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WLCSP

Shenyang is on an unwavering path to maturing its integrated circuit (IC) equipment manufacturing industry over the next few decades in response to the Made in China 2025 Strategy. Since the strategy’s introduction in 2015, the city, long a transportation and commercial hub of China's northeast, has built out a complete integrated circuit industrial chain integrating technical research and innovation, components and parts processing, and equipment manufacturing. Its ambition is to compete on the world stage.Shenyang has implemented policies and provided funding to support the development of its IC equipment and related industries to buttress the development of emerging industries. Speaking at the SEMI China Members Day 2019 in Shenyang, Zheng Guangwen, secretary-general of ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance, said that the city, as a key IC equipment industry base in the upstream of China’s industrial chain, hopes to enter the international community in part by leveraging SEMI’s global platform. Zheng Guangwen, Secretary General, ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance More than 150 representatives from member companies gathered at SEMI China Members Day 2019 to discuss China’s semiconductor industry investment and capital dynamics and semiconductor market trends. The event sought to promote stronger communication and interaction between the upstream and downstream of the semiconductor industry chain. The forum was co-sponsored by SEMI China and Shenyang Science and Technology Bureau and co-hosted by ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance. Lung Chu, President of SEMI China Opening the event, Lung Chu, president of SEMI China, set stage for the discussion by noting that global semiconductor industry has been booming since 1957, reaching another record high of $470 billion in sales last year as it faced a critical juncture, with industry growth slowing in the first half of 2019. The slowdown was predictable and is temporary, a natural stage in the industry’s cyclicality. From a macro point of view, the development of advanced technology requires huge investment. There was an obvious gap in investment between enterprises, which often leads to the stronger become much stronger. Under these circumstances, it is very important for China to master key technologies and products during the process of catching up and surpassing. Each region should focus on its strengths.Enterprises should do their own business in a low-key way and keep a prudent and optimistic attitude. The number of SEMI China members has reached a new high. SEMI China is committed to becoming the best partner to realize China's semiconductor dreams. In promoting the development of global semiconductor industry and China's semiconductor industry, SEMI has continuously gathered strength and actively organized rich activities to promote the sustainable growth of Chinese semiconductor enterprises through international cooperation. Zhao Rigang, Director of SCTB, Shenyang Science and Technology Bureau Zhao Rigang, director of SCTB at Shenyang Science and Technology Bureau, pointed to the importance of SEMI’s pivotal role and global influence in cultivating cooperation between international and domestic industries including Shenyang’s IC sector. Speaking at the SEMI China Members Day 2019 in early June, Rigang said the growing importance of chips in China is a key catalyst for Shenyang’s rise as semiconductor sectors domestically and abroad invest heavily in a new generation of information technologies such as mobile Internet, cloud computing, big data, Internet of Things. Kang Jin, General Manager, SMIC Beijing For China’s semiconductor industry to flourish, the region must improve its IC supply capacity just as it has brought its PV industry to full maturation, said Kang Jin, general manager of SMIC Beijing. The key to developing China's integrated circuit industry, he said, lies in building a robust semiconductor supply chain. Zong Runfu, Chairman and General Manager, KINGSEMI Semiconductor Equipment Supply Chain DevelopmentLocalization has enabled KINGSEMI to optimize its technology design capabilities to produce high cost-performance equipment for greater competitive advantage, saidZong Runfu, chairman and general manager of KINGSEMI. While the localization rate of supply chain construction was over 50 percent, the localization rate for front-end equipment is still low. Zong Runfu said localization is imperative not only to lowering costs, but also to ameliorating the supply-guarantee rate, maintaining quality and shortening the delivery cycle. Russell Li, VP of Marketing and Business Development, WLCSP Packaging Solutions for 3D Active Sensing DevicesInternet of Things (IoT), artificial intelligence (AI), 5G and other technologies are starting to become a part of daily life as more sensors find their way into new retail stores and smartphones, a trend that will continue as autonomous transportation begins to take hold, said Russell Liu, VP of marketing and business development at WLCSP. The move to bring more human-like capabilities to technology is driving the implementation of perception function in devices, with passive sensors giving way to active sensors and machines translating the physical world into a 3D view through the eyes of a 3D camera. What’s more, the next generation of IoT devices will feature more integrated processors including signal processors, caches, sensors, photons, RF and MEMS, bringing the challenges of miniaturization to system integration. Liu said miniaturization will only be possible by developing advanced packaging technologies that enable highly integrated processors for mobile devices and intelligent automobiles. Wang Ronghua, VP of Technology, Dalian Xinguan Technology Getting Ready for GaN Power Electronics EraGaN offers excellent performance in optoelectronics, RF and power electronics and will coexist with and complement silicon devices for years to come, said Wang Ronghua, VP of Technology at Dalian Xinguan Technology. However, the industrialization