Applied Materials

More than 400 students from disciplines including electrical and computer engineering, materials science, physics, and business registered for the inaugural Semiconductor Day at Ohio State University.

Coming in the wake of the COP27, the Smart and Green Manufacturing Summit at SEMICON Europa 2022 (Munich, 15-17 November) had a timely focus on the semiconductor industry’s contribution to meeting the United Nations’ target of limiting global warming to 1.5°C above pre-industrial levels.

Guido D’hert, High Tech and Semiconductor Industry Europe Lead at Accenture, spoke about challenges semiconductor companies face in meeting sustainability goals and how to apply analytics, new green technologies and circular design, sharing during his presentation at ISS Europe in Brussels, Belgium.

In this article, several experts weigh in on considerations for developing the smart manufacturing workforce that will help to alleviate the U.S. semiconductor manufacturing talent shortage, even as multiple, data-intensive $1 billion to $10 billion fabrication facilities come online.

The pandemic has taught us that diversity in the supply chain is more critical than ever. We need to be reliant on all resources available to us and seize opportunities where we can. With 2021 coming in hot with chip shortages across the world, there is a race to increase production yields despite traditional supply chains tapping out from a capacity standpoint. Solutions to these technology and supply chain problems require all hands-on deck including the smartest people in the world wherever, whoever, and however they are. Unfortunately, a quick look at the semiconductor supply chain reveals that for whatever reason, too many diverse owned suppliers are nowhere to be found. So, what does this mean for the semiconductor industry? It’s as if we’re working with one hand tied behind our back. Supplier DiversitySupplier Diversity is a strategy that drives the inclusion of diverse-owned businesses in the procurement of goods and services within an organization. Diverse groups vary globally in accordance with local laws but often include underrepresented groups such as women and local in-country minorities. Diverse companies are currently certified by being at least 51% owned, operated, and controlled by diverse individuals. Supplier diversity does not include lowering bidding standards or awarding business based on diversity status. Diversity done right increases ideas and competition.By diversifying the supply chain, we can expect to see an influx of innovation to improve our processes through competition. Diverse companies entering new markets bring unique perspectives and can often focus on R D problems large multinationals overlook. Engaging in the semiconductor industry allows local businesses to learn from what already exists in the market and offer new ideas that were not considered before. Furthermore, local businesses have more flexibility to create custom solutions for the process.New diverse suppliers also mean additional capacity to supplement the already taxed supply base. If your current suppliers are telling you they’re full, it might be time to branch out. Don’t assume that diverse suppliers are incapable of scale. There are many examples of multi-billion-dollar companies that are certified-diverse bringing world class scale, solutions, and capability to existing semiconductor supply chains. From one off prototyping to large scale manufacturing, diverse suppliers bring multiple skill sets. In addition to innovation and capacity building, expanding diverse suppliers has multiple other benefits to consider:Government tax and contract incentives exist for supply chains with certified diverse content2020 increased public awareness of diversity and Corporate Social Responsibility (CSR) initiatives. Expanding these programs is in line with stakeholder expectations.Flexibility of a privately held company with excellent customer service, often with less bureaucracy of a publicly traded companyTake ActionIf you’re seeing the gap between supply (chain) and demand, there’s plenty you can do about it. If you are a diverse owned company in an adjacent high precision manufacturing space, consider joining the semiconductor industry. You can reach out to your certifying NGO to find out more about our industry (SEMI is reaching out to them!).If you’re a company looking to cast a wider and more inclusive global net in your bidding process, you’ve got options as well. Start by making an intentional effort to start your own supplier diversity program. Scrub your existing supply chain and you may be surprised to find you’re already working with some high performing diverse suppliers. Maintain high standards and fair bidding while proactively including diverse suppliers in your opportunities – they can compete and win the business.The Manufacturing Ownership Diversity In 2018, SEMI members Applied Materials, Lam Research, TEL, and Intel approached SEMI with the idea of forming a special interest group that would work to increase the available diverse suppliers within the semiconductor industry. This led to the creation of the SEMI Manufacturing Ownership Diversity (MOD). The SEMI MOD working group is comprised