electric vehicles

Leading experts gathered at the Power and Opto Semiconductor Forum at SEMICON Taiwan 2022 last year to discuss the growing importance of the devices in semiconductor innovation as the chip industry works to develop a robust compound semiconductor ecosystem.

Handel Jones, a well-known, longtime strategic analyst and commentator covering the semiconductor industry, authored the recently published book – When AI Rules The World: China, the U.S. and the Race to Control a Smart Planet. I spoke with Jones about the fascinating read.

The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive. As automotive semiconductor designers carefully consider product definition, product validation, and long-term reliability, MEMS sensor suppliers are responding to new opportunities created by electrified and automated vehicles by developing inertial measurement units (IMUs) for automated driving as well as battery pressure monitoring sensors for Li-ion EV batteries. The most complex MEMS device of all The automotive MEMS IMU is probably the most complex MEMS device that will be used inside a vehicle. This type of IMU is a System-in-Package (SiP) comprised of multiple gyroscope and accelerometer sensing elements plus a signal processing ASIC, integrated into one package that creates an inertial sensor able to measure up to six degrees of freedom (6DoF): yaw, roll and pitch for rotational movements, and lateral, longitudinal and vertical acceleration for linear movements. Degrees of freedom in a vehicle For vehicles with Level 3 autonomy and above (per SAE definition), the IMU is mandatory for taking over the trajectory control of the vehicle in case other sensors, such as the camera, radar or LiDAR, become impaired. Should such a failure occur, the IMU will function as a guidance sensor to bring the car to a safe stop within a short period of time and distance. The IMU is also used to control the regular movement of the car while driving in automated mode. While IMU technology already exists for aerospace applications, there are significant challenges to adapting it for automotive. The automotive IMU requires high performance at costs that are compatible with the automotive industry. Because automotive life cycles are long, MEMS sensor suppliers must produce the device in high volume for an extended period of time. They must also guarantee the sensor’s performance and reliability over a 10- to 15-year lifetime with no maintenance or recalibration of the sensor required. Only a few MEMS suppliers have the capability and willingness to embark on this kind of journey. Electrification is creating new applications for MEMS sensors The conversion from internal combustion engines to electrified propulsion is going to affect the powertrain MEMS market. For example, pressure sensors used in engine management for air pressure and fuel pressure will simply go away with electrification. However, the use of large Li-ion batteries in electrified vehicles has created a new application for MEMS sensors. One of the known risks of Li-ion batteries is the small probability for a battery cell to go into a thermal runaway situation that will lead to a fire. The press has reported multiple cases of EV batteries catching fire. Thermal runway effects When it comes to thermal runaway events, every second counts. Detecting the event as early as possible enables the vehicle safety system to take all necessary measures to warn occupants of an imminent fire and activate timely countermeasures (e.g., trigger fire extinguisher and call fire brigade) to mitigate the impact of the fire. Published studies have shown that measuring the pressure inside the battery pack is a good indication that a thermal runaway is starting. The outgassing of a battery cell, plus a sudden rise in temperature, will increase pressure inside the battery pack, which will generate a pressure pulse. To detect such a pressure pulse, a MEMS pressure sensor must permanently measure the pressure inside the pack. It must also report to the battery management system any suspicious change in pressure, independent of atmospheric pressure changes. It’s important to keep this kind of sensor on all the time to detect any pressure anomaly in the system, even when the vehicle is completely off. NXP has developed a pressure sensor to specifically address this new safety application in EVs, and several automotive manufacturers are already using this solution. NXP battery pressure management sensor The quest for zero defects While the automotive industry is targeting zero fatalities as its ultimate goal, the semiconductor industry and module suppliers are targeting zero defects for each and every semiconductor device. For safety-critical automotive MEMS sensors complying with the Automotive Electronics Council (AEC) Q100 qualification for semiconductors, it’s necessary but clearly not sufficient to guarantee a zero defects production launch and long-term reliability of the device. To boost the reliability and robustness of automotive sensors, NXP has developed Above and Beyond (AaB), a new methodology that studies advanced reliability and robustness well ahead of the device’s qualification and production release. Based on risk-mitigation analysis, AaB consist of extensive testing, such as test-to-fail, corner lot testing, and new use-case testing combined with advanced statistics, all of which help NXP understand how these different parameters interact with each other. As sensor suppliers must integrate AaB into their project planning, it does add time and cost to the project. The upside is that this early investment pays off as long as weaknesses in the device can be detected and corrected before a production launch. Field failures, on the other hand, can lead to unplanned redesign and requalification of a device. Worst-case, they can lead to a recall campaign that costs a huge amount of money. We’re systematically using the AaB methodology at NXP for safety-critical MEMS sensors because its potential benefits far outweigh its costs. For more information about NXP MEMS sensors, register for the upcoming webinar series, MEMS to Market: Ingredients for Success, where NXP will discuss The Growing Importance of MEMS Reliability (May 5, 2021). Register by March 10 to watch all the webinars LIVE. Each webinar will also be available to watch on-demand at your convenience. Contact the author via LinkedIn or learn more about NXP sensors. About the Author With nearly 30 years of experience in the field of automotive and MEMS sensors, Marc Osajda is responsible for European automotive MEMS sensors business development activities at NXP Semiconductors. Osajda holds an engineering degree in mechanics and electronics from the French Ecole Nationale Superieure d’Arts et Métiers (ENSAM). NXP Semiconductors is an active member of MEMS Sensors Industry Group®(MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets to enable members to grow and prosper. Visit us today.

