Germany

Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels.

Electronics industry experts will offer insights into key aspects of the radio frequency (RF) challenge – from materials and devices to ICs and modules – at ITF Beyond 5G at SEMICON Europa 2022, Nov. 15-18 in Munich, Germany.

Jens Fabrowsky, executive VP of Automotive Electronics at Robert Bosch GmbH, spoke about changes in the European electronics industry necessary for the region to become more resilient, sharing his views during the panel discussion at SEMI ISS Europe on May 30 2022 in Brussels, Belgium.

SEMI spoke with Dr. Franz Laermer, Research Fellow (Senior Chief Expert) at Robert Bosch GmbH Stuttgart, Corporate Sector Research and Advance Engineering, about the latest trends in medical diagnostics and personalized treatments. An open platform for the automation of complex molecular diagnostics workflows recently developed by Robert Bosch has proven its ability to take molecular diagnostics to the point of need.To make this happen, miniaturization, microsystems and microfluidics technologies, as well as microelectronics, are crucial. This is critical for the detection of SARS-CoV-2 infections within a rather short development time.Laermer shared his views ahead of his presentation at the SEMI MedTech Forum, 19 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from Robert Bosch and other key industry influencers. Registration is open. SEMI: What is driving innovation in diagnostics and what role does the semiconductor industry play?Laermer: One of the major drivers in diagnostics is the molecular breakdown and detailed analysis of nucleic acids on the level of the individual nucleotide. This reveals the root causes of diseases like cancer, genetic aberrations, infections and therapy resistances. Today’s solutions are mostly PCR-based (that rely on the polymerase chain reaction) or depend on sequencing. The keys to bring these technologies closer to the point of need are automation, miniaturization, low-cost, ease of use, flexibility, reliability, and fast time from sample-to-result. Semiconductor and microsystems technologies are enablers to meet these requirements, thanks to their ever-increasing performance, with Moore’s law pushing the semiconductor side of the story.SEMI: Can you tell us more about the the Bosch VIVALYTIC system? Laermer: VIVALYTIC is a universal and highly flexible diagnostic platform for the integration and automation of a wide variety of molecular diagnostics assays. It consists of the universal laboratory analyzer tool, which operates the application-specific cartridges. All reagents and specific bio contents are contained in the application-specific cartridges in a long-term stable manner at room temperature. The user only has to introduce the patient sample into the cartridge, push the cartridge into the analyzer and start the automatic workflow, which yields a diagnostic result within typically less than one hour. The VIVALYTIC products are manufactured by Bosch Healthcare Solutions GmbH (BHCS) in cooperation with strategic diagnostic partners and bio content owners.SEMI: How is the pandemic impacting automated diagnostics in the medical industry? What is new now?Laermer: The pandemic has clearly shown the importance of fast automated diagnostics at the point of need. Breaking infection chains as early as possible requires fast reliable PCR testing anywhere and anytime. We managed to reduce the time needed for SARS-CoV-2 rapid testing to less than 30 minutes for positive probes, an achievement that is embraced by our customers. Until a sufficiently high level of immunization is reached by vaccination, rapid testing is the only way to limit the number of infections, hospitalizations, and lethal outcomes of the COVID-19 pandemic.SEMI: Besides infectious disease diagnostics, what solutions will enable a paradigm shift in medical treatments?Laermer: Today more and more targeted drugs and therapies are developed in oncology to address certain mutations that are considered drivers of the cancer. This moves away from the one drug fits all approach to precision oncology. As a prerequisite of this personalized therapy, the mutation status of a tumor must be clarified – and monitored precisely and repetitively during therapy. The latter requires molecular diagnostics at the point of need, i.e. at the onco-ambulance. One keyword in this context is liquid biopsy. Another example of personalized therapy is the detection of bacteria type and antibiotics resistances in bacterial infections, and the selection of optimized antibiotics therapy.SEMI: What solutions can Robert Bosch bring to address the needs just mentioned? Laermer: Robert Bosch GmbH is a leader in microsystems, microsensors and semiconductor technologies. Our new 12-inch semiconductor plant in Dresden will strengthen our position in these fields. This encompasses artificial intelligence and the Internet of Things as well. As a technology provider, we generate superior solutions for automation and management of complex workflows, and thus deliver win-win-solutions together with our diagnostic partners.SEMI: How can technology unite us? Laermer: Technology, especially semiconductor and microsystems technology, is a game changer in the medical area. Whenever different disciplines meet each other and cooperate, as are the medical, diagnostics and semiconductor areas, innovation is accelerated strongly. New things happen at the interfaces between different areas of competencies.Franz Laermer, Research Fellow (Senior Chief Expert), Robert Bosch GmbH Stuttgart, Corporate Sector Research Advance Engineering. Dr. Franz Laermer joined the Corporate Research and Technology Center of Robert Bosch GmbH, Stuttgart, Germany, in 1990, where he started the development of new key technologies and sensor functions for the upcoming field of MEMS at Bosch. Today he is a Bosch Research Fellow/Senior Chief Expert for Microsystems, Microfluidics and Molecular Diagnostics. Laermer's work laid the foundation for the VIVALYTIC Diagnostics Platform of the newly founded Bosch Healthcare Solutions (BHCS) Business Division and the SARS-CoV-2 rapid tests from Bosch. Dr. Franz Laermer is the co-inventor of the Bosch Deep Reactive Ion Etching Process (BOSCH-DRIE) for microstructuring silicon. He holds more than 200 patents and was awarded with European Inventor of the Year 2007 – Category Industry prize by the European Commission and the European Patent Office (together with co-inventor Andrea Urban) for the invention, development and sustainable success of the BOSCH-DRIE process. He received the 2014 IEEE Jun-ichi Nishizawa Medal Award from the Institute of Electrical and Electronics Engineers (IEEE), USA. In 2019 he was awarded with the 2019 Technology Prize from the Eduard-Rhein-Foundation in Germany.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

