TSMC

As an industry, we must collaborate because it’s going to take a village to solve Multiphysics, which in turn is the key to growth in 3D IC. No individual company can compete on every front.

The SEMI white paper A Vision for Electronics Supply Chain Management examines the vital importance of the electronics supply chain, current supply chain challenges, and the criticality of transparency, collaboration, and information sharing to mitigate disruptions.

Jay Vleeschhouwer, managing director of Griffin Securities, has followed the EDA industry as a leading financial analyst for 25 years and is a popular speaker at the annual Design Automation Conference. Vleeschhouwer discusses his DAC presentation The State of EDA: A View from Wall Street.

EMD Electronics welcomes dozens of interns into its various business functions nationwide every year. Students from under-graduate and postgraduate programs gain valuable experience in a global science and technology company connecting with colleagues across the world from day one.

29 new fabs will break ground globally between now and 2022. But who will staff them? With 34,000 current vacancies in the semiconductors industry worldwide, companies large and small are already competing for the same talent pool.

SEMI spoke with Andreas C. Zimmer, Executive Search and Selection Consultant at ZIAN Co industrial consulting and recruitment, about strategies for attracting and retaining talent and promoting careers in semiconductor industry. Zimmer shared his views ahead of his presentation at the SEMI Fab Management Forum, 17 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, an online event. Join us to meet experts from ZIAN Co. and other key industry influencers. Registration is open. SEMI: What makes the semiconductor industry such a great career destination? Zimmer: The semiconductor industry is an interesting world for anyone involved in or just fascinated by high-end technology. But if we think about our mobile phones, personal computers or cars, we should all ask ourselves what technology is behind these devices we use in our daily life. The classical Newtonian physics does not reveal the source of the pixels in our mobile phones or why a navigation system knows where I currently am and how I’m supposed to drive to avoid the traffic jam ahead. The semiconductor industry truly is the technological pacesetter. The technologies and applications developed by SEMI and its members are the multipliers directly impacting our daily life. Moore's law not only affects the development of chips themselves, but also how we use the applications and devices they enable. Think about the size-performance ratio of modern smartphones compared to the first- and second-generation devices in the 1970s and 1980s, or compare today's BMW with one from the 1960s. The problem is that the industry is too hermetic. We perceive a lack of willingness to go out and tell in a generally understandable way what this industry is all about! Everyone knows Apple, Samsung, Nokia, but who, besides the specialists, knows NXP, Infineon, TSMC or LFoundry? Many companies are largely unknown to the general public! So why should a graduate from a technical university choose a company such as Applied Materials, TEL or ASML? During their studies students will inevitably have come in touch with IC or MEMS companies, but do they also know what is behind them? Do they really know the value chain that leads to the end product? SEMI: What can the chip industry do to better attract talent? Zimmer: Our industry is extremely attractive for anyone who is interested in technology and would like to push things ahead, but unfortunately access to this industry is almost reserved to the initiated who, in whatever way, came in touch with the industry at some point. Let me get this straight: This is not a conscious, willful attitude. It is just the result of our industry’s hermetic attitude. In my opinion, there is no overarching, uniform strategy in marketing, communications or advertising to promote the potential of the semiconductor industry to a wider audience. That’s why SEMI and the cooperation of its members in attracting talent is essential. SEMI: What concrete actions do you suggest for attracting and retaining talent? Zimmer: In German there is the saying “Do good and talk about it!” – and this is exactly what should be implemented. It is not enough to place an ad when necessary, to promote something here and there, perhaps to sponsor a chair or to provide a device free of charge. These are certainly all reasonable actions, but rather random and not long-term or strategic. Furthermore, these actions will reach only a relatively small group of people. The industry should organize structured recruitment activities under a long-term plan, over 10 years or even