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SEMI-MSIG

Areas packed with dense foliage. Mile-deep mines and tunnels. Urban canyons. Indoor environments. Global Positioning System (GPS) technology has long been a boon to location tracking of aerial, terrestrial and aquatic vehicles — as well as to people in motion — but in many cases it can’t function with a high degree of reliability, either because the GPS signal is somehow obstructed, or worse, is jammed or spoofed. Delivering higher precision and higher reliability in GPS-denied environments — as well as immunity to jamming and spoofing — positioning, navigation and timing (PNT) represents the next evolutionary step in location positioning and tracking. With PNT so critical to a range of defense, commercial and industrial applications — and with sensors the building blocks of PNT solutions —the MEMS Sensors Industry Group, a SEMI Technology Community, is ensuring that our members play a transformative role in PNT innovations. We’ve secured $14.9 million in research dollars for PNT R D over the past 18 months, marking Phase I of a project funded through a public-private consortium with the U.S. Army Research Laboratory (ARL). With the typical funding structured as a 50/50 cost share with the industry participant, the research dollars go farther, and the level of commitment that each recipient makes is more pronounced. As we look ahead to Phase II of the MSIG PNT R D project, the details of which we’ll announce later this year, we’d like to reflect on the companies and research labs that won bids through a competitive process supported by the SEMI-MSIG PNT Technical Advisory Council and the SEMI-MSIG PNT Governing Council. Winners submitted proposals that both met our criteria for advancing PNT technologies relative to mobility, size and weight, and that laid a path toward greater cost efficiency and lower product price. “PNT doesn’t displace GPS,” said Tim Brosnihan, executive director of SEMI-MSIG. “Rather, getting the two technologies to work together improves position and tracking. While current PNT solutions use inertial measurement units, or IMUs, to effectively maintain positioning accuracy in the absence of a GPS signal, it’s also true that accumulated bias and noise-related errors in the IMUs make positional determination unreliable. Like most great pairings, GPS and PNT can work together. We can use IMUs when GPS is unavailable, and when GPS returns, it can be used to reset the IMU errors. So when the GPS signal is lost again, the IMU can maintain navigation and location. “We’re focusing this PNT project on technologies that will allow accurate positional determination in the absence of a reliable GPS signal for prolonged periods,” added Brosnihan. Here are snapshots of the 10 companies and research institutions that won awards for their PNT-focused developments. Analog Devices is developing an optimal size, weight, power, and cost (SWaP-C) solution for applications requiring high-accuracy navigation and uncompromised reliability. The company’s mode-matched navigation-grade gyroscope with system ID leverages an innovative sensor and its associated process design, a robust high-volume manufacturing flow, and system-control algorithms to achieve very high-performance (0.01 degree/hour bias instability and 0.005 degree/√hr angle random walk). Carnegie Mellon University (CMU) is developing a CMOS MEMS high-stability accelerometer through machine learning (ML). If embedded in footwear, these ML-optimized accelerometers could be used in personal navigation. If embedded in a golf ball, baseball or hockey puck, the accelerometer could extract the trajectory of the object in motion by measuring its shock (force). The CMU device validates state-of-the-art performance of the university’s high-dynamic-range accelerometer systems-on-chip. It also validates and tests ML models by measuring the accelerometer and auxiliary sensor output over long time periods (e.g., 1 hour, 10 hours, days) to collect independent long-duration time-series data. By modeling drift from environmental influences — along with possible overall system changes from extreme events, such as high-temperature excursions and shock — designers can dramatically reduce navigation errors to support more accurate navigation over longer time periods. GE Research is developing a novel MEMS gyrocompass that will enable high-end north-finding systems, traditionally unaffordable for automotive and consumer applications. The device will be available in mass-market applications such as robotics and autonomous vehicle navigation in GPS-denied environments. The MEMS gyrocompass enables a 10x reduction in SWAP-C with high accuracy. An additional benefit of this work is that GE will offer a foundry service process development kit (PDK) for its Polaris MEMS process, speeding the development and manufacture of MEMS devices in an advanced processing facility. Georgia Institute of Technology is developing high-aspect-ratio monocrystalline silicon carbide-on-Insulator (SiCOI) MEMS devices that will reduce navigation