RF

Areas packed with dense foliage. Mile-deep mines and tunnels. Urban canyons. Indoor environments. Global Positioning System (GPS) technology has long been a boon to location tracking of aerial, terrestrial and aquatic vehicles — as well as to people in motion — but in many cases it can’t function with a high degree of reliability, either because the GPS signal is somehow obstructed, or worse, is jammed or spoofed. Delivering higher precision and higher reliability in GPS-denied environments — as well as immunity to jamming and spoofing — positioning, navigation and timing (PNT) represents the next evolutionary step in location positioning and tracking. With PNT so critical to a range of defense, commercial and industrial applications — and with sensors the building blocks of PNT solutions —the MEMS Sensors Industry Group, a SEMI Technology Community, is ensuring that our members play a transformative role in PNT innovations. We’ve secured $14.9 million in research dollars for PNT R D over the past 18 months, marking Phase I of a project funded through a public-private consortium with the U.S. Army Research Laboratory (ARL). With the typical funding structured as a 50/50 cost share with the industry participant, the research dollars go farther, and the level of commitment that each recipient makes is more pronounced. As we look ahead to Phase II of the MSIG PNT R D project, the details of which we’ll announce later this year, we’d like to reflect on the companies and research labs that won bids through a competitive process supported by the SEMI-MSIG PNT Technical Advisory Council and the SEMI-MSIG PNT Governing Council. Winners submitted proposals that both met our criteria for advancing PNT technologies relative to mobility, size and weight, and that laid a path toward greater cost efficiency and lower product price. “PNT doesn’t displace GPS,” said Tim Brosnihan, executive director of SEMI-MSIG. “Rather, getting the two technologies to work together improves position and tracking. While current PNT solutions use inertial measurement units, or IMUs, to effectively maintain positioning accuracy in the absence of a GPS signal, it’s also true that accumulated bias and noise-related errors in the IMUs make positional determination unreliable. Like most great pairings, GPS and PNT can work together. We can use IMUs when GPS is unavailable, and when GPS returns, it can be used to reset the IMU errors. So when the GPS signal is lost again, the IMU can maintain navigation and location. “We’re focusing this PNT project on technologies that will allow accurate positional determination in the absence of a reliable GPS signal for prolonged periods,” added Brosnihan. Here are snapshots of the 10 companies and research institutions that won awards for their PNT-focused developments. Analog Devices is developing an optimal size, weight, power, and cost (SWaP-C) solution for applications requiring high-accuracy navigation and uncompromised reliability. The company’s mode-matched navigation-grade gyroscope with system ID leverages an innovative sensor and its associated process design, a robust high-volume manufacturing flow, and system-control algorithms to achieve very high-performance (0.01 degree/hour bias instability and 0.005 degree/√hr angle random walk). Carnegie Mellon University (CMU) is developing a CMOS MEMS high-stability accelerometer through machine learning (ML). If embedded in footwear, these ML-optimized accelerometers could be used in personal navigation. If embedded in a golf ball, baseball or hockey puck, the accelerometer could extract the trajectory of the object in motion by measuring its shock (force). The CMU device validates state-of-the-art performance of the university’s high-dynamic-range accelerometer systems-on-chip. It also validates and tests ML models by measuring the accelerometer and auxiliary sensor output over long time periods (e.g., 1 hour, 10 hours, days) to collect independent long-duration time-series data. By modeling drift from environmental influences — along with possible overall system changes from extreme events, such as high-temperature excursions and shock — designers can dramatically reduce navigation errors to support more accurate navigation over longer time periods. GE Research is developing a novel MEMS gyrocompass that will enable high-end north-finding systems, traditionally unaffordable for automotive and consumer applications. The device will be available in mass-market applications such as robotics and autonomous vehicle navigation in GPS-denied environments. The MEMS gyrocompass enables a 10x reduction in SWAP-C with high accuracy. An additional benefit of this work is that GE will offer a foundry service process development kit (PDK) for its Polaris MEMS process, speeding the development and manufacture of MEMS devices in an advanced processing facility. Georgia Institute of Technology is developing high-aspect-ratio monocrystalline silicon carbide-on-Insulator (SiCOI) MEMS devices that will reduce navigation angle errors, potentially