extending to the next generation. This shouldn't be a rigid corset, but rather a guideline closely informed by the chip industry’s technology roadmap and companies across the supply chain. If it is the task of an organization’s board and the management to define the strategic direction and to set specific goals, it should be the task of technical management to ensure that these goals can and will be achieved. However, this will only succeed if human resources is involved from the very beginning and can plan appropriate personnel resources accordingly. Employees retire, quit and change employers. New materials, technologies, applications and processes are being developed and require new, specific knowledge. Market requirements change. All of these components need to be recognized and considered in early planning. SEMI: What is your experience as a consultant? Zimmer: As consultants, we experience how organizations literally fall out of the clouds when the situation within the organization itself drastically changes, because a strategically important colleague is retiring or suddenly leaving the team for whatever reason. Then, quite surprisingly, the question “Where and how quickly can we find the suitable replacement?” arises. Instead, that departure should be considered as a possible development up front in overall talent planning – a plan B to keep in the drawer. Developing and implementing a long-term HR development roadmap, aligned with the technology roadmap, enables a company to anticipate when specific resources are needed, identify the right people and get them onboard without gaps. It is also important to keep your team informed and involved in all decisions and process changes, and to make sure they get the respect and appreciation they deserve. Employer-employee cooperation over the long term only works when the relationship is a win-win for both parties. If an organization sees the relationship as one-sided to its exclusive benefit, sooner or later the worker will be terminated or quit at the expense of the organization. Truly live the statement “Our people are our best and most valuable resources!” SEMI: When should organizations start attracting young talent? Zimmer: The sooner, the better! Communications aimed at attracting future employees should be designed to reach people of all ages and levels of education. For many years, the tobacco industry targeted young people by demographic, considering their age, education and cultural mindset to ensure they perceived cigarettes as cool. The result? Many people became addicted, mostly for life, just because some clever communications expert touched the right spot! Our industry will not attract teenagers like tobacco corporations did, but the strategy is basically the same: arouse the curiosity of your target group and speak their language. A possible scenario: A company starts and establishes a relationship with neighboring technical, middle and high schools by providing equipment, documentation, and employees who serve as teachers or coaches, and organizing guided tours, seminars and workshops in coordination with the school management. The cooperation continues with the university, where the respective chairs are supported and financed. With a little creativity there are endless possibilities! In our day-to-day business, we observe that large, well-known companies such as Bosch and Daimler are practically sitting on the lap of students in key universities and institutes, yet are unable to identify talent very early and bind them to their company. SEMI: How can organizations capitalize on shifting retirement patterns to help narrow their talent gap? Zimmer: The answer to this arises from considerations related to personnel planning in connection with a company’s technology roadmap. If the roadmap is linked to HR plans, you automatically have an overview of the time-critical moments when personnel gaps might arise. Then you can easily close these gaps, for example by arranging the onboarding of a successor for a specific position long before the job holder leaves. Considering notice periods and approval processes, a period of at least two years should be planned in order to be prepared for personnel changes. Of course, much of this varies depending on the importance of the position to the organization and the size of the talent pool. For example, it will probably be easier and faster to hire and train a sales engineer than the successor for a development manager, when you know there are maybe only 10 people worldwide who are, professionally speaking, at his level. And this is equally true for internal promotions: Always keep an eye on your own people and try to discover their greatest talent! Senior people tend to look outside the organization rather than just around the corner. Maybe the right talent