In my role as lead for the Smart Mobility initiative at SEMI, I recently spoke with Automotive Logistics Magazine about the growing importance of the semiconductor supply chain’s connection with the automotive industry and the semiconductor shortage hampering global automotive production. Following are excerpts from the interview. Automotive Logistics: Why is there a bottleneck in the global supply of semiconductors at the moment and how long is it likely to last? Weiss: The current automotive chip shortage resulted from the sharp, Covid-19-induced decrease in demand for automotive semiconductors in the second quarter of last year when vehicle production came to a near standstill. The automotive market picked up significantly in the fourth quarter and this caused the supply chain constraints we are seeing today. At the same time as the automotive standstill, the pandemic spurred an increase in demand for home computing and networking equipment, and semiconductor manufacturing plants (fabs) had to pivot to these other markets in order to maximize fab utilization and successfully navigate economic headwinds. Every minute a semiconductor fab is idle or has lines down adds up quickly to missed revenue, so their capacity is booked weeks and even months in advance. With this background, I don’t believe this is a structural shortage and expect a gradual recovery over the next two quarters, barring any major shifts in geopolitics or macroeconomics. Automotive Logistics: What needs to be done to remedy the current shortfall for the automotive industry? Weiss: The automotive industry needs to continue to strengthen its connections to the semiconductor manufacturing supply chain. In past years, auto manufacturers used to rely mainly on their tier one suppliers to interface with the semiconductor supply chain. This has changed significantly. Not only are more chips being used in vehicles (roughly 10% of all devices produced globally end up in cars), but the strategic importance of the chips as enablers for ADAS [advanced driver-assistance systems], electrification, safety, connectivity and other consumer-driven features has increased considerably. With this dynamic in play, carmakers have recognized the value of interacting and collaborating more closely with the semiconductor supply chain. This provides vehicle OEMs with access to innovation, the ability to influence technology direction and pace, along with greater visibility into global supply chain developments. The SEMI Smart Mobility initiative is evidence of this transition, with the likes of Audi, BMW, Ford, Uber, Volkswagen and other vehicle OEMs, along with tier one suppliers such as Continental and Bosch, now actively involved in our automotive electronics and mobility activities to do exactly that – influence, partner, accelerate and guide the global electronics design and manufacturing supply chain that SEMI represents. Automotive Logistics: What percentage of semiconductors manufactured for use by US-based companies are for automotive applications and how has this grown in recent years? Weiss: A little over 10% of semiconductors produced worldwide are sold into the automotive segment, but this number is expected to grow at an accelerated pace in the next few years as electrification, connectivity and autonomous driving become more prevalent. Automotive Logistics: How is SEMI working to help the automotive industry get a clearer view of sub-component supply and better manage supply chain risk? Weiss: The SEMI Smart Mobility initiative is designed to engage automotive OEMs, tier ones, semiconductor device makers, design houses, and equipment and materials companies to drive alignment across the supply chain and address shared challenges collectively. To facilitate this engagement, we created the Global Automotive Advisory Council (GAAC), which has active chapters in Europe, US, China, Japan and Taiwan. The GAAC provides an open platform for creating solutions, fostering collaboration and partnering with other industry bodies to accelerate and harmonize industry efforts that benefit the entire ecosystem. Volkswagen and Audi are already SEMI members – both are founding members of the GAAC Europe chapter – and have become vocal champions and critical contributors to our efforts. When all stakeholders work together, I have no doubt that the future of automotive and mobility will continue to be bright. Interested in learning more about this topic? Read the full interview in Automotive Logistics Magazine, A Fab Future for the Automotive Sector. Please contact me at [email protected] for more information about SEMI’s Smart Mobility Initiative, the Global Automotive Advisory Council, and how SEMI can help your organization navigate electronics in the automotive industry to drive innovation in the mobility space. Bettina Weiss is Chief of Staff and Global Smart Mobility Lead at SEMI.