making widescale pedestrian navigation available in mass-market applications such as smartwatches and smartphones. The platform for ultra-high-performance bulk acoustic wave (BAW) gyroscopes and timing resonators will feature material properties that allow a much better structural symmetry and a higher-resonant quality factor (Q) than silicon MEMS (Si MEMS). Honeywell is working to enhance the navigation accuracy of commercial and military vehicles in GPS-denied environments through an innovation that dramatically improves the performance of a MEMS IMU by both refining candidate ML algorithms, including recurrent neural networks (RNNs), and by combining deep neural network (DNN)-based calibration and sensor fusion algorithms. PARC is developing a new materials platform for photonic integrated circuits (PIC). Aluminum gallium nitride (AlGaN), an ultra-wide bandgap semiconductor, is epitaxially grown to produce single-crystal layers for fabrication of optical components, such as waveguides and micro-ring resonators for optical signal processing. The project includes design and fabrication of specialized laser diodes at wavelengths needed to probe qubits based on atomic ions (e.g., strontium and ytterbium). The new platform offers several benefits: low optical loss from the ultraviolet (UV) to infrared spectral bands excellent non-linear optical properties for efficient frequency-generation processes (e.g., optical frequency combs); and enabling technology to realize compact, field-deployable quantum systems for PNT applications, such as ultra-fast distance measurements, microcombs for optical atomic clocks, photonic radar, optical coherence tomography, and coherent communications — all applications that benefit from the lower cost and small chip size of these integrated photonic circuits By expanding its proprietary EpiSeal encapsulation process to include new materials and topologies, SiTime is developing low-impedance and low-noise MEMS resonators with an ultra-stable wafer-level package. Because these novel MEMS resonators are highly reliable and very compact — while using less power and providing lower RF noise — they’re ideal for 5G RF timing applications, IoT devices, and smart vehicles. Teledyne Scientific Imaging (CSAC project) is conducting a study to identify paths to reduce the cost of battery-operated chip scale atomic clocks (CSAC) that provide affordable precision timing for denied environments. The project goal is to identify viable paths of reducing cost by an order of magnitude, without sacrificing performance. In addition to exploring design and manufacturability solutions, project researchers are performing short loop experiments as proof-of-concept validation. Through a second award, Teledyne Scientific (IMU project) is advancing packaging and integration for compact, navigation-grade six degrees of freedom (DOF) MEMS IMUs. Featuring reduced bias instabilities associated with packaging stresses and ambient temperature influences, the Teledyne Scientific IMUs promote environmentally robust low-stress packaging of wafer-level vacuum packaged (WLVP) MEMS gyro resonators, facilitating a lower-cost, smaller and more accurate IMU for performance-driven PNT applications. Twinleaf is developing a new light source module ideally suited for integration directly into quantum sensors. This project integrates a bright, tunable distributed Bragg reflector (DBR) near infrared (IR) 795nm wavelength laser made by the project’s subcontractor (Photodigm) into a package that locks the laser to an atomic reference line in a microfabricated vapor cell. The laser module’s high-output intensity and low magnetic signature will enable breakthrough performance levels for Twinleaf’s magnetometer and other quantum sensors requiring the light source integrated into the sensor module. Request for Proposal for Phase II of SEMI-MSIG PNT Program Opens Q4 2021 SEMI-MSIG will accept request for proposal (RFP) submissions for Phase II of its PNT program starting in Q4 2021. This year, in addition to funding IMU and timing device projects, MSIG will also consider proposals on imaging-based navigation solutions. If you’d like to submit for Phase II, sign up to receive more information on the RFP by visiting SEMI’s R D Programs page. You can also connect with Paul Carey by email, [email protected] or LinkedIn. Paul Carey, Ph.D., is the director of the MEMS Sensors Industry Group. With deep domain expertise in X-ray imaging backplane platforms — and their supply-chain technologies such as flexible substrates, laser annealing for semiconductors and silicides, thin film transistors (TFT) for flexible OLED displays, and polysilicon-on-plastic TFT technology — Carey has held technical leadership positions at dpiX, Applied Materials, and Lawrence Livermore National Laboratory. He received a double-major B.S. from UC Berkeley in Electronical Engineering and Computer Science (EECS), and Materials Science and Engineering (MSE). Carey holds an M.S. in EECS from UC Berkeley and a Ph.D. in MSE from Stanford University.