is sitting next to you. Stay tuned and talk to your people to implement a strategic knowledge transfer as part of your organizational culture. Another aspect that is often overlooked is the deputy function: We often find functions in organizations that literally have a unique selling proposition. But there is no deputy, no one who can step in case of an emergency, because no other colleague possesses the knowledge and information to take over if necessary. Usually this is not a problem during a vacation or illness, but what do you do if a key job holder suddenly cannot work from one day to the other? SEMI: What is the role played by artificial intelligence? Zimmer: AI is both a risk and an opportunity. A new technology can always mean danger if it is used incorrectly, and I am not talking about job losses! This has always proven to be a mistake in the past. On the contrary, new technologies create new jobs! New technology accelerates communication, creates new platforms for interaction, shortens decision-making processes, and turns the world into a small village. In your interview with David Meyer CEO of Lynceus, he hits the nail on the head: The great advantage of AI in our industry is likely to be the management, handling, analysis and drawing of conclusions from an incredible amount of information at an unbelievable speed. Without AI, information cannot be controlled to this extent, not to mention accurately evaluated in real time. The mastery of these processes and the learning curve that results from them – for example for the determination of quality levels – should set completely new manufacturing standards. SEMI: How can technology unite us? What do you expect from your participation at SEMI Technology Unites Global Summit? SONAR GmbH has been in this industry as a personnel and business consultant firm for 25 years now. We have experienced many pig cycles since 1995 and accompanied our customers through all the ups and downs, only to have learned one thing in the end: The semiconductor industry is unfortunately still too fixated on technology and overlooks the fact that this technology is made by people for people. The EU's latest Pact for Skills, which was presented at end of November 2020 by Commissioners Schmidt and Breton, foresees 2 billion € investment to generate 250,000 new jobs in the electronics industry throughout Europe! In 2013, we aimed to sensitize semi industry executives, managers and CEOs to the importance of human resources to the well-being and success of organizations. It’s vitally important to invest in day-to-day relationships with your employees to foster their careers and address their needs. The SEMI Fab Management Forum will feature leading game changers of semiconductor operations to highlight best practices for achieving sustainable operations beyond 2020 and exploring the latest solutions for smarter tools and smarter processes. Andreas C. Zimmer is executive search and selection consultant at ZIAN Co industrial consulting and recruitment, specializing in recruiting talent for high-end technologies in areas such as LED, PV, semiconductors, electronics, and test and measurement. A personnel and industrial consultant with more than 20 years of experience, Andreas is active throughout Europe, the United States and Asia. For more insights about workforce and skills strategies, please see SEMI Workforce Development activities and the European METIS project. Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

The semiconductor industry is in the final throes of its most recent cyclical downturn, but clear demand drivers on the horizon, such as 5G and autonomous driving, have created a decidedly upbeat mood at SEMI’s Strategic Materials Conference, held this week in San Jose, California. Increased connectivity in daily lives will not only dramatically boost semiconductor volumes, but the physical challenges of improving chip performance have positioned materials as the key enabling technology of the fourth industrial revolution – creating opportunities for suppliers to capture significant value. Most speakers were quick to underscore the importance of materials innovation. According to Dave Anderson, president of SEMI Americas, “We are entering the era of the material scientist,” and the role of materials in semiconductor manufacturing “has never been more important.” Carlos Diaz, senior director, corporate research at foundry major TSMC, said that the future “belongs to new materials and processes,” while Bertrand Loy, president and CEO, Entegris, told attendees the world is on the brink of the fourth industrial revolution, where technology will be fusing “physical, digital, and biological worlds and transforming our collective lives.” Len Jelinek, senior director/semiconductor manufacturing, IHS Markit, noted that 2019 