Electric mobility, renewable energy and other technology innovations like IoT, 5G, smart manufacturing and robotics all require reliability, efficiency, and compact power systems, fueling the adoption of Silicon Carbide (SiC) and Gallium Nitride (GaN) to support lower voltages in significantly smaller devices. But chip designers must overcome the technological and economical challenges of integrating the two semiconductor materials into power systems.SEMI spoke with Elisabeth Brandl, Business Development Manager at EV Group about trends and new developments within the power electronics industry and the devices' application in smart mobility. Brandl shared her views ahead of her presentation at the SEMI SMART Mobility Forum, 18 February, as part of the SEMI Technology Unites Global Summit, 15-19 February 2021, online event. Join us to meet experts from EV Group and other key industry influencers. Registration is open. SEMI: What is driving new developments in power electronics?Brandl: Globally there are significant changes in infrastructure requirements for communication, automotive and power conversion. We need to look no further than the rising adoption of 5G, electric and hybrid vehicles, and renewable energy as examples of drivers of these changes. The device level, particularly in the field of power electronics, figures prominently in these shifts.The power electronics industry faces a growing number of scenarios where conventional silicon power devices are no longer suitable and are easily outperformed by new architectures mainly based on wide bandgap semiconductor materials like Silicon Carbide (SiC) and Gallium Nitride (GaN).SEMI: What industry challenges is power electronics innovation aiming to solve? Brandl: Power conversion efficiency is very important and needs further improvement as the related losses significantly contribute to the overall power consumption. For green power and a better environmental footprint, renewable energy is crucial, but so is overall power-consumption efficiency, yet the role of power devices is often underestimated. High-frequency and high-power applications, such as data center applications and inverters for renewable energy, where silicon power electronics are reaching their limits, are also important areas in power electronics.SEMI: How will the transition from silicon to compound semiconductor materials help?Brandl: The superior material properties of several compound semiconductors can tackle the need for lower losses in power conversion or better high-frequency behavior. Today, we mainly talk about GaN and SiC power devices as they are materials well-suited to address these needs. However, other materials like diamond and gallium oxide are in development for these applications. Material properties of SiC that enable thinner materials with lower power losses and better thermal behavior address power conversion efficiency as well as form factor challenges. GaN, especially in a high electron mobility transistor (HEMT), can be used for high-frequency applications.SEMI: What enables a better and more cost-effective manufacturability of SiC and GaN power devices?Brandl: For the end customer, a typical figure of merit regarding the cost effectiveness is $ per Ampere or Watt. While this seems simple, the reality is of course more complex. It is important to understand the main cost contributors within the manufacturing area. For SiC, this is clearly the substrate cost. In my presentation, I will show a way to reduce this cost via wafer bonding. For GaN, epitaxy – a method for growing or depositing mono crystalline films on a substrate – is the critical parameter. And of course, yield has a very big impact on cost effectiveness too, which means that good process control including metrology is very important.SEMI: Many semiconductor companies are already transitioning to silicon carbide and gallium nitride. Can you give us an example of a success story?Brandl: All the big power device manufacturers have either acquired or developed their SiC and/or GaN power device technology, so they also see a bright future for these wide bandgap semiconductors in the power device market. The most prominent success story is STMicroelectronics with its SiC MOSFET power devices, which have been implemented by Tesla in its Model 3 vehicles since 2018.SEMI: What is coming next?Brandl: New materials for power devices are being explored, such as diamond and gallium oxide. For SiC, the trend is moving toward 8-inch substrates, which is the focus of the funded EU project REACTION under the coordination of STMicroelectronics. Cost reduction and substrate availability also play a big role. All major power device manufacturers have contracts to secure the supply chain for SiC substrates because material availability is the main uncertainty at this time. Finally, collaborations along the supply chain are crucial and generally beneficial for all parties, as development requirements are better communicated and prioritized.Elisabeth Brandl is Business Development Manager at EV Group. She received her master in technical physics from the Johannes Kepler University Linz, Austria in Semiconductor and Solid State Physics. Since 2014, she has been responsible for Product Marketing Management for temporary bonding and compound semiconductors at EVG. The SMART Mobility Forum is the digital platform of SEMI Europe’s Global Automotive Advisory Council (GAAC) for industry stakeholders along the automotive and electronics value chains, from Design, Semiconductor Equipment and Materials Suppliers to Automotive OEMs.Smart Mobility is one of four SEMI initiatives focused on building communities, content, and activities around critical and emerging electronics markets. Read more about our Regional Chapters.Serena Brischetto is senior manager of Marketing and Communications at SEMI Europe.

Japan’s semiconductor industry has weathered the COVID-19 pandemic to post robust growth. Far from a temporary setback, COVID-19 will lead to enduring change in how we work and live. And just as automation has been a bulwark against the devastating business impacts of the virus outbreak, increasing digitization will lead to new efficiencies in our industry.These were some of the key takeaways from three SEMI Japan Members Day webinars in June and July that offered the latest updates on COVID-19 impacts to the semiconductor industry and restart strategies for SEMI members. More than 2,000 SEMI members across Japan’s islands attended the webinars featuring the following five speakers: Hideki Kanewaka, Marketing Director, Consulting Lead, Japan, Accenture Japan Ltd. Takayuki Komori, Manager, Marketing Engineering Dept, SUMCO Corporation Taketoshi Hamaguchi, Director, Manufacturing Industry, Microsoft Corporation Akira Minamikawa, Senior Consulting Director, OMDIA (Informa Intelligence LCC) Yuichi Koshiba, Managing Director Partner, Boston Consulting Group COVID-19 Impact on Japan Semiconductor Industry is ModestThe consensus view of the five speakers from various quarters of the industry – consultant, IT service provider, materials supplier, market analyst – was that the