of chip manufacturers, OEMs, component suppliers and NGOs working to develop a common standard to define supplier diversity within the industry and provide best practices. While all companies are welcome and needed to bring their best, we’d like to focus on the opportunities for diverse suppliers. An early participant is Heateflex, a minority owned business until 2019 which was brought onboard by Intel and Applied Materials.It’s time our industry takes a proactive approach to finding, inviting, and cultivating every able supply chain partner, including those that are diverse owned. We must make it clear that we are open for business to diverse companies – problem solvers needed! A more diverse supply chain will not only address the capacity issue, but it can also lead to improving innovation and cost savings, enable companies to qualify for new opportunities, and connect businesses with common corporate values.Our message is simple: Join us! The semiconductor industry is “open for business” and calling all diverse suppliers which bring a competitive advantage to the table. For more information about the MOD, visit us under the SEMI Foundation at the SEMI Manufacturing Ownership Diversity (MOD). The MOD is planning a virtual panel discussion on May 11, 2021 to introduce supplier diversity concepts and best practices in the semiconductor industry. Look for more information on the MOD web page.Beckett Tracy, Commercial Group Lead, Intel Corporation; Carlos D. Dones, Supply Chain Manager, Applied Materials, Inc.; Patricia Nhan, Marketing Coordinator, Heateflex by White Knight

The pandemic unleashed by the coronavirus SARS-CoV-2 (which causes the disease COVID-19) has infected over 100 million and resulted in over 2.6 million deaths worldwide as of March 2021. It is well-established that this virus primarily spreads from person-to-person via respiratory droplets produced when an infected person coughs, sneezes or even breathes (see Ref. 1-3). Subsequently, the droplets meet the eyes, or enter nose or mouth of a nearby person, or transmit when a person touches an infected surface, then contacts their eyes, nose, or mouth. Since the virus is small, 0.06–0.14 microns in diameter, many copies can be contained in or attached to emitted respiratory droplets. Droplets as small as one micron can carry enough viral load to cause an infection. A particular concern is the interaction of droplets with ventilation systems, which potentially could enhance the propagation of pathogens. This has implications on situation-specific safe distancing and the design of building filtration systems, air distribution, heating, air-conditioning and decontamination systems. A particular instance of this is the semiconductor manufacturing cleanroom, where systems and protocols are specifically designed to minimize contamination. The $440 billion global semiconductor industry depends on these cleanrooms for integrated circuits (chips), and in turn, these chips form the lifeblood of the multi-trillion-dollar global electronic systems industry. Electronic systems are now critical for just about every aspect of human life, including health, work, finances, entertainment, transportation, power grids and many others. Thus, it is critical to understand how cleanrooms can operate more safely to ensure the health of workers while maintaining productivity levels to meet increasing global demand for semiconductors. In the work described here, we analyzed particle and droplet transport via modeling, simulation [Refs 1-3], and experimentation [Ref. 4] to help guide the industry. Modeling and Simulation In this part of the work, mathematical models were developed to simulate the progressive time-evolution of the distribution of locations of particles produced by a cough. Analytical and numerical studies were undertaken. The models ascertain the range, distribution and settling time of the particles under the influence of gravity and drag from the surrounding air. Beyond qualitative trends that illustrate that large particles travel far and settle quickly – versus small particles that do not travel far and settle slowly (yet can be carried far by ambient flow) – the models provide quantitative results for distances travelled and settling times, which are needed for constructing social distancing policies and workplace protocols. Figure 1 shows examples of the results of the modeling and simulation work. Figure 1: Model of particle spreading from a person coughing, with and without a mask. (Ref. 1) Following are key insights from the modeling and simulation work (Ref. 1): Large particles travel far (launched “ballistically”) and settle quickly, while small particles do not travel far and settle slowly (when there are no ambient externally-driven flow fields). Small particles do not settle even by the end of the simulation time (4 seconds in Ref. 1). Accordingly, the simulations were also run for extremely long periods to ascertain that the “mist” of small particles remained airborne for several minutes (as predicted by the theory). For strong opposing headwind, small particles move backwards, yet still remain airborne for extended periods of time. This is by far the most dangerous case since this will encounter other persons