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If you look at your clothes or shoes, there is a growing chance you will see the words Made in Vietnam printed on the tag. Since the United States lifted its trade embargo against Vietnam in 1994, the country has become the second largest exporter of apparel and shoes to the U.S. What may be less evident is the source of that new electronic gadget you received for Christmas, with its numerous parts, chips, and intricate supply chain. While light manufacturing has dominated Vietnam’s economic growth since the Đổi Mới economic reforms implemented in the 1980s, over the last decade the country has been repositioning itself to become a dominant player in the global microelectronics industry, a trend that has gained momentum in the wake of the U.S.-China trade war. In 2019, Vietnam ranked as the fourth largest exporter of electrical goods and components to the U.S. With exports doubling over the last four years and now exceeding $19 billion, surpassing Taiwan, Japan, and Korea (based on goods exported under chapter 85 of the Harmonized Tariff Schedule). Vietnam’s global electronics industry now accounts for about 40% of its exports, and the country seems to be just getting started. Early Entrants Though Vietnam owes its growing success in attracting foreign direct investment (FDI) in the semiconductor and microelectronics industries to the advent of China plus one – the business strategy to diversify business investments geographically – it was the few early entrants that gambled on this emerging market a decade ago that put Vietnam on the global stage. Of these early players, no other firm comes close to having the impact that Samsung has. It’s initial $670 million mobile phone manufacturing plant in the northern province of Bac Ninh in 2008 grew to a country-wide investment of $17.3 billion within a decade. Samsung is now Vietnam’s largest FDI contributor and accounts for more than 25 percent of its exports. Because of Samsung, Vietnam has become the second largest exporter of smartphones in the world. Around the same time, Intel opened its $1 billion semiconductor assembly and testing facility in Ho Chi Minh City, putting Vietnam firmly on the global technology map. More investors, like LG, Panasonic and Foxconn soon followed. Within a few years of these initial investments the industry was taking notice, illustrated by SEMI’s role in co-organizing the Vietnam Semiconductor Strategy Summits in 2013 and 2014. With SEMI SEA’s increased efforts to promote Vietnam as an important ecosystem in the electronics supply chain, more will be done to positively influence the growth and prosperity of its member companies in Vietnam. These early investors found Vietnam attractive for several reasons. Key among these are the country’s low wage rates combined with its favorable demographic structure – what the UN refers to as the golden population structure, which provides “Vietnam with a unique socio-economic development opportunity.” Companies are also attracted to the growing number of Free Trade Agreements (FTAs) that Vietnam belongs to, including the ASEAN Free Trade Area, CPTPP, the EU-Vietnam FTA, and, most recently, RCEP. Though the U.S. has yet to ink a trade agreement, the Singapore AmCham’s annual regional survey has consistently identified Vietnam as the most attractive country in ASEAN for a potential bilateral FTA partner with the U.S. Leveraging the Trade War If the plus one strategy was the catalyst that started this wave of electronics manufacturing in Vietnam, then the U.S.-China trade war was the enzyme that supercharged it. A common quip in Southeast Asia is that the U.S.-China trade war is over and Vietnam is the winner, and this is apparent in both trade and investment trends. According to the Asia Development Bank (ADB), the riff between the U.S. and China has caused a redirection in trade, as U.S. imports from the PRC fell by 12% in the first six months of 2019 while U.S. imports from Vietnam increased by 33%, with electronics and machinery accounting for the bulk of this jump. The ADB further reported that in a prolonged and intensified trade conflict, the worse-case scenario would result in Vietnam, Malaysia, and Thailand being the biggest winners, “in that order.” On the investment side, a March 2020 Gartner, Inc. survey of global supply chain leaders revealed that 33% had “moved sourcing and manufacturing activities out of China or plan to do so in the next two to three years.” While this survey did not mention specific winners, the ADB reported that “newly registered FDI in Vietnam from the PRC and Hong Kong rose by 200% year on year in the first seven months of 2019,” indicating the move of Chinese suppliers to Vietnam. Additionally, a review of recent press reports indicate firms like