The combination of state-of-the-art semiconductor devices and upcoming manufacturing technologies for cost-effective processing of flexible film substrates has paved the way for a large variety of new applications in the emerging Flexible Hybrid Electronics (FHE).SEMI spoke with Professor Christoph Kutter, executive director, Fraunhofer EMFT, about current FHE technologies and market opportunities ahead of the Get Started with Flexible Hybrid Electronics workshop organized by Fraunhofer EMFT and supported by SEMI, 15 October, 2019, in Munich, Germany. To register for the event, click here.SEMI: Recent developments in thin semiconductors, new materials and cost-effective processing techniques have opened the door to a plurality of new applications and future products. What are the most innovative integration approaches?Kutter: Most interesting is the hybrid integration approach – the combination of most modern printing technologies and lithographically defined semi-additive copper wiring systems with state-of-the-art semiconductor components. Combining these best-of-breed technologies enables low-cost and high-volume printing but also ultra-low power electronics, which is important for every wireless device without or with limited power supply.SEMI: Integrating sensors, integrated circuits (IC), displays, antennas and communication devices on film substrates enables extremely thin and bendable form factors for applications where existing board-level technologies fall short. What are the key enabler technologies?Kutter: Key enabling technologies are fabrication of high-performance wiring patterns, integration of ultra-thin bare dies/components and ongoing advancements in roll-to-roll processing of film substrates. Besides the manufacturing technologies, materials such as electronic inks, substrates, isolation and passivation layers play a key role.SEMI: Are you currently working and experimenting on something particularly exciting?Kutter: We are in the process of developing an adaptive roll-to-roll direct imaging system that analyzes the position of the components manufactured before adaptive lithography steps are carried out in real time. We think that this concept will open up completely new processing possibilities for us. The technical infrastructure making this development possible is funded within the framework of the Research Fab Microelectronics Germany (FMD), the largest cross-site R D cooperation for microelectronics and nanoelectronics in Europe.SEMI: Can you share some details about the Fraunhofer EMFT roadmap?Kutter: Fraunhofer will push the hybrid integration – for example, combining printing technologies with high-performance CMOS – since we are convinced that hybrid integration is the only way to offer low-power systems for IoT with the highest performance and at the lowest cost. For this purpose, we are currently setting up a roll-to-roll die bond and component assembly machine.SEMI: What are your expectations for the future of flexible electronics and why would you recommend attending the workshop in Munich?Kutter: Flexible hybrid integration is becoming more important and offers the best of both worlds: mass volume printing technologies integrated with high performance ultra-low power electronics. You will see many examples of hybrid integration approaches during the workshop. This is a very important opportunity to highlight the latest developments in the semiconductor industry. Researchers, market analysts, material and product developers, and equipment suppliers will gather to provide insights into the latest flexible hybrid electronics innovations. We are particularly proud to organize this platform with SEMI and FlexTech Alliance.Agenda - Get Started with Flexible Hybrid ElectronicsLocation: Fraunhofer EMFT, Hansastrasse 27d, 80686 Munich, GermanyConference Chair: Prof. Dr. Christoph KutterENTRANCE Fees: 150 € VAT excl.Contact: [email protected] Prof. Dr. Christoph Kutter is the director of the Fraunhofer EMFT, focusing on sensing technologies based on silicon electronics and flexible hybrid integration technologies.Kutter completed his physics studies at TU Munich. In 1995, he earned his doctorate in physics at the University of Konstanz. Serena Brischetto is a marketing and communications manager at SEMI Europe.