of GaN power devices still faces technical challenges in application, reliability, packaging, epitaxy, device and process – all barriers to market adoption. To overcome these hurdles, GaN power devices must meet the reliability and cost-performance requirements of applications to which they are best suited.Ronghau said that GaN power devices, such as cascade and p-GaN enhanced devices, now support end products, proof that the era of gallium nitride has arrived. “Gallium nitride is quite different from silicon in epitaxy, device design and key technology, which requires close integration of upstream and downstream industry chains for effective promotion,” he said. Billy Feng, Executive Director, J.P. Morgan Is the Semiconductor Industry Still Cyclical? Since 2008, the semiconductor cycle has waned, disrupting the traditional thinking of investors, equipment suppliers and logistics channel providers as investors’ appetite for the chip industry investments has grown, said Billy Feng, executive director at J.P. Morgan. The long-term prospects for the semiconductor industry remain bright. But after reaching historic revenue highs in 2017 and 2018, the industry – and investor expectations – will enter a period of adjustment. Dr. Adam He, Executive Director, CGP Tech Fund The unique gene of the semiconductor industry consists of the blend of its lofty requirements for quality, reliability and consistency; cooperation between upstream and downstream sectors; internationalization; and a powerful ambition to innovate, said Dr. Adam He, Executive Director of CGP Tech Fund. He described Chinese chip enterprises he often encounters as falling into one of two entrepreneurial categories – IC experts and cross-border business people. Both want the answer to "how to make money and how to establish a solid competitive position?” He said. Adam believes that accessing the genes of the semiconductor industry is the answer to both questions and crucial to the maturation of China’s chip industry. The genes must be used to strengthen the Chinese manufacturing and materials sectors. Du Shanshan, Senior Analyst, SEMI China SEMI Market Outlook: Fab Investment, Equipment and Materials Market ForecastsEmerging technologies have sparked explosive semiconductor industry growth, said Du Shanshan, a senior analyst at SEMI China. While the industry will see a slight recession in 2019 due to memory market softness, trade wars and other factors, it is on stable footing for the long run. At the same time, China continues to optimize its IC industry chain, and semiconductor design and manufacturing companies have gradually grown in number. Over the next decade, the average growth rate of China's production capacity is expected to exceed 10 percent. Richard Feldman, VP of Global Expositions and Events, SEMI Richard Feldman, vice president of Global Expositions and Events of SEMI headquarters, presented the new SEMI Asia semiconductor business development plan to members and called on companies in mainland China, Taiwan and Malaysia to participate in SEMICON Europe to strengthen the influence of globalization.After the meeting, participants visited KINGSEMI Co., Ltd., Shenyang Piotech Co., Ltd, Shenyang SIASUN Robot and Automation Co., Ltd., Shenyang Fortune Precision Equipment Co., Ltd. and SKY Technology Development Co., Ltd. The event facilitated communications between upstream and downstream companies. SEMI China Member Day 2019 Group Photo Cherry Sun is a marketing manager at SEMI China.
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SEMI spoke with Balaji Nandhivaram Muthuraman, Package and Material Simulation engineer at Dialog Semiconductor, about the state of reliability testing for wafer-level chip scale packages ahead of his presentation at the Advanced Packaging Conference at SEMICON Europa 2018, 13-16, November 2018, in Munich, Germany. To register for the event, click here. SEMI: Since the beginning of package development reliability testing has played a key role in Wafer Level Chips Scale package (WLCSP) investigation. Lately, the role of simulation and predictive reliability significantly contributed in reducing package development time. To what extend can we predict potential failures for WLCSP packages in an early design phase by simulation?Muthuraman: Reliability testing is essential and crucial for the electronic packages. It is during the package development phase that several design iterations need to be considered and, in some cases, many feasibility studies for the package are executed. This means we require significant reliability test measurements, which could influence product-development time. For example, Temperature Cycling on Board (TCoB) reliability testing would take approximately 65-75 days for testing the package reliability subjected to 1500 temperature cycles. Each cycle involves exposing the device at hot and cold temperatures with a specified temperature profile. Executing such Board Level Reliability (BLR) tests for all feasible package designs is a tedious process that could lead to an increase in package development time. This is the stage where numerical simulation methodology helps us to foresee potential failures in Board Level Reliability. Predicting delamination or cracking of passivation/metal interface layers based on the WLCSP design layout and estimating the characteristic life of smart device subjected to temperature load are some classic examples of predicting WLCSP package behavior in an early design phase by simulation methodology.SEMI: We can definitely say that predictions occurring during the early stage are key to success. But how exactly can numerical simulation help estimating?Muthuraman: From a thermal reliability point of view, determination of the optimum material combination – bill of materials for device – is used to predict whether a heat sink is required for the device to meet thermal performance. This is not all. At an early design stage, the simulation methodology can be used to estimate device performance under varying thermomechanical loads. Numerical simulation at early package development phase helps the researchers