angle errors, potentially making widescale pedestrian navigation available in mass-market applications such as smartwatches and smartphones. The platform for ultra-high-performance bulk acoustic wave (BAW) gyroscopes and timing resonators will feature material properties that allow a much better structural symmetry and a higher-resonant quality factor (Q) than silicon MEMS (Si MEMS). Honeywell is working to enhance the navigation accuracy of commercial and military vehicles in GPS-denied environments through an innovation that dramatically improves the performance of a MEMS IMU by both refining candidate ML algorithms, including recurrent neural networks (RNNs), and by combining deep neural network (DNN)-based calibration and sensor fusion algorithms. PARC is developing a new materials platform for photonic integrated circuits (PIC). Aluminum gallium nitride (AlGaN), an ultra-wide bandgap semiconductor, is epitaxially grown to produce single-crystal layers for fabrication of optical components, such as waveguides and micro-ring resonators for optical signal processing. The project includes design and fabrication of specialized laser diodes at wavelengths needed to probe qubits based on atomic ions (e.g., strontium and ytterbium). The new platform offers several benefits: low optical loss from the ultraviolet (UV) to infrared spectral bands excellent non-linear optical properties for efficient frequency-generation processes (e.g., optical frequency combs); and enabling technology to realize compact, field-deployable quantum systems for PNT applications, such as ultra-fast distance measurements, microcombs for optical atomic clocks, photonic radar, optical coherence tomography, and coherent communications — all applications that benefit from the lower cost and small chip size of these integrated photonic circuits By expanding its proprietary EpiSeal encapsulation process to include new materials and topologies, SiTime is developing low-impedance and low-noise MEMS resonators with an ultra-stable wafer-level package. Because these novel MEMS resonators are highly reliable and very compact — while using less power and providing lower RF noise — they’re ideal for 5G RF timing applications, IoT devices, and smart vehicles. Teledyne Scientific Imaging (CSAC project) is conducting a study to identify paths to reduce the cost of battery-operated chip scale atomic clocks (CSAC) that provide affordable precision timing for denied environments. The project goal is to identify viable paths of reducing cost by an order of magnitude, without sacrificing performance. In addition to exploring design and manufacturability solutions, project researchers are performing short loop experiments as proof-of-concept validation. Through a second award, Teledyne Scientific (IMU project) is advancing packaging and integration for compact, navigation-grade six degrees of freedom (DOF) MEMS IMUs. Featuring reduced bias instabilities associated with packaging stresses and ambient temperature influences, the Teledyne Scientific IMUs promote environmentally robust low-stress packaging of wafer-level vacuum packaged (WLVP) MEMS gyro resonators, facilitating a lower-cost, smaller and more accurate IMU for performance-driven PNT applications. Twinleaf is developing a new light source module ideally suited for integration directly into quantum sensors. This project integrates a bright, tunable distributed Bragg reflector (DBR) near infrared (IR) 795nm wavelength laser made by the project’s subcontractor (Photodigm) into a package that locks the laser to an atomic reference line in a microfabricated vapor cell. The laser module’s high-output intensity and low magnetic signature will enable breakthrough performance levels for Twinleaf’s magnetometer and other quantum sensors requiring the light source integrated into the sensor module. Request for Proposal for Phase II of SEMI-MSIG PNT Program Opens Q4 2021 SEMI-MSIG will accept request for proposal (RFP) submissions for Phase II of its PNT program starting in Q4 2021. This year, in addition to funding IMU and timing device projects, MSIG will also consider proposals on imaging-based navigation solutions. If you’d like to submit for Phase II, sign up to receive more information on the RFP by visiting SEMI’s R D Programs page. You can also connect with Paul Carey by email, [email protected] or LinkedIn. Paul Carey, Ph.D., is the director of the MEMS Sensors Industry Group. With deep domain expertise in X-ray imaging backplane platforms — and their supply-chain technologies such as flexible substrates, laser annealing for semiconductors and silicides, thin film transistors (TFT) for flexible OLED displays, and polysilicon-on-plastic TFT technology — Carey has held technical leadership positions at dpiX, Applied Materials, and Lawrence Livermore National Laboratory. He received a double-major B.S. from UC Berkeley in Electronical Engineering and Computer Science (EECS), and Materials Science and Engineering (MSE). Carey holds an M.S. in EECS from UC Berkeley and a Ph.D. in MSE from Stanford University.