at the torso level. Ratio of the general drag to gravity indicates that at high velocities, the dynamics are dominated by drag. For general cough conditions, there can be cases where the change in the surrounding fluid’s behavior, due to the motion of the particles and cough, may be important. One major implication of this work is that the challenge of infection must be addressed both spatially and temporally. In other words, it is necessary to maintain social distancing based on how far the virus travels, but it is also important to account for how long the virus stays at the location because of specific air patterns. On the positive side, understanding these spatio-temporal patterns accurately will enable companies to design (or re-design) ventilation and decontamination systems precisely to improve worker safety. Other aspects of this analysis entail contact tracing (Ref. 2) and decontamination (Ref. 3). Further details, including simulations, are available at https://msol.berkeley.edu/publications/. Experimentation The major vector of coronavirus spread is through respiratory droplets expelled when coughing, speaking, and breathing; and the efficacy of any safety measures depends on accurate characterization of the dispersal of these droplets. The term particle describes objects that begin their journey as a solid. The term droplet is reserved specifically for objects that are initially liquid, albeit it is important to note that droplets can evaporate and effectively transform into solid particles composed of non-evaporative material. A purpose-built room, the Cal Covid Cube, C3, was set up and utilized for this research [Thatcher et al. 4]. The C3 is a parallelepiped room that is 232 centimeters tall, 376 centimeters long and 284 centimeters wide on the inside. For experimental results to be meaningful and repeatable for scientific and practical purposes, it is essential that the experimental setup be carefully controlled and calibrated. The following precautions were taken to ensure this: Charge-free: When solid particles are released, it is critical to eliminate (or thoroughly know) static charge effects for obtaining accurate deposition patterns. Static charge effects can manifest through particle-particle interactions (affecting particle motion in flight) or particle-surface interaction (affecting deposition pattern). Two methods for the elimination of charge effects on the deposition surface were found to be effective: (1) ionized non-conductive adhesive sampling strips, and (2) grounded aluminum backed carbon sampling strips. Isothermal: The room is a converted walk-in freezer with 10.5-13 centimeter thermal insulation and located in the middle of a building, at least 5 meters away from all building walls. Temperature uniformity was checked and the C3 room temperatures were found to be isothermal within uncertainty of measurements. Quiescent: It was ensured that the room did not create uncontrolled thermal convection due to isothermal nature. Quiescence was verified with both hot-wire measurements and with free-falling particle drift observations. Isopotential: The outer and inner surfaces, including the door of the C3 were conductive aluminum and stainless steel, and copper tape were used to ensure reliable electrical connection of door, interior and exterior panels. Electric fields were surveyed and found to be negligible within precision of instruments. Other design elements: All interior surfaces were coated with black matte paint to reduce scattered light and provide uniform background for imaging measurements. The facility was located on ground floor to limit vibrations. Repeatable Launch: To emulate the release from a true cough or sneeze, and to better understand droplet motion in a canonical turbulent jet versus a cough type release, we studied different layers of complexity for the release geometry: (i) Straight round pipe (ii) Smooth 90-degree curved pipe, with a changing radius along the length of the pipe (iii) Intubation trainer doll, with realistic airways and mouth/tongue structure Figure 2 shows the experimental setup with the intubation doll in C3, with the particle/droplet release being measured after deposition on the sampling strips that appear green. Figure 2: Experimental Setup in C3 with both charge neutralized (white appearing green) and conductive (black) sampling strips placed on a conductive and grounded alignment grid [Ref. 4] We utilized both liquid droplets and solid particles. For droplets, we explored and found promise in a method of deposition analysis based on fluorescence. For particles, we explored many ways in which the smallest of thermal gradients or electrostatic charge issues can affect the data and developed practical methods to address these issues. For accurate measurement free of static charge effects even in environments where high ambient flow velocities may cause a nonconductive surface to rapidly acquire charge (e.g., clean room environment), we developed carbon-tape-based sampling strips that are cleanroom-compatible, conductive, and grounded. For analysis, we developed a cost-effective method utilizing a commercial photo negative scanner followed by image enhancement by blind deconvolution. Figure 3 shows sample