3D sensing

MEMS actuators transform electronic signals into something that can be sensed or touched by the end user of an electronics device. A case in point: MEMS actuators such as print heads in inkjet printers transform electronic files into text or beautiful images. In 3D printers, actuators can produce real objects. Inside smart glasses, tiny MEMS mirrors can create virtual objects. Little surprise, then, that integrating these powerful devices into the end products is a multidisciplinary enterprise. STMicroelectronics has been successfully leading the deployment of dedicated MEMS actuator solutions with customer products in various market segments. SEMI spoke with Anton Hofmeister, group vice president and general manager of the MEMS Actuator Division at STMicroelectronics, about MEMS actuator trends. Hofmeister shared his views at the SEMI MEMS Imaging Sensors Forum as part of the virtual SEMI Technology Unites Global Summit. Watch the STMicroelectronics’ presentation on-demand until March 26, 2021. Registration is open. SEMI: What is the difference between MEMS devices that sense and MEMS devices that actuate? Hofmeister: MEMS sensors gather data from the world around us including motion, pressure and air temperature and transform them into an electrical signal. Actuators work the other way round. They receive an electrical signal and transform it into some well-controlled actuation such as ejecting a fluid, moving a membrane or deflecting a laser beam. SEMI: How can MEMS actuators’ integration be simplified to be embedded in new applications so they appeal to consumers? Hofmeister: The challenge of integrating MEMS sensors into devices has been simplified by demo kits and evaluation boards, which customers use to embed the sensor into a system. MEMS actuators are more difficult to integrate. They often power the core function of a system and therefore require deep system understanding. Reference designs are a big step forward in simplifying integration. My presentation at the SEMI MEMS Imaging Sensors Forum showcased some examples. MEMS micro-mirror projection for augmented reality (AR) glasses is an example of a complex system that requires multiple types of components to function. Together with several partners, STMicroelectronics recently announced the LaSAR Alliance, which will develop reference designs to enable the AR glasses market. SEMI: MEMS sensors and actuators are considered the backbone of many consumer products. Are MEMS actuators also mostly used in automotive? Hofmeister: The widest use of MEMS actuators has so far been in print heads for inkjet printers. In recent years, we have seen actuators adopted in emerging applications ranging from piezo heads for 3D printers to MEMS mirrors for laser beam scanning systems or 3D sensing solutions for consumer applications. The first high-volume application in automotive will likely be MEMS mirrors for LIDAR systems. SEMI: What market growth trends do you see for MEMS sensors and actuators? Hofmeister: The sensorization trend, which aims to collect data from homes, cities, factories, cars and personal devices, continues to drive the adoption of sensors and actuators for a wide variety of applications. While the last wave of MEMS growth was triggered by one end product – the smartphone – the next wave will be driven by multiple applications and use cases in industrial, medical, automotive and personal electronics. SEMI: How can technology unite us? Hofmeister: In recent months, we have all experienced vividly how vital technology has become. MEMS, and semiconductors in general, are an integral part of many products and services that make our lives easier. Communications technologies have been particularly important during this pandemic, whether using the personal devices as our interface to the digital world or the complex infrastructure that they operate through. I hope that my participation at the summit helped increase awareness of the new possibilities and opportunities that technologies like MEMS actuators have to offer to create products and services that further improve people’s lives. Anton Hofmeister is group vice president at STMicroelectronics, general manager of the company’s MEMS Actuator Division and managing director of its German subsidiaries. Hofmeister has been with STMicroelectronics for more than 30 years, working in Germany, France, the U.S. and Italy. He has held managerial positions in key account management, product and strategic marketing, advanced R D and general management. For the past 10 years, he has managed various product divisions in the MEMS sector. Hofmeister has also served as a board member of the Singapore-based molecular diagnostics company Veredus Laboratories. Serena Brischetto is senior manager of Marketing and Digital Engagement at SEMI Europe.