Japan semiconductor industry withstood the heavy blows COVID-19 dealt to other industries thanks to strong demand for chips. Shelter-in-place policies and lockdowns spawned by COVID-19 has accelerated the digital transformation rippling around the world as electronics sales have soared to support everything from remote work and education to healthcare and home entertainment including gaming.The rapid growth of cloud usage for video streaming, gaming and remote work is taxing communications network capacity and placing more bandwidth demands on servers, said Akira Minamikawa of OMDIA. According to a recent report by Nokia, communications network traffic has skyrocketed 300 percent for online meetings and 400 percent for gaming, bringing the networks closer to their capacity limits. Minamikawa sees server shipments increasing at 8 percent CAGR through 2024. For the broader chip market, he expects demand for notebooks, solid state and hard disk drives, and gaming to remain strong in 2020. He also predicts rapid 5G penetration for smartphones will boost semiconductor chip industry growth.Still, not all semiconductor segments are expanding, said Yuichi Koshiba of Boston Consulting Group. Chip shipments for end products in markets such as automotive, industrial equipment and aircrafts are on the decline. Slowing demand for chips that power automotive applications in particular could pare sales for some chip companies and distributors since the segment accounts for a high proportion of their overall revenue.State of the Semiconductor IndustryFrom SUMCO’s vantagepoint as a major silicon wafer supplier, the company’s Takayuki Komori sees a number of changes unfolding in the semiconductor industry: Smartphones are driving growing demand for process technology (smaller nodes) and 300mm wafers. Komori estimates the typical high-end smartphone sports 1,700 square millimeters of silicon. 300mm wafers account for 80 percent of that total while more than 50 percent of the devices use leading edge multi-patterning technologies. Smartphones will need more RF chips to support 5G’s high-speed communications and added frequency ranges. Substrates for RF switches and tuners have been shifting from gallium arsenide (GaAs) and other compound semiconductors to silicon. 5G smartphone penetration will accelerate as the cost of integrating CPUs and modem functions into a single chip sees a swift decline. While the sensitivity and resolution of CMOS image sensors have evolved to incorporate innovative backside illumination and stacking technologies, future advances will focus more on products for machine vision applications capable of sensing invisible light bands. Rising adoption of electric vehicles and robotics applications will drive growing demand for power semiconductors that control their motors such as IGBTs and MOSFETs as the production capacity for the devices expands and shifts to 300mm wafer lines. For memory fabs, Minamikawa said utilization remains high as a result of a spending slowdown by major chip manufacturers and will stay elevated even once additional capacity ramps to support robust demand. Foundry fab utilization also remains high despite the pandemic-driven cancellation of smartphone chip orders in March. Minamikawa also sees the utilization rate of micro rising with the surge in demand for notebooks, PCs and servers in the second half of 2020.Transition to New NormalAs people around the world start to settle into new ways of living and working, there’s a growing acceptance that the transformation will be long-lasting. And no area of people’s lives is changing more than their work. Boosted by government subsidies, many small and midsize companies in Japan have started to implement work-from-home policies, an area where major electronics and IT businesses had already instituted reforms, said Hideki Kanewaka of Accenture. A few examples: Nippon Telegraph and Telephone Corporation (NTT) announced that half of its employees will continue to work from home in the future. A five-year plan Toshiba launched in 2019 to allow all employees to work from home will likely accelerate. Hitachi plans to allow all employees to work from home starting in April 2021. dwango, a major internet-based entertainment company in Japan, announced it will allow in principle any employees to work remotely. In the critical area of remote sales, Kanewaka pointed to the importance of going beyond online business meetings, paperless transactions and virtual events to devise new ways to attract customers and close deals. Creating online communities and providing rich digital content are also important measures to consider, he said.Manufacturing's Digital TransformationTravel restrictions by most countries to curb the COVID-19 outbreak have also raised barriers to chip companies sending engineers overseas sites to service state-of-art equipment and provide other technical support. Microsoft’s remote assist system deployed by ASML is one tool semiconductor makers can use to overcome this challenge, said Taketoshi Hamaguchi of Microsoft.The system connects a remote equipment service expert with an onsite worker through the internet, allowing the technical expert to provide support through a goggle display with a camera worn by the worker. Guided by the expert, the worker can perform complex services. A Natural User Interface (NUI) helps give the factory worker a clear understanding of the often highly technical instructions.Using artificial intelligence (AI) to increase automation will also help reduce the reliance of semiconductor factories on onsite workers. For example, AI deep learning can be deployed to calibrate equipment autonomously and reduce downtime after scheduled maintenances, Hamaguchi said.Corporate Restart Strategies Beyond factory considerations tied to COVID-19, semiconductor companies will need to adapt their business strategies to new ways of operating. For example, global supply chains will shift to domestic sources and increase redundancy to ensure a steady supply, a change leading to higher overall costs, Koshiba said. Trade routes among regions will also be redrawn as the trade rift between the United States and China and other geopolitical tensions intensify. The total value of those routes is expected to recover by 2023.Koshiba advised companies to evaluate the supply chain trade-offs between stability and cost and factor in potential risks to improve their short-term resilience and drive mid- to long-term supply chain restructuring.After past recessions, 14 percent of companies restored sales growth, Koshiba said. He recommended investing aggressively in growth and seizing M A opportunities during the downturn. Chip companies must also adapt to supply chain changes faster than competitors.Become a SEMI MemberWebinars like the recent SEMI Japan Members Day series have become increasingly important in the mix of programs and services SEMI offers members to help them connect, collaborate and innovate in the microelectronics community. To become a SEMI member, please visit the SEMI website or contact your nearest SEMI office.Jim Hamajima is president of SEMI Japan.