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Every day it seems like a new portable voice-first device is coming to market. From smart speakers small enough to fit in your pocket to tiny wireless earbuds and voice-activated TV remote controls, we are using voice increasingly to play music, select TV shows, turn on the lights or interact with our smart thermostat. While the popularity of voice-first interfaces has spawned massive diversity in device type, as long as these devices are portable, they have one thing in common: They’re battery-powered, and that could be a problem for consumers who are tired of frequently recharging or replacing batteries. Change the Architecture, Reduce the PowerThe issue lies in the traditional hardware architectures of today’s voice-first devices, which are notoriously inefficient when it comes to power consumption. Such devices rely on a “digitize-first” model of processing voice data in which the heaviest power-consumers, like the analog-to-digital converter (ADC) and the digital signal processor (DSP), do all the heavy lifting up front, right at the start of the audio signal chain. They continuously digitize and analyze 100% of the ambient sound data as they search for a wake word, even if speech is not present and the only sound is noise. Because voice is spoken randomly and sporadically, that continuous digitization of sound wastes up to 90% of battery power.To tackle the battery drain in portable voice-first devices, we need look no further than the human brain. Our brain processes sound very efficiently. Imagine that you are outside your house having a conversation with your neighbor. You are able to focus on what your neighbor is saying because your brain can differentiate between sounds that it should send to the deeper brain for speech processing and sounds that it shouldn’t bother processing further (e.g., dog barks, sirens or car traffic). The brain spends minimal energy up front to decide whether it should spend additional energy on processing down the line. In other words, it saves the most power-intensive processing only for the important sounds.We can mimic the brain’s approach to signal processing by enabling a new “analyze-first” architecture for voice-first devices. This analyze-first approach requires ultra-low-power analog processing technology that can differentiate voice from noise before the sound data is digitized. This keeps the higher-power capabilities in a voice-first system, such as the wake-word engine, in a low-power mode when just noise is present. This approach only wakes up the higher-power chips in the system, e.g., the DSP or ADC, when it detects speech. Like our brain, a voice-first system uses an analyze-first architecture to conserve energy most of the time, saving the heavy lifting, i.e., the wake-word listening, for times when speech is present. The analyze-first architectural approach to always-on listening analyzes the analog microphone prior to digitization, saving considerable power in portable voice-first devices that run on battery. This architectural shift to analyze-first is well worth the investment because it reduces the system’s power consumption in a battery-powered voice-first device by up to 10x. That’s the difference between a portable smart speaker that runs for a month on battery instead of a week or smart earbuds that last for a whole day instead of a few hours on a single charge. Longer battery life in portable voice-first devices generates more good will among consumers, creating another key differentiator for manufacturers engaged in the ultra-competitive race for more users.For more information on the analyze-first architectural approach to voice-first devices, please view our video.Tom Doyle is CEO and founder of Aspinity. He brings over 30 years of experience in operational excellence and executive leadership in analog and mixed-signal semiconductor technology to Aspinity. Prior to Aspinity, Tom was group director of Cadence Design Systems’ analog and mixed-signal IC business unit, where he managed the deployment of the company’s technology to the world’s foremost semiconductor companies. Previously, Tom was founder and president of the analog/mixed-signal software firm, Paragon IC solutions, where he was responsible for all operational facets of the company including sales and marketing, global partners/distributors, and engineering teams in the US and Asia. Tom holds a B.S. in Electrical Engineering from West Virginia University and an MBA from California State University, Long Beach. For more information, visit www.aspinity.com. Aspinity is a member of SEMI-MEMS Sensors Industry Group, which connects the MEMS and sensors supply network, allowing members to address common industry challenges and explore new markets.
