Midwest

As the global semiconductor industry charges toward a projected $1 trillion market by 2030, regional innovation hubs are stepping into the spotlight. The inaugural SEMIEXPO Heartland—held April 1–2, 2025, at the Indiana Convention Center in Indianapolis—brought together key players from across the ecosystem to explore how advanced packaging, smart manufacturing, smart mobility, AI, and workforce development are fueling the semiconductor revolution.With a special focus on building self-reliance in the U.S. chip supply chain, the event highlighted efforts that are revitalizing the Midwest’s role as a key region driving innovation in the global semiconductor ecosystem. SEMIEXPO Heartland showcased leading-edge strategies and technologies from global giants and regional champions alike—underscoring the deep connections between government, academic, research, and industry leaders.Keynote HighlightsSK hynix: Accelerating the Future with Chiplets and Advanced PackagingDr. Woong Sun Lee, Senior Vice President at SK hynix, kicked off the event with a powerful vision for the future of semiconductor manufacturing. In response to skyrocketing demand fueled by AI, autonomous vehicles, and next-gen mobile applications, SK hynix is pursuing aggressive innovation through heterogeneous integration and chiplet-based design.Using 12-inch wafers, SK hynix’s chiplet strategy compresses product development timelines from 10-20 years to as little as 2-5 years. This leap in design efficiency enables faster time-to-market and greater performance optimization—crucial in an industry where speed and scale are paramount.A major component of this vision is the company’s investment in a state-of-the-art advanced packaging facility in Indiana. Targeting mass production by 2028, the new hub will not only expand SK hynix’s U.S. manufacturing footprint but also support national goals around workforce development and ecosystem growth. It’s a bold move that aligns the company’s R D leadership with America’s strategic reshoring efforts.Robert Bosch Semiconductor: Driving the Future with Silicon Carbide (SiC)Thorsten Scheer, Regional President Mobility Electronics and Plant Manager at Bosch Roseville, presented a deep dive into how Bosch is preparing for the electrified mobility era. Central to Bosch’s strategy is the adoption of silicon carbide (SiC) semiconductors, which are increasingly critical to electric vehicle powertrains.As vehicles become more connected and automated, Bosch projects more than 40 semiconductor chips per car by 2035. To meet this demand, Bosch is developing dual-channel trench MOSFET technology using SiC—a move that enhances power conversion efficiency and reduces heat, two of the biggest challenges in EV design.Bosch’s global expansion includes a new SiC wafer fab in Roseville, California, which is set to begin production in 2026. This facility is not only a technological investment but also a commitment to supply chain resilience, ensuring that the U.S. plays a central role in future automotive innovation.Polar Semiconductor: Reshoring Advanced Foundry CapabilitiesSurya Iyer, President and COO of Polar Semiconductor, shared the company’s mission to reinvigorate America’s semiconductor manufacturing capabilities. Headquartered in the Midwest, Polar is a rare U.S.-owned foundry playing a strategic role in reshoring production and building domestic capacity.Specializing in power semiconductors—including MOSFETs, IGBTs, and wide-bandgap (GaN) devices—Polar focuses on serving critical sectors such as automotive, aerospace and defense, and industrial applications. With advanced automation and a commitment to cost-efficient scale, the company is helping to bring more semiconductor innovation back to U.S. soil.Polar’s flexible business models and emphasis on workforce training position it as a linchpin in the nation’s efforts to build a more secure and agile semiconductor supply chain.Smart Manufacturing and Mobility SessionsUnlocking the Future with AI, Edge, and Digital TwinsThe opening session on April 1 showcased how AI and advanced simulation are transforming the semiconductor manufacturing process. NHanced Semiconductor introduced "Foundry 2.0," a platform delivering chiplet-based solutions tailored for low-volume, high-mix applications—highlighting flexibility and speed.Kulicke Soffa emphasized the use of AI, digital twins, and agentic automation in backend operations, helping to cut costs and boost efficiency. Humatics demonstrated its Milo microlocation system, addressing factory automation and labor challenges with precision positioning technologies.Meanwhile, Purdue University’s research in chip-package co-design and semiconductor education reflected the essential role of academia in building future-ready capabilities.AI, Edge, and Digital Twins in Backend ManufacturingThis session continued to explore the shift toward intelligent, connected manufacturing ecosystems. Allan Lewis of Nordson Electronics Solutions showcased AI-powered inspection systems that reduce downtime and improve yield.Jim Redman from ErgoTech Systems emphasized the importance of scalable, decentralized data platforms using low-code tools. Luis