As the amount of electronics in automobiles continues to increase, it is becoming more common to hear a vehicle referred to as a “computer on wheels.” To that end, innovation occurs at the intersection of automotive and microelectronics so that leveraging synergies and contemplating joint initiatives becomes crucial in shaping the future of both fields. In this two-part article, we will discuss the current trends in the automotive industry, which are to a large extent driven by microelectronics, and will reflect on the transition from “just the vehicle” to “the mobility ecosystem.”SEMI encourages its members to partner in seizing opportunities in safe, efficient, and convenient mobility solutions. Before diving into specific opportunities that the automotive industry offers to electronics companies, we will start by taking a closer look at this sector and the current trends.Automotive or Mobility? Shaping the New EcosystemThe automotive industry and its supply chain of vehicle manufacturers and component suppliers has been evolving for decades around the sales of vehicles. The customer groups used to be fairly well established with individual consumers and commercial entities, the latter often as fleets. The automotive industry has grown in depth by vertically integrating design, manufacturing, sales, service, accessories, etc. More recently, the traditional players have also begun to venture into mobility services such as car sharing, showing their ambitions to become “mobility providers.”The term “mobility” has been used increasingly instead of “automotive” for about a decade now. This reflects the more recent transition to creating businesses and functionalities around the sales of miles. In line with this, the industry’s perspective is also shifting toward use-cases and experience rather than just focusing on the vehicle or plain transportation. Much of this transition from “vehicles to miles” is driven by key trends that require massive use of microelectronics, in particular autonomous driving and electric vehicles.One of the key questions to raise for SEMI members is: at which stages should the supply chains for the microelectronics and mobility industries interact with one another to shape the evolving ecosystem? In order to answer this question, we will examine the four main trends shaping the future of mobility represented in the acronym “ACES”: Autonomous, Connected, Electric, Shared.ACES – Autonomous, Connected, Electric, SharedThese four trends, together with the broader transition from “vehicle to miles,” also include newcomers “disrupting” the industry and changing it for good. Basically, every mobility player, traditional or new, is taking ACES (or CASE) into consideration at the moment.Autonomy: computers are taking over the task of driving from humans, first through advanced driver assistance systems (ADAS) and then at some point with complete self-driving. Following the levels of automation from zero to five, as defined by SAE International[1], the current market frontier is SAE Level 2, which means the vehicle can under certain situations (e.g. highway) drive itself but has to be monitored by the driver at all times. Many industry experts assume that artificial intelligence and computing power hold the key to higher levels of automation.Connectivity: vehicles are increasingly exchanging data with a central hub and with one another through cellular, WiFi, satellite, etc. At present, there are mostly entertainment and convenience offerings on the market, but maintenance and safety functionalities are emerging. One key differentiation between solutions is whether connectivity is “built-in” with embedded OEM solutions, “brought-in” (e.g. smartphone apps independent of vehicle or dashboard navigation systems), or “tethered” (e.g. smartphone used as communication gateway).Electrification: traditional mechanical and fossil-fuel-powered vehicle driveline components are increasingly being replaced by electrical components. The spectrum includes hybrid electric vehicles (HEV), plug-in HEV (PHEV), battery-based electric vehicles (EV), and hydrogen fuel-cell vehicles (FCV). The transition from traditional to electrified driveline technology requires more and more diverse electronics, such as more control systems, sensors and high-voltage systems. Ultimately though, the transition requires fewer systems, i.e. ignition, injection and multiple other systems being replaced by high-voltage power electronics and battery monitoring.Sharing: a growing number of consumers are seeking convenient access to mobility to get “from A to B” while viewing vehicle ownership as a burden rather than a benefit. Typical forms of this trend include car-sharing, ride-sharing, ride-hailing, micro-mobility, and micro-transit. Mobile computing enables much of the convenience that shared mobility offers, such as instant access, competitive and convenient payments, and flexible work opportunities (i.e. “gig economy”). Therefore, electronics, connectivity, and computing all play an important role in this trend.SEMI as the Natural Convener for Industry Exchange and ProgressClearly, for all four of the ACES trends, microelectronics play a crucial role in driving mobility innovation and making future solutions safe, efficient, and convenient. Based on this, mobility represents one of the largest opportunities for semiconductors: by 2025[2], a projected 14% of all integrated circuits produced globally will go into vehicles. As the trade association representing the complete microelectronics manufacturing and design supply chain, SEMI is positioned as a natural convener of experts for cross-industry and pre-competitive exchanges with the automotive supply chain. This positioning led to the foundation of the Smart Mobility initiative at SEMI, in part, to facilitate collaboration across these increasingly interdependent supply chains. The second part of this blog will present opportunities for electronics based on the ACES trends in the automotive industry, along with an overview of the Smart Mobility initiative.[1] © SAE International from SAE J3016™ Taxonomy and Definitions for Terms Related to Driving Automation Systems for On-Road Motor Vehicles (2018-06-05), https://www.sae.org/standards/content/j3016_201806/ (retrieved 05/5/2020)[2] Source: IC InsightsMicroelectronics Power the Future of Mobility – Part 2: Opportunities for ElectronicsBettina Weiss is Chief of Staff and Global Smart Mobility Lead at SEMI. Sven Beiker is Smart Mobility Consultant at SEMI.