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According to market research and strategy consulting firm Yole Développement (Yole), the total market size of MEMS, sensors and actuators will double from $48 billion in 2018 to $93 billion in 2024.[i] The consumer market will continue to drive volume, with applications such as smartphones making up for in volume what they lack in average selling price (ASP). Stronger demand in automotive, biomedical/health, industrial, and voice-first applications (such as smart speakers) will support this upward trajectory. With so much growth ahead of us, how will the design and manufacture of MEMS keep pace with industry demand for higher levels of innovation and integration, lower cost and lower power, smaller footprints, and faster design cycles — all while meeting acceptable price points?We turned to a handful of MEMS manufacturing experts from SEMI-MSIG who will join us at SEMICON West 2019, July 9-11 at the Moscone Center in San Francisco, to explore the complexities of keeping pace with market demand for MEMS over the next decade.Address the Design GapMentor GM, ICDS Division Greg Lebsack and SoftMEMS President Mary Ann Maher see tremendous progress in the manufacturing supply chain for MEMS. At the same time, they acknowledge the significant gap that still exists in design capability for creating the billions of interconnected sensors required for future applications. Greg and Mary Ann will dive into the standards, ecosystem requirements and collaborative design solutions that will allow the micro-sensors industry to meet demand for next-generation wearables, Internet of Things (IoT) products and medical devices.Get Collaborative with Greg and Mary Ann: Addressing the Design Gap to Enable Next Generation Sensor-Based Products, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 10:35-11:00 a.m. Register today.Get to a Really Big NumberFrom thousands of sensors and actuators in a single airplane to hundreds in a single car or a piece of factory equipment to the twenty-plus that ship in each of the hundreds of millions of the world’s smartphones, we aren’t even close to reaching the saturation point for these intelligent devices. SPTS Technologies EVP GM David Butler isn’t living on the Spaceship Enterprise (or the Millenium Falcon, come to think of it) when he says that we are going to get to a trillion sensors. It is going to happen. The questions are: how and when?Connect with David: Enabling the Age of a Trillion Sensors, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:00-11:25 a.m. Register today.Shift to Automotive-GradeDemand for optical sensing technologies such as LIDAR is shifting sensor manufacturing requirements from consumer- to automotive-grade, with its enhanced lifetimes, temperature cycling and higher performance specifications. To meet demand, manufacturers are turning to wafer-level processing, since it complies with the hermetic sealing and dew-point control required for the more rigorous automotive-grade applications. EV Group Business Development Director Thomas Uhrmann, Ph.D., will provide an overview of the steps for manufacturing optical elements, including integration with CMOS circuitry, as he offers a window into the future of automotive packaging for sensors.Tune in with Thomas: Future Manufacturing Requirements for Automotive and Photonics Sensing, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:25-11:50 a.m. Register today. Measure Twice, Cut OnceFaster time-to-market, improved device yield, and greater productivity in high-volume manufacturing are increasingly critical requirements for MEMS manufacturers. When a single manufacturing error can cost hundreds of thousands if not a million or more dollars — as well as months of development time — designers can save both time and cost by employing an integrated approach to MEMS design. Lam Research Sr. Director of Strategic Marketing David Haynes will explain how simulation, verification and process modeling can address MEMS-specific engineering challenges such as multi-physics interactions, process variations, MEMS + IC integration, and MEMS + package interaction. Using the right tools before committing to actual fabrication can make or break a project.Get Conceptual (and Practical) with David: Enabling Better MEMS from Concept to High-Volume Production, SEMICON West, TechTALKS South, Thursday, July 11, 2019, 11:50 a.m.-12:15 p.m. Register today.Navigate a Dynamic Foundry LandscapeWe’re still living in a one product-one process world when it comes to MEMS manufacturing. This makes bringing a new device to market both time-consuming and expensive. These challenges aside, the functional capabilities of MEMS, combined with small-footprint and low-power options, have made MEMS increasingly popular. How are market dynamics in MEMS manufacturing evolving to accommodate both demand for high-volume, lower-cost products such as MEMS microphones as well as high-value, lower-volume products such as biomedical devices, IoT products and industrial sensors? Rogue Valley Microdevices Founder CEO Jessica Gomez will explain how foundry consolidation through acquisition, collaboration with other ecosystem players, and specialization in vertical markets such as biomedical or optical are some of the approaches that are transforming the MEMS foundry landscape.Join the Evolution with Jessica: Consolidation, Collaboration, Specialization: How Will MEMS Fabs Manage Changing Dynamics, TechTALKS Stage South, Thursday, July 11, 2019, 12:15-12:40 p.m. Register today.i“Status of the MEMS Industry report,” Yole Développement (Yole), 2019 Edition.Maria Vetrano is a public relations consultant at SEMI.