has been a challenging year for semiconductor revenue – expectations are for a 12.5% decline YOY – but said he is not forecasting “doom and gloom” because of positive consumer demand trends beyond 2019. These include the rollout of 5G networks, internet of things (IoT), artificial intelligence (AI), and autonomous vehicles. Jelinek emphasized the foundational impact of 5G in particular. “Don’t think of 5G’s impact only in terms of handsets. It’s an enabling technology that will have broad-based impact” and will be key to creating a sustainable recovery in semiconductor demand in the second half of 2020. The current semiconductor downturn – the industry’s 10th – was initiated by an imbalance in memory supply and demand, and the lack of resolution of trade issues between China and the US is threatening to amplify volatility. Smartphones, the number-one application for semiconductors, are currently challenged by extended replacement cycles, and total handset shipments are set for its second year of decline. “We, as consumers, are waiting for revolutionary features such as 5G speeds, biometrics, foldable handsets and AI capabilities,” Jelinek says. Recent iterations have been merely evolutionary, and premium handset costs have escalated, he adds. Automotive electronics, which account for about 10% of global semiconductor demand, will eke out slight growth in 2019, Jelinek says. “Long-term semi component revenue growth within the Auto segment will focus on increasing content within cars supporting advanced safety features.” During his session, Duncan Meldrum, chief economist and founder of Hilltop Economics, addressed recent threats of a recession. “Underlying economic fundamentals are strong, but we are at that point in the business cycle where it doesn’t take much to knock the economy into recession,” he says. “I am telling people to have a contingency plan in place.” Nevertheless, Meldrum laid out reasons for optimism. Most economies have plenty of jobs, and consumers have been confident despite negative headlines. “For the average person, a tariff trade war gets to be noise. If they don’t see immediate impact, they tend to eventually discount all the headline noise. The same goes for Washington politics or Brexit.” There are no serious signs of inflation pressures in the US or other major economies, he adds. Beyond the cycleLonger-term, explosive growth in connected devices will create a runway for semiconductor volume growth. According to SEMI, over 30 billion devices are currently connected and another 200 million are added daily. By 2020, the number of connected devices will reach 1 trillion. “The growth profile for industry will be very strong and a multiplicity of drivers will bring more stability to this industry,” Loy adds. “But before this future becomes a reality we have a lot of work to do.” Current chips need to be faster and cheaper. “Physical scaling is not going to get us there, we’ve hit those limits,” Loy adds. “We have to look at new architectures and materials.” Loy called on the materials sector to need to “up our game” and spend more on R D. “Customers want us to make our products in very tight process window and ship to control. They want extreme purity for everything. It’s a long list of to-dos and it’s going to cost us a lot,” he adds. Among the needed innovations are photoresist hard masks to hand high aspect ratio, new etch chemistries for better rates and higher selectivity, and new cleaning chemistries for high aspect ratio geometry with high selectivity.Loy also identified contamination control as a key challenge for material suppliers. “When you think about purity and contaminants, you need to think about size, concentration levels, and classes. To optimize yields and lower wafer defectivity, our customers expect materials to be very pure and exhibit low variability.” The payoff for customers is large; a 1% yield improvement can mean $150 million in annual net profit for a leading-edge logic fab, Loy says. For a 3D NAND fab, that figure can be around $110 million per year. But these requirements are getting exponentially tighter. From 28 to 7 nm, the metal impurity concentration limit became 1,000 times lower, Loy notes. Contamination control is even more vital when the potential impacts of latent defects – which are difficult to detect in a fab and during electrical testing – are considered, particularly in emerging applications like autonomous driving, Loy says. “The cost of yield loss is expensive, but failure in a critical optical sensor of a car could be significantly greater, in terms of recalls or even human loss of life.” To meet tightening purity requirements, Loy recommends throwing out traditional thinking about contamination control. “In the past, we could get away with simple filtrations,” he says. “That’s no