In the future, electronics-related gear including advanced driver-assistance systems (ADAS) will account for a whopping 50 percent of automotive costs. More importantly, with more control of vehicles shifting to automation, the margin of error in component performance and reliability will become vanishingly small as zero defects become the new safety standard.SEMI spoke with Antoine Amade, Senior Regional Director EMEA, Entegris about zero defects as a new collaborative approach necessary to shape the car of the future and the automotive industry.SEMI: The next generation of automobiles will be more electric, autonomous and connected. What is the most pressing next step for automotive players to pursue this goal? Amade: The automotive ecosystem faces many challenges. For example, when cars become autonomous, their interaction with the cloud and the massive amount of data computed simultaneously could be vulnerable to cyberattacks capable of seizing control of the vehicle.Another example is the use of artificial intelligence (AI) as there is a big opportunity to explore and define the right architecture while also meeting automotive quality requirements. The quality challenge will be amplified by advanced nodes. Reliability is also critical since 90 percent of device failures are extrinsic, or unrelated to device design. Today, the top priority should be to eliminate latent defects, those that remain undetected until the product is in use. These latent defects may appear at some future point in the life of vehicle – 1 month, 1 year, 10 years, etc. This is the vital focus of the carmaker and the supply chain.SEMI: With in-line metrology tools reaching their detection limits, how will the industry reduce latent defects? Amade: Minimizing latent defects is now a top priority in semiconductor fabs. However, there is a gap between visible and non-visible defects. Although fabs can detect small defects, human intervention is still needed to manage them. We are witnessing a fundamental shift in the contamination control strategy in auto chip production, from contamination control for yield to contamination control for reliability. The shift is born of the recognition that all particles, regardless of size, and parts per trillion (ppt) concentration levels of contaminants matter, impact both defectivity and reliability. Contamination management will play a key role in enabling the industry to reach parts per billion (ppb) failure rates at the component level. SEMI: How will the industry reach the goal of zero defects? Amade: A sound contamination management strategy that follows three main axes of actions will be one key to reaching zero defects: the ambient air in the fab, the wafer’s environment over its lifetime, and the integrity of the materials in the clean chemical delivery pathway.Contamination management in each of these three areas presents opportunities to limit process variability. The first step in limiting variation is detecting it, which can be difficult when the contaminants causing the variation are hard to identify or caused by an unexpected event. When a contaminant signature can be detected, it leaves clues to its root cause. Careful scrutiny of these signatures can inform a contamination control strategy to eliminate the root cause and reduce overall defectivity.SEMI: What collaborative engagement model do you see as the best for reaching zero defects? Amade: Entegris sees the SEMI Global Advisory Automotive Council (GAAC) as the perfect collaboration platform for the entire automotive semiconductor ecosystem, from car manufacturers to material suppliers. Entegris is also a member of the Platform for Automotive Semiconductor Requirement Across the Supply Chain (PASRASC). Both forums help raise the visibility of key challenges and potential solutions.Collaboration starts with agreement on a definition of automotive based on existing standards and guidelines that must be communicated across the value chain. Another important element for collaboration is standardizing on how new materials such as SiC Semiconductors (silicon carbide) should be used. Entegris plays a leading role in contamination management for defectivity reduction through its New Collaborative Approach (NCA) platform, which brings a new level of knowledge sharing to all those involved in detecting and improving defectivity.SEMI: Can you explain the New Collaborative Approach in more detail?Amade: During the SEMI Smart Transportation Forum at SEMICON Europa, we presented the process and tools we have been developing in collaboration with car makers and are implementing with chipmakers as part of our New Collaborative Approach. Our data-driven tools compare current contamination solutions practices and identify optimization opportunities. A good indicator of the maturity of the ecosystem, the tools allow chipmakers to compare the contamination mitigation practices of peers with their own and identify hot topics for advancing contamination management strategies. Every year, during Entegris Technology Days, we share best known methods, case studies, and review fab processes in order to propose customized solutions. It is all about improving defectivity.Mr. Amade joined Entegris in 1995 as an Application Engineer in its semiconductor business. In his current role as EMEA/NA Sr. Director, Mr. Amade is focused primary on growing the semiconductor business in Europe and Middle East through market strategies, and the management of sales, customer service, and marketing teams. Mr. Amade held leadership positions at Entegris in functions including gas microcontamination market management, strategic account management, and regional sales management. Mr. Amade has a degree in Chemical Engineering from ENS Chimie Lille and is a member of the SEMI Electronic Materials Group and the Global Automotive Advisory Council for Europe (GAAC).Serena Brischetto is a marketing and communications manager at SEMI Europe.