results for particle deposition location along our centerline for particles in the ballistic, intermediate and aerosol regime. Figure 3: Experimental Results [Thatcher et al. 4] Following are key insights from experimental work: Significance of both static charge effects and thermal gradients in rooms for validation tests are more than usually appreciated. For modelling, accounting for the non-uniform initial particle velocity matters for the ballistic particles. For all sizes of particles, simulating the transient versus steady state significantly impacts predicted particle spread. Thermal plumes alone from humans along particle flight path can transport 50 micron particles across the room. In some situations, this was observed up to ~6 meters. There is a significant effect of Relative Humidity (RH) and temperature on droplet evaporation. The practical consequence is that, in low RH, particles spread further, with all other things being equal. (The reason is that particles shrunk more and entered the aerosol regime.) In summary, a systematic analysis of particle and droplet transport was conducted by simulation, modeling, and experimentation. We were able to develop robust, rigorous, and repeatable methodologies and draw meaningful insights that will support safer operation and productivity of semiconductor cleanrooms globally. Further, these studies will help with the design (or re-design) of ventilation and de-contamination systems that help protect both the health of humans and the economy from current and future pandemics. This article provides a high-level overview of the work, and further details will be available through a series of scientific papers that are in various phases of publication. We gratefully acknowledge the following support: Gift of the Lam Research Corporation Gifts coordinated through SEMI and provided by Advanced Energy Industries, Applied Materials, ASM, Entegris, JSR, KLA, TEL, and Wonik The 2020 Seed Fund Award from the Center for Information Technology Research in the Interest of Society (CITRIS) and the Banatao Institute at the University of California Vision Research for providing a v2640 camera to help quantify the particle velocities Graduate students Eric Thacher and Tvetene Carlson who conducted the experiments in C3 Valuable discussions with Brett Singer, Thomas Kirchstetter, Michael Sohn, Chelsea Preble of Lawrence Berkeley National Laboratory regarding droplet transport and COVID, and Keith Hansen on particle sampling and charge neutralization DOE Office of Science through the National Virtual Biotechnology Laboratory, a consortium of DOE national laboratories focused on response to COVID-19, with funding provided by the Coronavirus CARES Act Steven Ruzin and the Biological Imaging Facility for their assistance in obtaining the high-quality fluorescence microscopy scans to validate the particle counting methodology. References Zohdi, T.I. (2020) Modeling and simulation of the infection zone from a cough, Computational Mechanics. https://doi.org/10.1007/s00466-020-01875-5 Zohdi, T.I. (2020). An agent-based computational framework for simulation of global pandemic and social response on planet X, Computational Mechanics. https://doi.org/10.1007/s00466-020-01886-2 Zohdi, T.I. (2020) Rapid simulation of viral decontamination efficacy with UV irradiation. Computer Methods Appl. Mech. Eng. https://doi.org/10.1016/j.cma.2020.113216 Thatcher, E., Carlson, J., Castellini, J., Sohn, M.D., Variano, E. and Makiharju S.A. (2021) Droplet and Particle Methods to Investigate Turbulent Particle Laden Jets (in preparation) Authors Evan A. Variano, Professor, Environmental Engineering, UC Berkeley Simo Mäkiharju, Assistant Professor of Mechanical Engineering, UC Berkeley Tarek I. Zohdi, Will C. Hall Endowed Chair of the UCB Computational Data Science Engineering Program, Professor of Mechanical Engineering, UC Berkeley Pushkar P. Apte, Director of Strategic Initiatives, Center for Information Technology Research in the Interest of Society (CITRIS) and the Banatao Institute, UC Berkeley; and Strategic Technology Advisor, SEMI

AI vs. energy. Quantum for everyone. Biofabrication of human organs on a mass scale. Slowing advancements from Moore’s law.In the midst of a market dip, optimism reigned as keynote and AI Design Forum speakers addressed both looming challenges and explosive market opportunities during July 9-10 presentations at SEMICON West 2019 in San Francisco. SEMICON West again proved to be a magnet for visionaries who laid out the path to electronics innovation over the coming years.“The current business environment demands that the industry looks ahead toward issues that need attention sooner, not later – especially since we are approaching a once-in-a-generation inflection point that has the potential to be a $10 trillion opportunity,” observed SEMI Americas president Dave Anderson.Market forecasts punctuate the point: The microelectronics supply chain is on the verge of what has the potential to be the longest-lived electronics era.