TFME

The automation of semiconductor factories through digitization is reshaping Smart Manufacturing to streamline the connectivity and orchestration of manufacturing processes across the entire supply chain. But the threat of cyberattacks and viruses looms. An estimated 26 billion smart and connected manufacturing devices are expected to be online by next year. Never before has the need been greater to protect the staggering volume of manufacturing data traversing increasingly intricate supply chain networks.“We are living in the time of digital manufacturing,” said Chen Chi-Hsien, Director of TSMC’s Manufacturing Technology Center. “Processes ranging from assembling equipment and upgrading hardware and software are increasing security challenges for semiconductor manufacturers. With viruses and malware constantly evolving to pose greater threats, all members of the supply chain – from manufacturing and equipment to operating system and software/firmware providers – should work together within the SEMI Smart Manufacturing platform to establish cybersecurity standards across the industry. Doing so will also enhance the development of smart manufacturing and accelerate digitalization.” Representatives from Tongfu Microelectronics, Adlink, NSHC, ABB, TSMC, ASE and Microsoft with SEMI CMO and SEMI Taiwan president Terry Tsao (left to right) Chi-Hsien offered his insights at the SEMI Smart Manufacturing and Cybersecurity Seminar, joining speakers from other leading semiconductor manufacturers including TFME and ASE to discuss the latest smart manufacturing trends and cybersecurity challenges. The April event in Hsinchu also featured representatives from ABB, Adlink, Microsoft, Rockwell, Siemens, Delta Electronics and the National Center for High-Performance Computing (NCHC) offering their views on how the semiconductor industry can speed its digital transformation using various technologies.With its 43 years’ experience in developing international standards, SEMI is committed to serving as the platform to establish universal information security standards for silicon wafer plants and semiconductor equipment, Terry Tsao, SEMI chief marketing officer and SEMI Taiwan president, said at the seminar. Tsao added that SEMI is now in discussions with leading semiconductor manufacturers to establish a communications framework for addressing potential security risks and facilitating the development of risk management and security solutions that safeguard the semiconductor supply chain.This year SEMI will debut its SMART Manufacturing EXPO to gather key supply chain players for critical discussions about security and to feature AI manufacturing and cybersecurity solutions. Co-located with SEMICON Taiwan, September 18-20, 2019, at TaiNEX 1 (Taipei Nangang Exhibition Center, Hall 1), the SMART Manufacturing EXPO will include Smart manufacturing hardware and software providers from around the world for the interdisciplinary discussions and collaboration key to developing strong Smart manufacturing security.For more information about the SEMI Smart Manufacturing Platform, contact Emmy Yi of SEMI Taiwan at [email protected] Yi is a marketing specialist at SEMI Taiwan.

Outsourced Semiconductor Assembly and Test (OSAT) service providers experienced strong growth in 2017, but will this growth continue? In the last few years, OSAT growth has been driven by shipments for packages found in smartphones, but this market is slowing. What will replace it? Growth in power devices is strong and electronic content in vehicles is increasing. Will OSATs participate in this growth? Many OSATs have plants dedicated to automotive package assembly and will see continued growth. Growing demand for connectivity everywhere, called IoT, is generating large amounts of data, creating the need for more servers and datacenters. The adoption of Artificial Intelligence (AI) across a broad range of applications is driving demand for high-performance packages, but will this assembly take place at the OSATs or foundries? In the third and fourth quarters of 2017, growth in cryptocurrency provided unanticipated revenue for a number of OSATs. Given that the most well-known crypto mining companies and the biggest mining pools are all based in China, several OSATs, including major Taiwanese and Chinese service providers, experienced revenue growth in 2017 directly attributed to the assembly of ASICs in flip chip scale packages (FC-CSPs) and GPUs in flip chip ball grid arrays (FC-BGAs) for the cryptocurrency market. However, the first and second quarter of this year has seen decreased demand for GPUs and ASICs for this application. The assembly of packages for cryptocurrency slowed considerably in the first half of the year and therefore can’t be counted on to add as much to the revenue base as in the previous year. Going into the latter half of the year, the demand for Crypto ASICs is expected to pick up as new generation of 7nm chips will drive new investment and replacement cycle while crypto-mining GPU will see a further decline. Three of the top 10 OSATs, Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology (Huatian), and Tongfu Microelectronics (TFME), are based in China. China’s share of the top 10 OSATs’ revenue increased from slightly less than 23 percent in 2016 to more than 25 percent in 2017, and this trend is expected to continue. Crypto-related packaging and test business has certainly contributed a big portion of the share gain. Major OSATs such as TFME and Tianshui Huatian plan expansion in their plants and they expect to fill this added capacity in a broad range of packages. Huatian’s new Nanjing plant will include assembly for memory packages. TFME plans to set up a plant in Xiamen, Fujian Province to provide bumping, wafer level packaging, and system-in-packaging (SiP) services. Tracking the capabilities of OSATs is increasingly important. SEMI and TechSearch International have introduced a new Worldwide OSAT Manufacturing Site Database that provides listings of OSAT facility locations and package and test options in each factory. This database indicates the specific packages offered at each location. Finding plants that offer automotive qualified assembly is also possible with the database. Companies that offer bumping and wafer level packaging are identified. Over 120 companies and 300 facilities are tracked in this database covering both OSAT packaging and test facilities. For additional information about this informative database, please visit https://discover.semi.org/osat-database-registration.html E. Jan Vardaman is president of TechSearch International, Inc., and Clark Tseng is director of Industry Research and Statistics at SEMI.