Sapphire is a precious gemstone, consisting of aluminum oxide (α-Al2O3) with occasional traces of other elements such as iron, titanium, chromium, vanadium or magnesium. While sapphire stones found in nature mostly go to jewelry applications, the lab-grown sapphire – produced in a scale of up to several hundred tons per year – is widely used by the electronic industry. Now one can hardly find a branch of technology where this crystal is not used.Sapphires are mainly applied in infrared optical components, high-durability windows, wristwatch crystals, and the very thin electronic wafers used as the insulating substrates of solid-state electronics. High thermal conductivity, low reactivity, and appropriate unit cell size make sapphire an ideal material for a wide range of such electronic substrates for manufacturing of components such as LEDs and CMOS chips.SEMI spoke with Ivan Orlov, CEO of Scientific Visual, after his presentation at SEMI Strategic Materials Conference at SEMICON Europa, 12-15 November, 2019 in Munich, Germany, to learn more about the future of sapphire.SEMI: Why is sapphire an ideal material for a wide range of electronic substrates? Orlov: Sapphire undoubted advantages are its chemical inertness and ability to withstand high temperature, radiation and mechanical loads. In addition, it exhibits low dielectric loss and very good electrical insulation that makes sapphire a good candidate for substrates for LEDs and laser diodes or wafers for epitaxial growth. However, the most important advantage is that sapphire crystal lattice does very well matching semiconductor materials deposited to its surface, in particular nitrides of group III elements. To plainly benefit from these features, the grown sapphire must have as few macro- and micro-defects as possible, as substrate defects are inherited by semiconductors layers grown on the substrate surface. Hence the importance to detect defects in the raw sapphire material. This is the area where our team at Scientific Visual contributes. SEMI: Flaws are usually identified only after costly wafering and polishing steps, because rough surface of raw crystals prevents detection of the defects. What can be done to prevent defects?Orlov: Today, major players are investing in growing larger crystals without mastering in depth the growth process. Let’s face it, the semiconductor substrate industry, which is primarily based in Asia, is using empirical research methods. The raw sapphire boules are still inspected manually, and this qualitative assessment is exploited in two folds. The first step is to further process the boule. Furnace operators then adjust the growing parameters depending on the results of the manual inspection.Due to the lack of visibility into internal crystal defects, the crystal growth and its downstream processing remain an art rather than a science. The primary reasons are the difficulty to measure, locate and quantify precisely the defects in the full crystal volume. Scientific Visual equipment enables defects in raw boules to be fully quantified and categorized. With such objective measurements and knowing the full set of growth parameters, the Process Engineering (PE) team can, with the assistance of deep learning algorithms, considerably improve the growing process. Our quality control tools give Process Engineering team the “eyes” to see complete defect distribution in raw crystals, enabling it to make minor modifications in the growth process to improve yields, reduce costs and shorten the time to market for products.SEMI: What lead to those advancements and what problems did your team set out to solve? Orlov: Breakthroughs in immersion tomography, machine vision and parallel computing drove advancements in automated quality control technology. Previously crystal inspection accuracy was limited by the acuity of the operator’s eye and subjective bias. Light distortion and the diffusion of crystals made it impossible to accurately identify internal defects.Scientific Visual equipment give operators an undistorted 3D view of all defects in a crystal boule or ingot. However, only deep learning technology can correlate a hundred thousand growth data points to identify a final defect pattern.Defect pattern in non-processed item cored from EFG sapphire plate. Well visible is a typical wavy pattern of surface layers and sandwich structure in the volume. Color code marks sapphire defect density: from deep blue (non-defective material) to deep red (highest defectiveness.) SEMI: What challenges are addressed by your approach? Orlov: Increasing the yield of semiconductor substrates like Sapphire, Gallium Nitride and Silicon Carbide is paramount to reducing the price of wafers while increasing their quality. The upstream growth and downstream wafering processes are not deterministic. So far, most of the producers can only determine the quality during the late stages of the process. This condition creates huge constraints for teams in charge of production and processing. Automated Quality Control (QC) at the early stage of the production chain relieves all the unknowns, ultimately reduce the cost of material.SEMI: And what are the main opportunities?Orlov: There are massive opportunities to increase the yield and to ease the full processing chain from growth to the wafering process. Objective Quality Control (OQC) paves the way to industry-wide standards that categorize crystal quality at each step of growth to enable full certification of the defectiveness of the material and facilitate its trade and exchange.SEMI: What’s one of your predictions for the future of new materials?Orlov: The explosion of e-mobility and electric vehicles and the development of other green technologies will drive rising demand for low-defect sapphire, silicon carbide and gallium nitride substrates thanks to the streamlining of the full processing chain. Manual quality control will soon give way to full automation as quality control in sapphire and other raw crystals production is the only missing link in a fully automated semiconductor production chain. I believe that in five years, automated raw crystal inspection will become standard in the industry. Our mission is to empower every crystal grower to achieve this important milestone.Dr. Ivan Orlov obtained a Ph.D. in Crystallography from the Federal University of Technology in Switzerland EPFL and an MSc in Solid-State Physics in Moscow, Russia. Ivan co-founded Scientific Visual in 2010 to answer the challenge of the synthetic crystals industry struggling with high defect yield. Prior to this he worked in a company specialized in diamond optics. He has more than 10 years of experience in R D with focus on optical materials, industrial crystals and non-destructive quality control technologies. Dr. Orlov was a SEMI Task Force member for sapphire standard development in China and collaborates with ISO committee in Switzerland to establish industry-wide sapphire quality standards.Serena Brischetto is senior marketing and communications manager at SEMI Europe.