“Inflection points like this are rare, but not unprecedented,” Anderson added, citing 2007 as the inflection of the growth curve from new technologies that led to last year’s historic high semiconductor sales.SEMICON West squarely focused on the future, with a number of industry leaders noting that chip, tool and materials makers need to look beyond their immediate suppliers and customers in developing strategic partnerships. Dr. Cliff Young, data scientist with the Google Brain Team, for one, invited semiconductor and equipment firms to explore chip codesigning opportunities with his Google.The recently formed Quantum Economic Development Consortium – and its 50 members including Boeing, Google and IBM – debuted roadmapping activities devoted to the pursuit of U.S. leadership in the rapidly emerging global quantum computing industry. IBM’s Jeff Welser showcased the IBM Q Computer model built upon decades of semiconductor industry advances. Markets that could see staggering leaps from a quantum computational capacity include automotive, medical, financial and energy. Today, anyone can dabble with the future quantum computing capabilities by connecting online with IBM’s 16-qubit quantum computer. Dr. Aart de Geus, chairman and co-CEO of Synopsys, suggested that software and other programming tends to develop more quickly if it is open sourced. He recommends an open source model that allows semiconductor and equipment companies to work together in the cloud to speed chip development.Nate Baxter, TEL development and production group general manager, advocated sharing big data with competitors in pre-competitive spaces to ensure data quality, improve measurement and solve problems faster. The key is security. “Yes, we can share data while protecting it,” he said. “We’re quickly seeing opportunities that we didn’t know existed.”Gary Dickerson, Applied Materials president and CEO, said that embedding artificial intelligence (AI) in chips will drive significant long-term industry growth by processing far more big data computations much faster than humans can.That is, if there is enough electricity. Almost invisibly, AI-enabled machines already are crunching massive amounts of data while gulping power in the process. As AI use rapidly expands, current power grids will be stressed as never before. Dickerson added that speed of innovation, societal acceptance, security and safety will guide how well and quickly AI is adopted. A potential hurdle, however, is sustainability. He warned power constraints could be “very high” and a “barrier to AI adoption if we don’t drive innovation” in substantially reducing the power draw of power-hungry AI chips.Of the five members of a venture capitalist panel, four agreed that Moore’s Law as we knew it is dead. The promising news is that the average age of a first-time mobile phone user is 10, more than 40 percent of the world population is now under 25 and about to wield considerable market influence, and 5G is on the cusp of helping connect trillions of devices. AMD CEO Lisa Su noted “there’s a tremendous amount of innovation yet to come” from microarchitectural advances, chiplets and die stacking, and heterogenous platforms.And there’s nothing more innovative – or intriguing – than regenerating human organs in mass volume. Legendary inventor Dean Kamen laid out his well-funded plans to biofabricate the viscera of human existence but warned of two crucial missing pieces – scale and talent. “I’m here at SEMICON West to beg for high-tech’s help in getting artificial human organs out of labs and ramped up for volume manufacturing and widespread distribution,” Kamen said during his keynote. “The basic science already exists, but researchers can’t bring it to scale like Silicon Valley can.”The talent Kamen needs to fulfill his dream will come from the pool of skilled workers the microelectronics industry is feverishly working to recruit to make good on its own ambitions. As if on cue, SEMI endorsed Kamen’s FIRST Global program, establishing a united effort to encourage young people worldwide to pursue engineering careers. “Together, we can better help provide a path to success for generations to come,” SEMI’s Anderson said.Scott Stevens, SEMI

Would you buy your next hotdog in parts, from un-coordinated suppliers? For example: Get the bun from a baker, the sausage from a butcher, mustard and/or ketchup and veggies from the nearest supermarket? If yes, you may find the sausage being too small, the veggies too big for the bun, and, when you finally finished adding mustard/ketchup and start eating, you may “enjoy” a cold sausage on a soggy bun!This “hotdog example” is just a very simple way to highlight the advantages of a well-coordinated semiconductor supply chain. What may be a few dollars and cents wasted in this hotdog purchase, can become millions of dollars lost to delays and inefficiencies during the roll-out of a new electronic system.Complexity is Increasing the ChallengeThe very innovative semiconductor industry is continuing to develop more complete and complex building blocks for electronic system solutions, with the intent of making our customers’ lives easier. However, every new technology takes increasingly more time for technical and business interfaces to mature before all the semiconductor supply chain members can serve customers in a smooth, efficient and cost-effective manner. In particular, coordination between design and manufacturing has always