expected to grow at a CAGR of 5.8 percent, reaching US$48.78 billion by 2022.For its part, the SEMI Smart Automotive special interest group connects professionals from the microelectronics and automotive industries. The group promotes the semiconductor industry's development of automotive technologies and cross-domain collaboration to help drive autonomous vehicle innovation.