SEMI spoke with Dr. Mikko Söderlund, sales director for Beneq’s semiconductor business, about trends in Atomic Layer Deposition (ALD) applications. Söderlund shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet Beneq and other key industry influencers. Registration is open.SEMI: The Backside Illuminated (BSI) CMOS Image Sensors (CIS) market continues to experience steady growth. Which applications are currently driving market growth?Söderlund: BSI CMOS Image Sensor market continues to be driven by mobile, security, automotive and Internet of Things (IoT) applications – so there seems to be plenty of opportunities for BSI CIS market to grow further.SEMI: What is critical for advanced thin-film deposition methods to extract best electrical performance?Söderlund: It is critical to control the material properties of the deposited layer (such as charge density, resistivity or barrier property) and of course, film uniformity and conformality. Furthermore, controlling material interfaces is also important, especially for sensitive III-V materials. {% video_player "embed_player" overrideable=False, type='scriptV4', hide_playlist=True, viral_sharing=False, embed_button=False, width='350', height='197', player_id='12721134435', style='margin: 0px auto; display: block; float: right; margin-left: auto; margin-right: auto; width: 350px;' %} Coatings and material features based on existing standard techniques can be very expensive, or not feasible at all. What does Atomic Layer Deposition (ALD), as a thin film coating method, offer in particular?Söderlund: ALD offers dense, highly conformal and pinhole-free best-in-class functional layers for dielectrics, passivation, encapsulation and much more. As a gentle and precise layer-by-layer method, ALD is extremely well-suited for deposition of such performance critical layers over large surface areas such as a cassette of wafers.SEMI: Please describe the Atomic Layer Deposition (ALD) coating process. Söderlund: ALD is based on a self-limiting surface reaction controlled thin film deposition. During coating, two or more chemical vapors or gaseous precursors react sequentially on the substrate surface, producing a solid thin film (see schematic below). Most ALD coating systems use a flow-through traveling wave setup, where an inert carrier gas flows through the system and precursors are injected as very short pulses into this carrier flow. The carrier gas flow takes the precursor pulses as sequential waves through the reaction chamber, followed by a pumping line, filtering systems and, eventually, a vacuum pump.SEMI: What are the two leading edge ALD applications?Söderlund: Today’s leading-edge ALD applications are in logic (high-k/metal gate, multiple patterning) and memory (DRAM capacitor, 3D NAND). Within the More-than-Moore (MtM) markets, CIS and MEMS (actuators and sensors, RF) have been early adopters of ALD, and we also see ALD being introduced in GaN Power and RF, as well as photonics.SEMI: Give us one prediction about the opportunities offered by advanced imaging applications.Söderlund: The large diversity of imaging applications will continue to drive growth and innovation. For example, machine vision is expected to transform the imaging landscape. We see this as a big opportunity for advanced thin-film deposition methods such as ALD, provided that the tools are versatile enough to address the diverse manufacturing requirements.SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why do you invite your peers to attend? Söderlund: The summit brings together all key RF stakeholders in the MEMS and imaging sensors industry, and we are looking forward to a great event. It’s a special event for us as we are officially launching a new ALD cluster tool product specifically engineered for the MtM applications – so this brings great excitement that we want to share with the attendees.Dr. Mikko Söderlund is Sales Director for Beneq’s semiconductor business. He has more than 20 years of experience in product development, product management, technical sales and business development across the photonics, OLED, and semiconductor industries. Mikko received his Ph.D. in Micro- and Nanotechnology from the Helsinki University of Technology. Serena Brischetto is a marketing and communications manager at SEMI Europe.

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on in-process warp control, as well as the associated production methodology that provides rapid prototyping and high-volume manufacturing. We spoke ahead of his presentation at the 3D Systems Summit, 28-30 January, 2019, in Dresden, Germany. To register for the event, please click here.SEMI: What is Corning’s mission and vision and your role within the company?Zhang: Corning is one of the world’s leading innovators in materials science with a track record of 165+ years of life-changing innovations. We excel in glass science, ceramics science, and optical physics and succeed through sustained investment in RD E. Our products include Corning® Gorilla® glass, a durable material used on more than six billion mobile devices worldwide, and industry-leading LCD glass for display applications. We have recently dedicated a unit of the company called Precision Glass Solutions to address the emerging need for glass in the semiconductor industry. Here we apply Corning’s long history of glass science expertise and deep customer relationships in consumer electronics to support cutting-edge applications like wafer-level optics for precise 3D sensing and carrier solutions for temporary bonding applications in semiconductor manufacturing. It’s our most recent work in the Carrier Solutions product line that I’m excited to present: a new carrier glass product optimized for fan-out, called Corning Advanced Packaging Carriers.SEMI: What projects are you currently working on that you think will make a difference in 2019?Zhang: My team is excited to introduce Corning Advanced Packaging Carriers this year. This is a new line of product within our portfolio of Carrier Solutions. These ultra-flat glass carriers are specially developed to reduce customers’ challenge of in-process warp by up to 40 percent, which in turn helps advanced packaging customers achieve better yield.Corning Advanced Packaging Carriers feature high-stiffness properties and are available in a wide range of coefficients of thermal expansion (CTE) in fine granularity. These attributes help customers select an ideal glass carrier that will minimize in-process warp for their package. Furthermore, we make sample quantities of these carriers available in just four to six weeks to help maximize efficiency during customers’ R D process.My team is excited about the potential of this new product, but also encouraged by our results. We have already supplied this product and have heard from one of the largest semiconductor companies in Taiwan that it has reduced in-process warp by as much as 150μm.SEMI: Your presentation at the 3D Systems Summit will focus on Agile Manufacturing of Glass Carriers for Advanced Packaging. What exactly will you be sharing?Zhang: There is a lot of interest right now in using glass as a carrier substrate in temporary bonding applications in advanced semiconductor packaging – especially in fan-out processes. We also know that in-process warp is a significant challenge to companies pursuing advanced packaging because different CTE materials are added during the process. My team has done a lot of work to understand the impact that an ideal CTE glass carrier substrate can have on minimizing in-process warp. We have studied the available levers – both theoretical and in real-life fab environments – that can help address this challenge. I will present our findings on how it is possible to select a glass carrier with the ideal CTE and Young’s modulus to reduce in-process warp by up to 40 percent, and how Corning has developed an agile manufacturing platform to support customers with these ideal carriers from their R D stage through mass production.SEMI: What do you think will be a hot topic in the next few years?Zhang: We expect high-end fanout technology to address more applications beyond just mobile APs. There is also an interesting dynamic playing out between wafer-level and panel-level fan-out technologies. Corning is active in both areas. In developing and offering high performance glass carriers, we hope to help enable our customers to expand the fan-out applications space.SEMI: What are your expectations regarding the summit in Dresden, and why do you recommend your members and other industry leaders to attend the 2019 3D Systems Summit?Zhang: Europe is where some of the most advanced packaging technologies are born. Fan-out also saw early commercialization there. I hope to meet many scientists and technologists at 3D Systems Summit and exchange technical and business ideas. We also hope to get early feedback from other attendees about the value of our new product offering. Serena Brischetto is a marketing and communications manager at SEMI Europe.