turned out to be in the critical path.SEMI, the manufacturers’ trade organization, and the Electronic System Design (ESD) Alliance, representing electronic design automation (EDA) tools vendors, developers of intellectual property (IP = ready-made building blocks for ICs) and IC design service providers, both recognized these challenges. Late in 2018, these two industry organizations decided to jointly address this painful, costly and often a very frustrating, yet critical path and became Strategic Association Partners, The goal is to establish a well-coordinated semiconductor supply chain.To make the value propositions of this partnership highly visible and demonstrate the first joint accomplishments, SEMI’s well-known SEMICON West conference and, in its first year, ES Design West, will be conveniently co-located in San Francisco’s Moscone Center from July 9 to 11, 2019. The synchronized schedules and geographic proximity of these events not only outlines the multi-faceted interdependence of manufacturing and design but encourages and enables conference attendees to do, what previously would have been viewed as “forming cross-border relationships.” It’s a new word now — please join the path to success and expand your network!Navigating SEMICON West and ES Design WestJust in case you are not yet planning to come to San Francisco early July, please check the Agendas-at-a-Glance for SEMICON West and ES Design West, to see how broad and valuable these parallel conferences are for your business. In addition, every customer, partner and semiconductor industry supplier can, from July 9 –11, walk from one conference section to the other, arrange face-to-face meetings, in dedicated meeting rooms, with representatives from both camps and discuss, from the first project planning step to the final production ramp-up, the many topics that need to be coordinated across parts or the entire supply chain to minimize delays and/or cost over-runs.Who Will Lead the Discussions?Conference attendees can, in addition to meeting many important supply chain partners face-to-face, hear about the latest technologies and market trends from key executives in our industry. Featured speakers are: David Pellerin, Head of Global Business Development, Amazon Web Services Lisa Su, President, and CEO, AMD Gary Dickerson, President, and CEO, Applied Materials Laurent Le Faucheur, Principal Engineer, Digital Signal Processing and Machine Learning, Arm, Ltd. Renee St. Amant, Ph.D., Research Engineer in Emerging Technologies and US Innovator of the Year, ARM Dean Kamen, President DEKA Research Development, Founder First and First Global Jeffrey Welser, Ph.D., Vice President and Lab Director, IBM Research-Almaden Dean Drako, President and CEO, IC Manage, Inc. Oreste Donzella, Sr. VP Chief Marketing Officer, KLA Corporation Prakash Narain, President, and CEO, Real Intent, Inc. Aart de Geus, Chairman, and Co-CEO, Synopsys, Inc. Manish Pandy, Fellow, Synopsys, Inc. Nate Baxter, General Manager, Development and Production Group, TEL US Like in previous years, SEMICON West and ES Design West offer a range of special features, addressing Smart Manufacturing, Smart Transportation, Smart MedTech and Smart Workforce development in dedicated pavilions as well as an AI Design Forum. Also, the many exhibitors from both camps will give conference attendees convenient opportunities to get to know new supply chain partners and/or refresh long-term business relationships. Search for the exhibitors you want to meet early July here. Questions to Ask for a Well-Coordinated Semiconductor Supply ChainIf I may, I would like to ask my many friends in the manufacturing camp to spend some time in the ES Design West section and ask the exhibitors a few questions, like: What can you do to get me to profit faster? To reduce development and unit cost? To improve yield, product quality, and reliability? When can you visit my team to discuss how your company can contribute to our goals?Vice versa, I would like to encourage my friends in the design camp to spend time in the SEMICON West section and ask exhibitors what their companies offer. When talking to manufacturers of IC, passive components or circuit boards, assembly and test houses, please ask very specific questions like: How can we help you reduce iterations between you and your customers? How can we help to improve IC test programs? How can we increase the throughput of your manufacturing equipment? How can we apply machine learning (ML) and Artificial Intelligence (AI) to minimize equipment downtime, improve yields and/or shorten production ramp-up?I can assure you that you’ll not only win great friends “across the border” but will be very impressed by the expertise you’ll find in the other camp and the willingness for and benefits of cross-border cooperation.I look forward to meeting you at SEMICON West and ES Design West. Also, if your schedule allows, mark your calendars for the June 12 MEPTEC Luncheon at SEMI in Milpitas, June 18 for the GSA’s Silicon Summit in Santa Clara and June 25 to 27 for the IMAPS SiP Conference in Monterey, CA. Hope to see you at one or all of these important events!Article originally published in 3D InCites. Herb Reiter is president of eda 2 asic Consulting.