Apple, Nintendo and Dell are encouraging suppliers to move parts of their supply chains to Vietnam. These suppliers are complying, with Compal Electronics, GoerTek, HZO, Inventec, Luxshare Precision Industry, Pegatron, USI and Wistron all reportedly announcing plans for new investments in Vietnam. Manufacturing Hubs Within Vietnam, microelectronic facilities have concentrated in a few geographic hubs. In the south, the Saigon High Tech Park in Ho Chi Minh City attracted early entrants Intel and Samsung, with firms like Nidec and Jabil soon following. The largest investment capital, however, developed in the northern provinces that ring Hanoi. Bắc Ninh, an hour’s drive from Hanoi, was the site of Samsung’s first investment and has since attracted Foxconn and Canon. More recently, firms have been drawn to the port city of Hải Phòng, the country’s third largest city, which is already home to Samsung and LG. The city’s close proximity to other manufacturing clusters, its new deep-water port, and its expressway that provides a 12-hour trucking route to China’s electronics epicenter in Shenzhen are helping make the city Vietnam’s new high-tech production center. In 2019, LG Electronics moved its entire smartphone production line from South Korea to Hải Phòng, and in 2020 Pegatron reportedly chose the city for its $1 billion investment plan. Local phone manufacturer VinSmart is also producing the country’s first 5G smartphones in Hải Phòng. In November, USI, a subsidiary of Taiwan-based ASE Holding, broke ground on its first production base in Southeast Asia, a $200 million phase-one investment in the production and assembly of chips for wearable electronic devices. USI’s investment, which is moving into the internationally managed DEEP C Industrial Zones in Hải Phòng, is “intended to move us closer to our overseas customers and accommodate their ever-increasing demand,” according to Mr. Kuei Chun Chi, the firm’s Manufacturing Service Director. “North Vietnam, with its strategic geographical position and an extended infrastructure in place, offers USI an optimal way to facilitate fast and flexible response to customers' orders.” Though the Covid-19 pandemic has dampened the pace of new investments in Vietnam’s microelectronics industry, it has also amplified the country’s attractiveness to investors. Vietnam was successful in containing the outbreak through aggressive quarantine and contact tracing measures, and as a result its economy has the brightest outlook in the region. The ADB forecasts the country will be one of the fastest-growing economies in SEA in 2021, with GDP estimated at 6.8%. The Ministry of Industry and Trade is also reporting that several of the world's largest technology corporations plan to shift their production chains to Vietnam post-Covid-19, an indication that technology firms will accelerate relocation plans in 2021. Vietnam’s successful response to the pandemic, combined with its strategic location, low wage rates and foreign trade agreements, will ensure that the region continues to benefit from the shift in supply chains in Asia, making it the new destination for electronics manufacturing. About the Author Stuart Schaag is Principal at E-Ward Trade Consulting LLC, which assists firms that are expanding their presence in the global marketplace by creating strategies combining market analysis, business development, commercial diplomacy, and relationship building. He previously spent 25 years in various domestic and overseas positions in the U.S. Department of Commerce’s International Trade Administration. Stuart served as the Commercial Counselor at the U.S. Embassy in Hanoi from 2014-2018 and resided in Vietnam until 2020.
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SEMI’s annual FLEX Conference Exhibition returns to Monterey, California, February 18-21, 2019, bringing together nearly 100 speakers on the major developments at the leading edge of printed/flexible/hybrid sensors and electronics technology.The maturing technology for smarter sensors, in a wider range of flexible formats, is enabling new opportunities across a wide range of applications, from healthcare to agriculture. And that means sensor suppliers need to connect with a broader range of users to build the next generation of innovative outside-the-box solutions. SEMI gathers the flexible/hybrid integration supply chain, leading researchers and potential customers at this annual event to help advance the sector.Collaborative efforts for sensors emerging markets: global health, faster crop development, military monitoringThere’s huge potential for smarter, more accessible sensor systems to detect infectious diseases and aid decision-making for community health workers around the globe, but new technologies and manufacturing methods alone will not be enough to meet the