longer going to work. We need to collectively, up and down the supply chain, migrate to better filtration and purification and also rethink chemical delivery systems and packaging solutions to preserve the integrity of our products.”Metrology will also be key, but analytical capability is lagging. “We all like to believe that we cannot control what we cannot see, but that is exactly what we have to do.” The need for innovation is also being felt at the wafer level. Kevin Light, director, Applications Technology Americas at Siltronic Corp., said that as semiconductor markets become more diversified, silicon suppliers must recognize the distinct challenges each segment faces. Better wafer properties are required for next-generation chips, he adds. “Excessive wafer geometry can cause errors during lithography, especially when printing even smaller linewidths,” he says. The end result can be defocus and placement errors. When dealing with “More than Moore” architectures, wafer requirements are driven by other factors than defects. “More than Moore applications do not benefit from scaling, but instead drive capabilities of separate silicon parameters,” Light says. “In some cases you need high doping, in others the doping needs to be precise.” Czochralski crystal growth is suitable for high dopant levels, but the concentrations vary at the top and bottom of the ingot. Float Zone crystals avoid oxygen incorporation and provide consistent doping. These variations make Czochralski process suitable for PowerMOS, and Float Zone appropriate for IGBT. Compound semiconductor layers, such as GaN-on-Si, offer potential advantages owing to higher switching speeds and critical breakdown fields, he adds. “Silicon wafer requirements are diversifying as the devices themselves find increasing use outside of traditional logic,” Light adds. “Moore’s law is alive and next-gen computing will continue to push the limits of flatness and cleanliness. Meanwhile, demands of energy efficiency, electrification, IoT, and 5G drive wafer requirements other than scaling, including extremely high doped or ultra-low oxygen growing techniques, high lifetimes, and substrates engineered for compounds semiconductors.” Driverless futureAutonomous driving was a frequent discussion topic at SMC. Although IHS Markit does not see it really rolling out until past 2025, the disruption to the auto industry’s status quo is very much being felt now. Dragos Maciuca, executive technical director, Palo Alto Research and Innovation Center at Ford Motor Company, says cars of the future will be autonomous, connected, electrified, and shared. “The biggest transformation will be the shift from mechanical hardware to software,” he says. “Currently [a car] is a mechanical thing that has some electronics. Going forward, it will be a software-driven system that happens to control some mechanical elements.” The transition is already way under way, so much so that autonomous technology developed for the automotive industry is already being spun off into other sectors, such as mining and agriculture, and the auto industry’s competitive landscape is already seeing changes. OEMs and carmakers are entering the market from the traditional auto industry side, while companies such as Google are participating from the software side. “Others, like Uber and Lyft, are coming in from the business plan point of view to eliminate drivers and improve margins,” Maciuca adds. Autonomous driving will require numerous innovations, many of which will require new electronic materials and production processes. “We need weight savings, space savings, and advanced architecture,” Maciuca says. “We also need customization to print circuits as the vehicle comes down the line.” The tech community is proving up to the task. For LIDAR, there were just two technologies available a few years ago, he adds. The impact on chipmakers is also already being felt. “The automotive industry used to buy older chips,” Maciuca says. “Now we are moving to a stage where we need the very first chips at the most advanced node. And we are using them for safety-critical operations. If an AI chip that is supposed to detect a human fails, the consequences can be very severe.”Rebecca Coons is a senior editor at Chemical Week. Republished with permission from Chemical Week.The SEMI Electronic Materials Group (SEMI EMG) is the backbone of the Strategic Materials Conference. EMG is a technology community representing SEMI member companies that provide substrates, polymers, metals, organic and inorganic materials, chemicals, and gases that are developed or in use for the manufacturing of electronics. The group is open to SEMI Members involved in materials manufacture, distribution, and services throughout the microelectronics industry. For more details, please visit the website.