OSATs (outsourced assembly and test companies) currently handle the bulk of assembly and test activity for the worldwide semiconductor industry. These companies’ factories have a manual operation legacy: Decision-making is manual. Materials and WIP (work in process) movement is manual. Practically everything in these factories is done manually. In addition, OSAT factory environments typically present many physical constraints with respect to equipment layout, material carriers and storage. All of these constraints present challenges when trying to automate material handling in these factories. OSATs also operate with far smaller gross and operating profit margins than IDMs, yet the percentage of worldwide semiconductor product handled by OSATs is currently increasing from year to year while the IDM share is decreasing. The combination of increased business volume with lower margins encourages OSATs to automate their factories, but there are challenges that must be overcome. Technical challenges abound OSATs face many technical challenges when trying to automate production. First, installed legacy equipment in these factories is typically 25 to 30 years old. This older equipment was simply not designed to accommodate automated materials handlers. For example, access doors on older equipment make automated WIP delivery and pickup nearly impossible without significant modifications to the equipment. Second, these factories are not equipped with the infrastructure needed to support automation. To start with, most of this older equipment is not SECS/GEM compliant. (SECS/GEM is the semiconductor industry's standard equipment interface protocol for equipment-to-host data communications.) This capability must either be retrofitted to the existing equipment or some other means of extracting required data from the equipment – getting it from the PLCs controlling the equipment, for example – must be employed. Similarly, the WIP carriers currently in use – wafer carriers, trays, magazines, and the like – are not designed for automation. In contrast to the semiconductor wafer fab industry, it seems that almost every company in the OSAT domain has a different idea concerning what a carrier should look like. In particular, there’s no such thing as the standard 300mm FOUP (Front Opening Unified Pod), which carries wafers from one tool to the next inside of semiconductor fabs. The variations in carrier shapes, configurations, and even gripping handles in the OSAT domain thwarts progress in OSAT factory automation. How do you design a materials-handling robot with the grippers and flexibility needed to adapt to all of these different carriers? It’s a difficult question and an expensive proposition. OSAT facilities themselves are designed for human-based materials handling, not automated materials handling, simply because they were designed at a time when automation was not contemplated. As a result, the equipment in these facilities is packed very closely together (to reduce floor space costs), as shown in Figure 1. Figure 1: Equipment in a test facility is often tightly packed, which impedes the adoption of automated materials handling. It’s very difficult to add automated materials handling equipment at floor level or even at ceiling level in these OSAT factories, as is frequently done inside of a semiconductor wafer fab. You will not see AGVs (automated guided vehicles) moving around inside of legacy OSAT factories because there’s simply no room for them to move around. Tackling the challenges So, what can be done to handle these all of challenges? You must start by understanding the nature of the operations taking place inside of the factory. As stated above, most of these operations are currently performed manually. All of the decisions and the materials transport is performed by humans. There’s simply no way to transition from a fully manual operation to a fully automated operation in one jump. It’s too far a reach. A significant amount of work is needed just to reach the level where automated decision making is possible. Key systems must be added to enable this level of automation. Many companies tried and failed to automate assembly and test in OSAT facilities about 25 years ago. They failed because the required data could not be extracted from the equipment in use and, therefore, there was no data to drive good decision-making. Too many required systems were simply lacking. For example, when AGVs were added, one or two operators had to walk along with the AGV to tell it what to do. There was no benefit from the automation in this example. There was no successful path to automation at the time. Standards needed One of the major obstacles to automating