needs of these resource-constrained environments, argues Arunan Skandarajah, program officer at the Bill and Melinda Gates Foundation. He’ll introduce the foundation’s funding and partnering priorities for sensing and imaging for diagnostics and decision support and discuss potential paths forward for development.Recent advances in plant genomics and high-throughput phenotyping have big potential to enable faster development of crop varieties that better withstand adverse conditions – but that will depend on getting fast feedback from sensor data from the field. There’s immediate need for robust, high-efficiency, low-cost sensor technologies to collect on-the-ground microclimate and resource-use data from tractor-based sensors to field scanners, says Nadia Shakoor, Danforth Plant Science Center. She’ll discuss the sensors researchers need to develop high-yielding, energy- efficient crops that are resilient to variable climates.Military interest in biosensor patches to monitor human physiology and performance, and other sensor solutions for flexible imaging and point-of-care diagnostics, are also drivers of collaborative research between industry and universities. The Nano-Bio Materials Consortium (NBMC), a SEMI strategic association partnership with the Air Force Research Lab, will offer a workshop to discuss its potential needs, and how to get involved in its development program to create an integrated suite of nano-bio materials and production technology. Progress in scaling printed/hybrid flexible electronics manufacturing technologyThe maturing manufacturing supply chain continues to make progress towards scaling volume manufacturing of higher performance products, with recent innovations in materials and assembly technologies.Cal Poly researchers will report results from the recent FlexTech benchmark study of the flexible hybrid electronic industry. The study looks at the current state of maturity of the technology, its manufacturing processes, and its main applications while projecting the roadmap for future development. The study covers passives, sensors, batteries, antennas, speakers, PV and energy harvesting, and flexible hybrid integration.Catch up on new process development capabilities and recent work at the NextFlex Flexible Hybrid Electronics Manufacturing Institute’s San Jose Technology Hub for prototyping and pilot manufacturing. The institute has been adding engineers and projects as it looks towards the next generation of technology for sector growth. Innovations in scalable assembly of thin die on flexible substratesSeveral companies will update on recent progress developing solutions for the industrial-scale, high-yield assembly of fragile thinned die on to flexing substrates. American Semiconductor reports new automated assembly capacity for flip chip die attach and interconnect for devices with up to 100 I/Os and 100um pitch pads. The company also notes that it now has flexible Bluetooth ICs from two major suppliers available in semiconductor-on-polymer chip-scale packages, finally enabling improved wireless capacity for flexible hybrid systems.CEA-Leti will present its latest developments in flip chip bonding of thin bare die on flex. It uses gold stud bumps on the die, with 150°C thermocompression bonding to PEN Film. The researchers have also developed a wafer-level die process that thins and encapsulates die before removing them from the carrier wafer. systeMECH will also present its results for direct die placement of 300nm die on flexible polyester. Innovations in materials for easier processing, higher performanceDevelopments in substrates and processing may now enable use of photonics for laser patterning and flash curing on flexible substrates. Brewer Science will report developments on new polymers that can be quickly and cleanly etched with the mid-UV wavelengths commonly used for laser drilling and etching on printed circuit boards, bringing this improved performance to printed electronics as well. The polymers can be processed at less than 200°C with desirable qualities for substrates, adhesives, protective layers and the like for many electronics applications.Novacentrix will update on improvements in photonic curing equipment for fast heating to enable the use of high-temperature solders without damaging low-temperature substrates. Atotech will report results from its multiyear initiative to develop lower temperature solder pastes for better performance than SAC-based materials on a variety of substrates. Printed graphene and carbon nanotubes find applications in sensors and RF devicesBonbouton will introduce its commercial smart insole using a printed graphene sensor to monitor skin temperature to detect early signs of foot ulcers in diabetic patients. The company inkjet-prints graphene oxide followed by thermal