Rivera of Koh Young Technology introduced KSMART Server and CFX standards, enabling real-time optimization and machine-to-machine communication.Josh Mangahas from INFICON detailed how digital twins and AI/ML models are enhancing production scheduling and delivery timelines, while Mahesh Deshpande of Dassault Systèmes illustrated how virtual twins and XR-based tools are supporting agile packaging environments.The Convergence of AI, Robotics, and Digital TwinsSession 3 on April 2 featured cross-disciplinary insights from leaders at Arizona State University (ASU), Fraunhofer IZM, Teradyne, and Purdue. A common theme: AI, robotics, and digital twins are converging to redefine factory dynamics.Dr. Binil Starly (ASU) explained how reinforcement learning and MQTT protocols are enabling adaptive robotic inspections. Erik Jung (Fraunhofer IZM) highlighted how packaging and AI systems evolve in tandem to achieve tighter integration and higher performance.Teradyne’s Mat Najibnia focused on the ROI of robotic material handling systems, while Purdue’s Dr. Martin Jun shared a vision for democratized smart manufacturing—especially for small and medium-sized manufacturers (SMMs).Building Future-Ready Semiconductor EcosystemsThe final session underscored the importance of collaboration, resilience, and cybersecurity. Athinia discussed its work harmonizing raw material and fab data to improve manufacturing insights. IBM presented use cases combining digital twins and generative AI for yield improvement and predictive maintenance.Siemens focused on sustainability and decarbonization through digital twin platforms. The Florida Semiconductor Engine (FSE) illustrated how regional ecosystems can support leadership in packaging innovation and talent development.PEER Group spotlighted the Semiconductor Manufacturing Cybersecurity Consortium (SMCC), advocating for a standardized, collaborative approach to securing manufacturing infrastructure.Workforce Development and Regional ImpactA strong undercurrent throughout SEMIEXPO Heartland was the need for strategic workforce development. The event featured a Workforce Pavilion offering job seekers access to career coaching, resume guidance, and mentorship.Local universities and community colleges were well represented, as were federal and state workforce programs. These partnerships are crucial to ensuring a robust talent pipeline and equipping workers with the skills needed for a rapidly evolving industry.The presence of SK hynix, Polar, and other major players making sizable investments in the Midwest signaled not just a resurgence of regional manufacturing, but a renewed commitment to community growth, equitable opportunity, and long-term sustainability.A Midwest Moment with Global ImplicationsSEMIEXPO Heartland 2025 captured a pivotal moment in the evolution of the semiconductor industry. From chiplets and SiC to AI-driven smart factories and cyber-resilient ecosystems, the event highlighted how innovation, collaboration, and policy alignment are driving progress.As America looks to fortify its semiconductor future, the Midwest is emerging as a powerhouse of talent, technology, and tenacity. With support from industry, government, and academia, the region is well-positioned to lead the charge into a smarter, more secure, and more resilient semiconductor era.For questions about SEMI’s Smart Manufacturing initiative, contact Anshu Bahadur at [email protected]. Read more about SEMIEXPO Heartland in this press release: Inaugural SEMIEXPO Heartland Event Underscores Midwestern U.S. as a Global Hub for Smart Manufacturing and Smart Mobility.Anshu Bahadur is Sr. Program Manager, Technology Communities at SEMIRafael Tudela is Sr. Technical Marketing Manager at SEMI

The semiconductor industry is at a pivotal moment, with smart manufacturing, smart mobility and workforce development as key drivers in the industry’s path to reach $1 trillion in revenue by 2030. Bringing together key stakeholders from the semiconductor ecosystem, SEMIEXPO Heartland will take place on April 1-2, 2025, in Indianapolis and explore the latest advancements and opportunities to foster growth, accelerate innovation and reinforce the Midwest as a thriving hub for semiconductor manufacturing.SEMI sat down with Purdue University President Mung Chiang who shared his insights on growing semiconductor industry in the Midwest, how Purdue is making an impact, and a sneak peek into his upcoming keynote presentation at SEMIEXPO Heartland.SEMI: How important is semiconductor industry expansion in the Midwest?Chiang: Purdue’s partnerships with industry leaders, state and federal government are essential to advancing the U.S. semiconductor industry and establishing the Midwest region as the Silicon Heartland. The Department of Defense-funded Silicon Crossroads Microelectronics Commons innovation hub is a partnership between Indiana, Illinois, and Michigan, while the Midwest Microelectronics Network is in collaboration with Ohio, Illinois, and Michigan.An event like the SEMIEXPO Heartland in Indianapolis gathers industry representatives from across the nation to see the potential and value that Indiana and the Midwest bring and provides a