Post-Conference Report: SEMI Heterogeneous Integration SummitDemand for high-performance computing (HPC) chips is exploding. These super-speedy chips are critical for data centers and cloud computing infrastructures to support new performance-hungry technologies such as artificial intelligence (AI) and 5G. The challenge is for the devices and their multi-core architectures to couple high bandwidth density with low latency and high energy efficiency. Heterogenous integration offers a potential answer as an advanced packaging technology designed to meet these skyrocketing performance demands on HPC chips and open the door to a whole new world of 3D integrated circuits (ICs).So important are 3D ICs that Intel and TSMC representatives speaking at the recent Heterogeneous Integration Summit hosted by SEMI Taiwan in Taipei declared that the packaging technology will all but dictate the future of the industry. All told, 12 speakers from government, academia and a broad range of leading international companies from sectors including advanced packaging, design, manufacturing, silicon photonics, equipment and materials shared forward-looking strategies, the latest technologies and potential heterogeneous integration market opportunities. Koushik Banerjee, vice president, TMG, Assembly, and Test Technology Integration, at Intel pointed out that using heterogeneous integration for a single SiP (system-in-package) will deliver what the industry has long wanted by enabling multiple process nodes, more diverse silicon IP (intellectual property) and chip functionality, and chips that pair low energy with high frequency. Intel plans to announce its first Forveros 3D packaging product combining a 10nm HPC chiplet with a low-energy 22nm base die and stacked with memory on top. When asked about the future of advanced packaging technology, Banerjee said it will be very much about the combination of Foveros and its very own Embedded Multi-Die Interconnect Bridge (EMIB).For its part, TSMC, will continue to upgrade its CoWoS (Chip-on-Wafer-on-Substrate), InFO (Integrated Fan-out) and other 2.5D IC production solutions while developing 3D chip stacking technology such as SoIC and WoW (wafer-on-wafer). TSMC is ushering in a new age of 3D IC packaging, said Marvin Liao, Vice President, Backend Technology and Service Division, at TSMC. The company’s SoIC is based on Chip-on-Wafer concept, with the flexibility to support one-to-many or different process nodes, whereas its WoW integrates two wafers with solid yields that could be used for products of the same size or manufactured with mature process technology.Speakers also included representatives from ATOTECH, Lam Research, SPIL, Sigurd, Cadence, Grand Process Technology, ITRI (Industrial Technology Research Institute), Industrial Development Bureau, and Lee San-Liang, Distinguished Professor, Department of Electronic and Computer Engineering at National Taiwan University of Science and Technology all shared their perspectives on equipment, materials, and testing and how different industry value chains might contribute to the development of heterogeneous integration technology.Expected to be a key driver of the next wave of semiconductors, heterogeneous integration and related technologies – including 3D IC, FOWLP (Fan-out wafer-level packaging) / FOPLP (Fan-out panel-level packaging), silicon photonics, Micro LED, compound semiconductor, automated optical inspection and SLT (system level testing) – will be a key focus at SEMICON Taiwan 2019, September 18 to 20 in Taipei. The Heterogeneous Integration Innovation Zone – along with featured international programs such as SiP Global Summit, Strategic Materials Conference, the Smart Data Summit and the Smart Automotive Summit – will gather key industry players to reveal the latest technology breakthroughs and market trends.Emmy Yi is a senior marketing specialist at SEMI Taiwan.

The automation of semiconductor factories through digitization is reshaping Smart Manufacturing to streamline the connectivity and orchestration of manufacturing processes across the entire supply chain. But the threat of cyberattacks and viruses looms. An estimated 26 billion smart and connected manufacturing devices are expected to be online by next year. Never before has the need been greater to protect the staggering volume of manufacturing data traversing increasingly intricate supply chain networks.“We are living in the time of digital manufacturing,” said Chen Chi-Hsien, Director of TSMC’s Manufacturing Technology Center. “Processes ranging from assembling equipment and upgrading hardware and software are increasing security challenges for semiconductor manufacturers. With viruses and malware constantly evolving to pose greater threats, all members of the supply chain – from manufacturing and equipment to operating system and software/firmware providers – should work together within the SEMI Smart Manufacturing platform to establish cybersecurity standards across the industry. Doing so will also enhance the development of smart manufacturing and accelerate digitalization.” Representatives from Tongfu Microelectronics, Adlink, NSHC, ABB, TSMC, ASE and Microsoft with SEMI CMO and SEMI Taiwan president Terry Tsao (left to right) Chi-Hsien offered his