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For nearly two decades, Sean Ding, CTO and chief scientist of Alibaba Cloud IoT, has worked in software and algorithm architectures, sensing, semiconductors, systems and cloud computing – all areas that have contributed to the rise of the Internet of Things (IoT). It’s no surprise, then, that Alibaba is leading next-generation innovation for the IoT. Ding will bring his expertise to his role as moderator of Brave New World - MSIG Conference on AI+IoT 2019, a half-day forum March 20, 2019, at SEMICON China in Shanghai, China. Maria Vetrano of SEMI spoke with Ding about technologies key to the IoT era including MEMS, sensors, artificial intelligence (AI), edge gateways and cloud computing. SEMI: MEMS sensors are widely used in IoT devices. What is the relationship between AI and MEMS sensors?DING: While MEMS sensors and AI will increasingly co-reside in end-user devices, I do not recommend adding AI next to the sensor (in the same package). That’s because designers continue to use the ASIC for signal conditioning, so A/D converters are still required. Rather, we should look to edge gateways to carry the majority of the workload, including deep learning, because this reduces system complexity and power consumption.SEMI: Why are smarter sensors shifting data processing and analytics to the edge of IoT devices?DING: Data processing and analytics are very important for IoT devices, but we need to focus on understanding the data, parameter calibration and more. The MEMS sensor industry should leave big data analytics to edge computing and cloud computing because AI requires deep learning, demanding a huge amount of data.The challenge is to find the sweet spot for data processing right next to the sensor element.SEMI: What is China’s evolving role in innovation in MEMS sensors for IoT devices?DING: At present, the MEMS community in China needs to figure out how to innovate instead of copying existing technologies, a low-margin business that will not help to grow the industry. One reason why I am so pleased to see the MSIG Conference on AI+IoT in China is that it will encourage greater creativity in the MEMS community in China, and this will ultimately lead to Chinese companies and R D institutions leading innovation rather than copying it.SEMI: What is the right approach to combining smart MEMS sensors with AI in IoT devices? Why is this important for both domestic Chinese and international markets?DING: Combining data from sensors with cloud-edge computing is the right approach. As sensor companies increasingly provide end-to-end solutions, such as “sensor+ firmware + SaaS + app,” we will realize easier and faster integration of sensors in IoT applications.This is incredibly important because China today is the world’s biggest market for IoT hardware. China has 2,000-plus design houses, 200-plus OEMs and thousands of distributors. That said, we still see a highly fragmented market that will benefit from a faster integration methodology.Faster integration of MEMS sensors and AI/machine learning for IoT hardware will benefit designers in international markets as well.SEMI: What do you hope MISG Conference on AI+IoT attendees will take away from the forum? DING: MEMS sensors are highly fragmented, reflecting the highly fragmented applications in which they play. The MEMS sensors industry should figure out how to provide one-stop-shopping solutions for vertical markets. This will speed the scalability of applications and expedite the growth of sensor production. Sean Ding (柯镇) will moderate Brave New World - MSIG Conference on AI+IoT 2019 at SEMICON China on Wednesday, March 20, 2019, at Kerry Hotel Pudong in Shanghai, China.This conference has been organized by the MEMS Sensors Industry Group (MSIG). Register today to connect with Sean Ding and featured speakers at the event.Speakers at the MSIG Conference on AI+IoT 2019 at SEMICON China include: Welcome and Introduction / 欢迎辞Carmelo Sansone, Director, MEMS Sensors Industry Group (MSIG), a SEMI technology community AI Needs Accurate Data – MEMS Sensors Can Provide It / MEMS传感器为人工智能提供真实数据Andrea Onetti, Group VP of Analog MEMS Group, GM of MEMS Sensor Division, STMicroelectronics Enhanced IoT Edge by Smart Sensors / 智能传感器助力IoT边缘智Bennini Fouad, Regional President Asia Pacific, Bosch Sensortec Horizon AI Processor Solution, Enable Industries in AI Time / 地平线AI芯片解决方案,赋能千万业Carl Zhang 张永谦, General Manager/VP, Smart Chip Solutions Division, Horizon Robotics Inertial Sensors in AI Applications / 运动传感器AI应用案例Ben Lee 李彬 , CEO, mCube Ultra-Low-Power Solutions: an Ecosystem Approach / 超低功耗的生态链解决方案Carlos Mazure, IEEE Fellow, Chairman Executive Director, SOI Industry Consortium High-Integrity, Fault-Tolerant Open Inertial Measurement Platform for AI-based Vehicle Automation / 适用于人工智能车辆自动控制的高集成及容错的惯性测量开放平台Dan Dempsey, Senior Director of Automotive, ACEINNA Maria Vetrano is a public relations consultant at SEMI.