by predicting the possible temperature contour field and stress contour field of the smart device under a given loading condition. The estimation accuracy of potential issues through numerical simulation depends on the material models implemented and consideration of realistic load condition under which the package operate in real life situation. For example, engineering judgements can be made using numerical simulation of Solder Joint Reliability (SJR) analysis to decide whether an Underfill material is required between the Package and the Printed Circuit Board (PCB).SEMI: Are all conditions tested during the reliability investigations specific to fit a certain type of applications or do these vary?Muthuraman: Reliability investigations are based on the end application of the electronic devices. For example, handheld device applications will be exposed to a reliability condition up to a maximum of +85oC, whereas smart devices designed for an automotive application would be tested with a typical temperature of +125 oC or up to +150 oC. In some cases, the testing conditions are customized based on specific customer requirements. Moreover, reliability conditions can also be customized to study some specific failure mechanism. SEMI: Can you describe for which one?Muthuraman: Thermal cycling profile is based on device application and/or specific requirement from our customer. For example, handheld devices use a typical temperature range of +85°C to -40°C with 20°C/min ramp time and 20 minutes of dwell time. There is possibility of adjusting the ramp and dwell time of the Temperature Cycling qualification test, provided such accelerated test does not lead to other failure modes.SEMI: What failure mechanism was the subject of the study in this specific case?Muthuraman: Electronic package reliability behavior without and with underfilled devices is explained in this study with the help of temperature cycling on board (TCoB) measurements and validated with numerical simulation. In the paper to be presented at SEMICON Europa, failure occurring at the interface of the solder and Under-Bump Metallization (UBM) structure is discussed. Behavior of such failure mechanism is illustrated with different WLCSP package sizes subjected to varying thermal load condition. One of the key aspects of the subject is the board-level reliability (BLR) measurement and simulation validation showing how the failure mode could be shifted from solder joint to the metal interface layers between UBM and interconnection to Silicon Chip, depending on the WLCSP design layout. The reasons for such shifts in Failure phenomenon are explained and necessary design optimization is suggested for improvement. Another key aspect of this study is determination of Fatigue Life Model for WLCSP family using the SACQ solder. SEMI: Are you currently working and experimenting on something particularly exciting?Muthuraman: Recently, we concluded our engineering analysis of thermomechanical reliability of Large Wafer Level Chip Scale packages. In September 2018, I presented this research work in an International Conference held in Dresden, Germany. Dialog Semiconductor GmbH was awarded the “Best Paper Presentation for the year 2018” for this work. This success is attributed to the entire team of Package and Material simulation experts at Dialog Semiconductor GmbH lead by Mr. Baltazar Canete and IC Package-Design Simulation group managed by Mr. Rajesh Aiyandra. We have started our investigation on the influence of Board Level Reliability of WLCSPs due to varying metal concentration of inter-metallic layer. We, at Dialog, are also working on possibility of thinner WLCSP. All these activities would include extensive Temperature Cycling on Board (TCoB) measurements, Statistical Analysis of measurement Data and would then be validated by Numerical Simulation. SEMI: What are your expectations for the future and why would you recommend attending SEMICON Europa Advance Packaging Conference?Muthuraman: SEMICON Europa is an important platform for Dialog Semiconductor GmbH to showcase the latest developments in the semiconductor industry. It is an opportunity to meet other industry experts, partners, and customers, and exchange various innovative ideas and to get new insights. Many semiconductor companies are based around the Munich area as well world-class universities. We are particularly interested in innovation, workforce and talent development themes. SEMICON Europa gives us a platform for greater interaction with the academicians and research scientists. This way, we bridge the gap between industry and University researches, thereby moving forward in innovative technologies. We, as Dialog Semiconductor GmbH, have also a development center near Munich (Germering). Our expectations for the future are very positive and vibrant. We are always ready to take up the industry challenges and demands and provide the best-in-class solutions to our product users. Dialog Semiconductor GmbH is certainly poised for higher growth in coming years. Balaji Nandhivaram Muthuraman BioBalaji Nandhivaram Muthuraman is a Packaging and Material Simulation engineer at Dialog Semiconductor GmbH, Germany. He has authored/co-authored conference publications including in the area of molecular dynamics simulation on assembly of carbon nanostructures; Analysis of thermoset material used in smart devices and reliability of wafer level packages. Recently, he has been awarded with the “Best Paper Presentation for year 2018” in the area of Board Level Reliability of Wafer Level Chip Scale Packages, in a recently held international semiconductor conference. His current areas of working interest include reliability investigation of electronic packages and developing fatigue models for reliability assessment of Dialogs products. He obtained his Bachelor’s degree in Aeronautical Engineering from Anna University, India and Master’s degree in Computational Mechanics of Materials and Structures from University of Stuttgart, Germany. Serena Brischetto is a marketing and communications manager at SEMI Europe.
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