insights at the SEMI Smart Manufacturing and Cybersecurity Seminar, joining speakers from other leading semiconductor manufacturers including TFME and ASE to discuss the latest smart manufacturing trends and cybersecurity challenges. The April event in Hsinchu also featured representatives from ABB, Adlink, Microsoft, Rockwell, Siemens, Delta Electronics and the National Center for High-Performance Computing (NCHC) offering their views on how the semiconductor industry can speed its digital transformation using various technologies.With its 43 years’ experience in developing international standards, SEMI is committed to serving as the platform to establish universal information security standards for silicon wafer plants and semiconductor equipment, Terry Tsao, SEMI chief marketing officer and SEMI Taiwan president, said at the seminar. Tsao added that SEMI is now in discussions with leading semiconductor manufacturers to establish a communications framework for addressing potential security risks and facilitating the development of risk management and security solutions that safeguard the semiconductor supply chain.This year SEMI will debut its SMART Manufacturing EXPO to gather key supply chain players for critical discussions about security and to feature AI manufacturing and cybersecurity solutions. Co-located with SEMICON Taiwan, September 18-20, 2019, at TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1), the SMART Manufacturing EXPO will include Smart manufacturing hardware and software providers from around the world for the interdisciplinary discussions and collaboration key to developing strong Smart manufacturing security.For more information about the SEMI Smart Manufacturing Platform, contact Emmy Yi of SEMI Taiwan at [email protected] Yi is a marketing specialist at SEMI Taiwan.

New SEMI Taiwan Testing Committee to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.Mobile, high-performance computing (HPC), automotive, and IoT – the four future growth drivers of semiconductor industry, plus the additional boost from artificial intelligence (AI) and 5G – will spur exponential demand for multi-function and high-performance chips. Today, a 3D IC semiconductor structure is beginning to integrate multiple chips to extend functionality and performance, making heterogeneous integration an irreversible trend. As the number of chips integrated in a single package increases, the structural complexity also rises. Not only will this make identifying chip defects harder, but the compatibility and interconnection between components will also introduce uncertainties that can undermine the reliability of the final ICs. Add to these challenges the need for tight cost control and a faster time to market, and it’s clear that semiconductor testing requires disruptive, innovative change. Traditional final-product testing focusing on finished components is now giving way to wafer- and system-level testing.In addition, the traditional notion of design for testing, an approach that enhances testing controllability and observability, is now coupled with the imperative to test for design, which emphasizes drawing analytics insights from collected test data to help reduce design errors and shorten development cycles. Going forward, the relationship among design, manufacturing, packaging, and testing will no longer be un-directional. Instead, it will be a cycle of continuous improvement.This paradigm shift in semiconductor testing, however, will also create a need for new industry standards and regulations, elevate visibility and security levels for shared data, require the optimization of testing time and costs, and lead to a shortage of testing professionals. Solving all these issues will require a joint effort by the industry and academia. "With leading technologies and $4.7 billion in market value, Taiwan still holds the top spot in global semiconductor testing market," said Terry Tsao, President of SEMI Taiwan. "When testing extends beyond the manufacturing process, it can play a critical role in ensuring quality throughout the entire life cycle from design and manufacturing to system integration while maintaining effective controls on development costs and schedules. Taiwan's semiconductor industry is in dire need of a common testing platform to enable the cross-disciplinary collaboration necessary for technical breakthroughs."The SEMI Taiwan Testing Committee was formed to meet that need, gathering testing experts and academics from MediaTek, Intel, NXP Semiconductors, TSMC, UMC, ASE Technology, SPIL, KYEC, Teradyne, Advantest, FormFactor, MJC, Synopsys, Cadence, Mentor, and National Tsing Hua University to collaborate in building a complete testing ecosystem. The committee addresses common technical challenges faced by the industry and cultivates next-generation testing professionals to enable Taiwan to maintain its global leadership in semiconductor testing.The SEMI Taiwan Testing Platform spans communities, expositions, programs, events, networking, business matching, advocacy, and market and technology insights. For more information about the SEMI Taiwan Testing platform, please contact Elaine Lee ([email protected]) or Ana Li ([email protected]). Emmy Yi is a marketing specialist at SEMI Taiwan.