assembly and test in OSAT facilities is a lack of standards for carriers, robotics, layout, and facilities. Many front-end standards exist. The SEMI-E82, SEMI-E84, and SEMI-E88 standards designed for semiconductor fab front ends might apply, but they need to be adapted to requirements for OSAT back-end facilities. In addition, OSATs have special needs that may demand new standards. This is a real opportunity for SEMI and its constituents. An architecture for full assembly and test automation involves four layers, as shown in Figure 2. Figure 2: Full automation for assembly and test involves four layers. Starting with the data layer at the top of Figure 2, a fully automated facility needs to have database systems in place that can supply all of the data needed for making smart scheduling and dispatch decisions. These databases then feed smart, automated scheduling and dispatch applications in the logic layer. The scheduling and dispatch applications then send control commands to the automated transport and materials controllers and the automated equipment handlers in the control layer. You need to start at the top of the diagram to put all of this automation in place. The automated equipment and equipment controllers need commands from the scheduling and dispatch applications, which in turn need data from the databases to make smart decisions. So it’s the data layer and the systems that feed data to this layer that constitute the starting point for the journey to full automation. A significant amount of simulation is needed to develop optimal facility workflows. These simulations are driven by data extracted from the databases. One of the frequently ignored facets of automation is the need for backup plans. For example, what is the backup plan when an AGV fails and cannot deliver material as scheduled? Simulation helps create contingency plans for such events. A case study Applied Materials has worked with assembly and test factories in deploying full automation. Towards this objective, the factories have worked on many modifications (physical and systems) to enable this automation. For example, a die-attach machine was retrofitted for automation by removing all of its equipment doors so that an AGV could load the machine and extract completed work. Additional modifications permitted the mounting of multiple magazines on the die-attach machine’s input and output to provide the buffering needed to smooth the flow of work through the machine. Finally, simple instrumentation and networking was added to the machine to aid in making WIP delivery and pickup decisions. These machine modifications addressed only the bottlenecks in this particular machine, but even these simple modifications helped to reduce the incidence of manual handling errors, such as the misalignment of magazines or trays. Modifications like these also reduce the need for human operators, which in turn reduces operating costs. Such types of incremental enhancements in automation capability have been implemented by leading-edge companies over the past few years. Conclusion Deploying full automation for assembly and test is not only feasible, it’s necessary for future profitability. OSATs must address the challenges of rising manufacturing volumes and thin margins by reducing manufacturing errors and increasing quality. (The quality requirement is increasingly driven by the automotive industry.) Trailblazing deployments have shown that it’s possible to automate these manufacturing lines successfully. While IDMs have a longer history for manufacturing automation, OSATs are now traveling along the same path due to their rising share of worldwide manufacturing volumes. On that path, they’ll need to develop experience and new standards tailored to their unique needs. Shekar Krishnaswamy is a senior manager at Applied Materials responsible for business development and pre-sales of factory automation products and solutions. He has over 27 years of experience in all aspects of semiconductor manufacturing including wafer fab manufacturing, bump, assembly and test. His specific areas of expertise are traditional industrial engineering methods as well as systems-related methodologies such as modeling, scheduling, dispatching and factory automation. Prior to Applied Materials, Shekar held senior technical and management positions at IBM, Motorola and AMD, including management of corporate operations research departments supporting factory and service groups. Shekar has a bachelor’s degree in mechanical engineering and a master’s degree in industrial engineering and operations research. Note: SEMI has a Smart Manufacturing Technology Community. For more information or to get involved, click here.