reduction to fabricate graphene supercapacitor electrodes for temperature and pressure sensing.C2Sense will update on its development of carbon nanotube gas sensors to monitor food condition to prevent waste. The sensitized carbon nanotubes selectively detect ethylene from fruit or ammonia from chicken to accurately track the condition of the foods as they pass through the supply chain. Georgia Tech will report results of printing not only sensors from carbon nanotube ink but even RF and mm-wave diodes and transistors for high-frequency, long-range, low-cost RFIDs. Innovations in display materialsMaterials for flexible displays continue to see innovations – from solutions for foldable displays to plenty of new options for improved transparent conductive films and force-sensitive films. Solotech will introduce a cross-inked polymer that it says offers both high hardness and excellent foldability as a reliable covering for foldable/bendable displays. Atotech will describe its development of selective electroless copper deposition for metal mesh and TFT electrode patterns for touch screens to eliminate the need for costly mask and etching steps after deposition. Chasm Advanced Materials suggests hybrids of the conductive metals and carbon nanotubes offer a promising alternative for flexible transparent conductive films.C3Nano reports on nanowire ink, fused after printing, for flexible transparent conductors. Peratech will report on its printable pressure touch technology that it describes as high-resolution and low-cost for better localized, force-sensitive touch. Jabil will share the results of its evaluations of five of the available printed force-sensitive sensors. E Ink will introduce new capabilities for its electrophoretic display technology – it’s now possible to write on it with a magnetic stylus, and there’s a variable transmission version for electronic windows. Next generation technologies from universities and startupsResearchers from major research institutions and startups will talk about developments in flexible/printed/hybrid electronics including innovations in biological/electronics interfaces, via skin or neurons, and demonstrations of piezoelectric and better stretchable circuits. Emerging technologies for biosensors and human/machine skin interfaces Georgia Tech researchers will detail their electrical interface with human skin for wireless control of a remote-control car and a wheelchair by electrical signals from the body. They’ve developed a flexible elastomer skin patch patterned with thin film metal/polymer nanostructures made by CMOS processes, and metal pads compatible with conventional reflow soldering. Other Georgia Tech researchers will report their work on better cochlear implants made of encapsulated polymer printed with conductive microcoils for pulsed micro-magnetic stimulation that can focus more tightly on specific areas of auditory neurons. Seoul National University will introduce its flexible organic artificial nerves that can activate an insect’s leg muscle. Researchers there have devised a pressure sensor connected to a ring oscillator that converts the pressure signal into voltage pulses, which are then integrated by a transistor into a signal that replicates a post-synaptic current to communicate with the biological nerves.Epicore Biosystems will report on its advances in manufacturing and packaging technology that enable its skin-interface electronics and microfluidics systems in thin stretchable format to continuously monitor electrical, acoustic and biochemical signals. The technology is now entering commercial development with industrial partners. GE Global Research will update on its field testing of sweat-sensing devices to monitor hydration. Emerging technologies for piezoelectric actuators and improved stretchable sensors and circuits PARC will report on audio speakers made of PVD piezoelectric film on polyimide with inkjet-printed flexible hybrid operating circuits, and Novasentis will talk about its piezoelectric electroactive polymer for different kinds of vibrations for wristband notifications. UTC will share its learnings from deploying large numbers of stretchable flexible hybrid sensors conformably over large areas on aerospace and infrastructure assets to sense temperature, vibration, strain and damage for critical safety.The Air Force Research Lab reports promising results for stretchable circuits made with liquid metals, which maintain their high conductivity even when stretched. Silent Sensors will discuss its printed flexible manufacturing technology for low-cost, stretchable energy storage and piezoelectric energy harvesting for monitoring the condition of automobile tires.By Heidi Hoffman, senior director of technology community marketing, SEMI
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