The microelectronics industry is entering the era of Cloud Engineering Simulation to slash the costs and risks of new technology development and speed time-to-market in spaces like semiconductors, MEMS sensors, RF front ends, biomedical and driverless cars. In the run-up to SEMICON Europa, 12-15 November, 2019, in Munich, Germany, SEMI spoke with Ian Campbell, CEO of OnScale, about the new paradigm of Cloud Engineering Simulation. Campbell shared his views ahead of the SMART Design Forum, 14 November, 2019, 14:30 to 17:00, in Hall B1, TechARENA 1 at SEMICON Europa. Registration is open. Join the forum to meet experts from OnScale and other key industry influencers. Attendance is free of charge for all SEMICON Europa visitors.SEMI: How did your adventure with OnScale start?Campbell: I’m an engineer. When I was still in high school, I took a night class at Nashville Tech to learn AutoCAD R14, and I’ve been designing and engineering things ever since. I was introduced to Desktop Simulation in my bachelors of mechanical engineering program and used many types of simulation tools for massive design studies at the Aerospace Systems Design Lab at Georgia Tech. I’m a simulation junkie.I started my first Silicon Valley high-tech company, NextInput, in 2012 with Dr. Ryan Diestelhorst (now VP of Strategy at OnScale), to commercialize new ForceTouch and 3D Touch technologies based on our patented MEMS force sensors. At NextInput, we bought hundreds of thousands of dollars of engineering software, but were always frustrated by slow, inaccurate engineering simulation results. We dreamed about running massive simulations on Cloud Supercomputers and creating true Digital Prototypes that could replace costly, time-consuming, and risky physical prototypes.When I got the chance to join the team that became OnScale in 2017, I jumped at the opportunity. At OnScale, we took engineering simulation solvers that had been developed for the U.S. military to run on U.S. Department of Defense and DARPA supercomputers and built a cloud supercomputer platform on Amazon Web Services to run the solvers. The net-net is the world’s first on-demand, infinitely scalable Cloud Engineering Simulation platform. Now, we routinely run massive multi-billion degree of freedom simulations for Fortune 100 companies, including many from the semiconductor and MEMS industries. Since our business model is to charge per core-hour for simulations, the incredible capability we built is cost-effective and available to small startups as well. SEMI: How is the semiconductor design ecosystem evolving? How is Cloud Engineering Simulation applied to semiconductor and design industries?Campbell: The entire industry is experiencing a massive acceleration in product launch cycles and increased competition. New markets like IoT and 5G are reducing semi/MEMS product cycles from years to months. That, in turn, puts enormous pressure on semiconductor and MEMS designers. Missing a key product introduction like a flagship smartphone launch can literally make or break a company.A reliance on traditional engineering methods – schematic capture and layout of a chip, taping out (physically prototyping the chip), performing engineering validation on an e-bench, qualifying the chip (or not qualifying it and going back to the drawing board), and finally launching mass production – is no longer sustainable from a competitive perspective.Instead, market-leading firms are turning to Cloud Engineering Simulation and Digital Prototypes to explore massive design spaces, find optimum designs that beat the competition in every KPI (size, power, performance), and digitally qualify designs before ever cutting silicon, ensuring that designs are robust over their intended operating environments and performance envelopes. Large thermal analysis of a chip on a circuit board executed quickly on the OnScale Cloud Simulation Platform SEMI: Can you give us an example? Campbell: A great example is thermal analysis. Thermal effects have always had huge impacts on MEMS device performance and, more recently, they are beginning to impact performance of next-gen semiconductors, especially GaN power electronics for electric vehicles (EVs).Conducting a full system-level thermal analysis of something like an EV power management system – a power IC in a package, on a board, in an enclosure, under various loading conditions – has been a challenge from a simulation complexity perspective (degrees of freedom) and from a parametric sweep perspective (running hundreds or thousands of simulations to optimize chip placement, routing, etc.). To run these sets of simulations using legacy desktop simulation would take weeks, perhaps even a month or more. To run these massive simulations in parallel on cloud supercomputers using OnScale takes days or even hours.Our customers routinely run very large simulation studies on OnScale Cloud for thermal simulations, RF filter simulations, MEMS simulations, packaging simulations (what we call Digital Qualification), and many more use cases.SEMI: What’s one of your strategic objectives for 2020? Campbell: For 2020, we’re doubling down on MEMS and semi simulation capabilities. We will be launching additional solver capabilities like EM that will be critical in our strategic markets like 5G. We will also be launching a Cloud API so that engineers can integrate OnScale directly into their existing engineering workflows (e.g. MATLAB or EDA/CAD tools) with just a few Python commands.SEMI: Can you share one prediction for the future of semiconductor design solutions? share?Campbell: I think we will continue to see MEMS and semi designers push the envelope and bring smaller, more performant, more cost-effective solutions to market. I’d like to see more highly cost-effective flexible semi/MEMS designs come to market to enable next-gen IoT and IIoT applications. I’d also like to see more biomedical applications – biomems, microfluidics, and labs on a chip for all sorts of life-enhancing applications.SEMI: What are your expectations regarding the SMART Design Forum at SEMICON Europa 2019 in Munich? Campbell: I’m looking forward to getting back to my roots in MEMS/semi design and chatting with other designers about the future of engineering and the future of semi! Ian Campbell is a twice venture-backed Silicon Valley CEO and expert in MEMS sensors, semiconductor technology, and engineering software. Most recently, Ian co-founded OnScale, a Cloud Engineering Simulation startup backed by Intel Capital and Google’s Gradient Ventures. OnScale is revolutionizing engineering by combining world-class multiphysics solvers with Cloud supercomputers, machine learning, and artificial intelligence. Prior to co-founding OnScale, Campbell served as founder and CEO of NextInput, where he led the startup through multiple rounds of funding – totaling $12 million and an additional $4 million in research contracts with government and industry partners – and built a world-class team of engineers and scientists who developed 3D Touch and ForceTouch technologies for smartphones, wearables, industrial, and automotive interface applications. He also secured the first major smartphone OEM design wins in Asia. Campbell earned his B.S. in mechanical engineering from Middle Tennessee State University, and his MSAE in aerospace engineering and MBA from Georgia Institute of Technology.Serena Brischetto is senior manager, marketing and communications, at SEMI Europe.