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4 Key Takeaways from SEMI Taiwan Member ForumThe rapid development of artificial intelligence (AI) has accelerated the digital transformation in various industries and has now fused with Internet of Things (IoT) to exploit the value of both technologies in reshaping the electronics industry value chain. As it emerges from the shadows of its parent technologies, AIoT is giving rise to new opportunities in manufacturing, healthcare, transportation, and even energy. AIoT is fast rising in prominence as an enabler of key electronics manufacturing process improvements and the creation of add-on value to existing products – both critical to the success of many businesses.SEMI and the SEMI MEMS Sensors Industry Group (SEMI-MSIG) held a technical forum on smart sensing and its applications in AI and AIoT, inviting renowned experts in sensors and edge computing to share in-depth insights into the latest AIoT technologies and applications with more than 100 industry professionals in research and development, marketing and sales. Here are four key takeaways from the SEMI Taiwan member forum.1. Steady Growth for Global Sensors MarketThe global sensors market’s steady growth is expected to expand at a CAGR of 6.6 percent from 2017 to 2023, with Asia driving the biggest gains and automotive leading the segments – including healthcare and education – with the strongest growth. Automotive alone is expected to reach US$34 billion in 2023.2. Integration Critical to MEMS Sensors DesignsWith AI booming, MEMS sensor designs need to drive toward greater integration —not only integrating data collection with sensors, but also streamlining data processing on the backend – making 3D models of today’s MEMS mechanical designs critical. The differences between 3D and entrenched 2D models are dramatic, elevating the importance of specifying manufacturing steps in MEMS designs. As new sensors and applications continue to emerge, companies that develop the most powerful integrated designs will win. 3. Growth of Smart Voice-Control Applications to ExplodeAIoT is also accelerating the development of smart voice-control applications and the rise of new related business opportunities. Just 50 million voice-controlled devices shipped worldwide in 2017, a number predicted to swell to 436 million in 2021 with smart home devices such as set-top boxes and smart TVs the major growth drivers.4. AIoT Eyed to Make Human-Robot Collaboration SafeSafety is an essential feature for human-robot collaboration. Tactile sensing technologies give robots a layer of “skin” with capabilities rivaling human touch. To ensure humans and robots work together safely in work environments, sensors on this layer of skin are concentrated – less than 8mm apart, equivalent to the width of a human finger, with a response time of less than 5ms on contact. More than 4 million robots worldwide are expected to be upgraded with these sensing technologies and are on track for deployment in pilot plants in the next three years.SEMI-MSIG is committed to strengthening connections across all sectors in the MEMS and sensors supply chain, working closely with the industry to accelerate the development of related technologies and applications in both mature and emerging markets. In addition, SEMI-MSIG hosts regular events to inspire business opportunities and technology exchange for innovative applications, while enhancing the visibility of members among global customers and partners to help them forge new partnerships. To join the group, contact SEMI Taiwan’s Helen Chen at [email protected] Yi is a marketing specialist at SEMI Taiwan.
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