great forum to explore strategies for collaboration and innovation.SEMI: How important is collaboration between industry and academia to advance semiconductor innovation and address workforce challenges?Chiang: Enabled by semiconductors, artificial intelligence (AI) continues to advance rapidly. Purdue is a national academic leader in microelectronics and semiconductors in part because of industry partnerships – both nationally and internationally – that help us align our research and workforce development to the needs of our industry partners.Collaborations among industry, academia and government will be critical to strengthening America’s position in the global semiconductor landscape and securing our technological future. Two recent examples are our partnership with SK hynix to fill a critical gap in the U.S. semiconductor supply chain and our partnership with SEMI, the leading global microelectronics industry association, to create online courses aimed at bolstering the semiconductor workforce.SEMI: How are Purdue’s innovations contributing to those fronts?Chiang: World-leading research, transformational investments in infrastructure and pioneering education are all part of Purdue’s contributions to advance the semiconductor industry.Strategic initiatives like the first comprehensive, large-scale Semiconductor Degrees Program, advised by a board of industry leaders, lead the way to high-quality workforce development at scale. Experiential education, such as programs like “Summer Training, Awareness, and Readiness for Semiconductors” (STARS) for undergrads, energizes first-year students and provides a strong foundation to prepare the next generation high-tech workforce, a critical step in cultivating the talent needed to drive the industry forward.Birck Nanotechnology Center, one of the nation’s state-of-the-art academic research centers, is another prime example of Purdue driving innovation. This facility will soon become the first and only digital-twin-enabled semiconductor research lab in the world.SEMI: What are the highlights of your keynote address for the SEMIEXPO Heartland?Chiang: I’ll point out that these are exciting times in Indiana – two new semiconductor clusters are emerging, one in West Lafayette at Purdue focused on the commercial sector and one at Westgate, near the Naval Surface Warfare Center Crane, focused on the defense sector.The initiative at Purdue is led by SK hynix, the world’s leader in high-bandwidth memory for AI; MediaTek, the world’s fifth-largest fabless design company and a leader in chips for smartphones, tablets, TVs, and Internet of Things products; and by imec, the world's leading independent semiconductor research and innovation hub.Our goal is to leverage Purdue’s excellence at scale to work with our partners and create a new, thriving, vibrant, and growing semiconductor hub in the heartland and to connect this growing commercial sector to the emerging defense sector at Westgate.We look forward to working with our partners in the Midwest to make the Heartland one of the few critical regions of semiconductor manufacturing, design, innovation, and talent development in the United States.SEMI: Part of SEMIEXPO Heartland’s focus is on smart manufacturing. What strategic collaborations in smart manufacturing are driving innovation forward?Chiang: Smart manufacturing is being driven, in part, by the continuing advancement of AI and digital twins. The semiconductor industry already is partnering with computational modeling and fabrication leaders like Purdue University to develop the digital twins and play a major role in training the workforce and accelerating the pace of innovation.The NIST-funded SMART USA Manufacturing Institute for Digital Twins is a $1 billion plus program that brings industry and academia together. Purdue looks forward to playing a leading role in this important initiative.Maintaining a strong connection between academia and industry can help accelerate design and innovation of new U.S. chip development and manufacturing concepts through cost reduction, product optimization and real-time process adjustments.ResourcesHear more from academic leaders, industry executives and government officials about the semiconductor expansion and opportunities for growth in the U.S. Midwest during SEMIEXPO Heartland event, April 1-2, 2025, in Indianapolis. Visit the SEMIEXPO Heartland website to view the full agenda: https://semiexpo.semi.org/.Mung ChiangMung Chiang is the President of Purdue University, and the Roscoe H. George Distinguished Professor of Electrical and Computer Engineering. Prior to being selected university president in 2022, he was the John A. Edwardson Dean of the College of Engineering and executive vice president for strategic initiatives at Purdue University.Chiang received BS (1999), MS (2000) and PhD (2003) from Stanford University and an honorary doctorate (2024) from Dartmouth College. Before 2017, Chiang was the Arthur LeGrand Doty Professor of Electrical Engineering and an affiliated faculty in Computer Science and in Applied Mathematics at Princeton University.SEMI ContactSherrie Gutierrez, Marketing Communications ManagerEmail: [email protected]