SEMI spoke with Dr. Mikko Söderlund, sales director for Beneq’s semiconductor business, about trends in Atomic Layer Deposition (ALD) applications. Söderlund shared his views ahead of his presentation at SEMI MEMS Imaging Sensors Summit, 25-27 September, 2019, at the WTC in Grenoble, France. Join us at the event to meet Beneq and other key industry influencers. Registration is open.SEMI: The Backside Illuminated (BSI) CMOS Image Sensors (CIS) market continues to experience steady growth. Which applications are currently driving market growth?Söderlund: BSI CMOS Image Sensor market continues to be driven by mobile, security, automotive and Internet of Things (IoT) applications – so there seems to be plenty of opportunities for BSI CIS market to grow further.SEMI: What is critical for advanced thin-film deposition methods to extract best electrical performance?Söderlund: It is critical to control the material properties of the deposited layer (such as charge density, resistivity or barrier property) and of course, film uniformity and conformality. Furthermore, controlling material interfaces is also important, especially for sensitive III-V materials. {% video_player "embed_player" overrideable=False, type='scriptV4', hide_playlist=True, viral_sharing=False, embed_button=False, width='350', height='197', player_id='12721134435', style='margin: 0px auto; display: block; float: right; margin-left: auto; margin-right: auto; width: 350px;' %} Coatings and material features based on existing standard techniques can be very expensive, or not feasible at all. What does Atomic Layer Deposition (ALD), as a thin film coating method, offer in particular?Söderlund: ALD offers dense, highly conformal and pinhole-free best-in-class functional layers for dielectrics, passivation, encapsulation and much more. As a gentle and precise layer-by-layer method, ALD is extremely well-suited for deposition of such performance critical layers over large surface areas such as a cassette of wafers.SEMI: Please describe the Atomic Layer Deposition (ALD) coating process. Söderlund: ALD is based on a self-limiting surface reaction controlled thin film deposition. During coating, two or more chemical vapors or gaseous precursors react sequentially on the substrate surface, producing a solid thin film (see schematic below). Most ALD coating systems use a flow-through traveling wave setup, where an inert carrier gas flows through the system and precursors are injected as very short pulses into this carrier flow. The carrier gas flow takes the precursor pulses as sequential waves through the reaction chamber, followed by a pumping line, filtering systems and, eventually, a vacuum pump.SEMI: What are the two leading edge ALD applications?Söderlund: Today’s leading-edge ALD applications are in logic (high-k/metal gate, multiple patterning) and memory (DRAM capacitor, 3D NAND). Within the More-than-Moore (MtM) markets, CIS and MEMS (actuators and sensors, RF) have been early adopters of ALD, and we also see ALD being introduced in GaN Power and RF, as well as photonics.SEMI: Give us one prediction about the opportunities offered by advanced imaging applications.Söderlund: The large diversity of imaging applications will continue to drive growth and innovation. For example, machine vision is expected to transform the imaging landscape. We see this as a big opportunity for advanced thin-film deposition methods such as ALD, provided that the tools are versatile enough to address the diverse manufacturing requirements.SEMI: What are your expectations for SEMI MEMS Imaging Sensors Summit and why do you invite your peers to attend? Söderlund: The summit brings together all key RF stakeholders in the MEMS and imaging sensors industry, and we are looking forward to a great event. It’s a special event for us as we are officially launching a new ALD cluster tool product specifically engineered for the MtM applications – so this brings great excitement that we want to share with the attendees.Dr. Mikko Söderlund is Sales Director for Beneq’s semiconductor business. He has more than 20 years of experience in product development, product management, technical sales and business development across the photonics, OLED, and semiconductor industries. Mikko received his Ph.D. in Micro- and Nanotechnology from the Helsinki University of Technology. Serena Brischetto is a marketing and communications manager at SEMI Europe.

Shenyang is on an unwavering path to maturing its integrated circuit (IC) equipment manufacturing industry over the next few decades in response to the Made in China 2025 Strategy. Since the strategy’s introduction in 2015, the city, long a transportation and commercial hub of China's northeast, has built out a complete integrated circuit industrial chain integrating technical research and innovation, components and parts processing, and equipment manufacturing. Its ambition is to compete on the world stage.Shenyang has implemented policies and provided funding to support the development of its IC equipment and related industries to buttress the development of emerging industries. Speaking at the SEMI China Members Day 2019 in Shenyang, Zheng Guangwen, secretary-general of ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance, said that the city, as a key IC equipment industry base in the upstream of China’s industrial chain, hopes to enter the international community in part by leveraging SEMI’s global platform. Zheng Guangwen, Secretary General, ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance More than 150 representatives from member companies gathered at SEMI China Members Day 2019 to discuss China’s semiconductor industry investment and capital dynamics and semiconductor market trends. The event sought to promote stronger communication and interaction between the upstream and downstream of the semiconductor industry chain. The forum was co-sponsored by SEMI China and Shenyang Science and Technology Bureau and co-hosted by ICMTIA and Shenyang IC Equipment Industry Technology Innovation Strategic Alliance. Lung Chu, President of SEMI China Opening the event, Lung Chu, president of SEMI China, set stage for the discussion by noting that global semiconductor industry has been booming since 1957, reaching another record high of $470 billion in sales last year as it faced a critical juncture, with industry growth slowing in the first half of 2019. The slowdown was predictable and is temporary, a natural stage in the industry’s cyclicality. From a macro point of view, the development of advanced technology requires huge investment. There was an obvious gap in investment between enterprises, which often leads to the stronger become much stronger. Under these circumstances, it is very important for China to master key technologies and products during the process of catching up and surpassing. Each region should focus on its strengths.Enterprises should do their own business in a low-key way and keep a prudent and optimistic attitude. The number of SEMI China members has reached a new high. SEMI China is committed to becoming the best partner to realize China's semiconductor dreams. In promoting the development of global semiconductor industry and China's semiconductor industry, SEMI has continuously gathered strength and actively organized rich activities to promote the sustainable growth of Chinese semiconductor enterprises through international cooperation. Zhao Rigang, Director of SCTB, Shenyang Science and Technology Bureau Zhao Rigang, director of SCTB at Shenyang Science and Technology Bureau, pointed to the importance of SEMI’s pivotal role and global influence in cultivating cooperation between international and domestic industries including Shenyang’s IC sector. Speaking at the SEMI China Members Day 2019 in early June, Rigang said the growing importance of chips in China is a key catalyst for Shenyang’s rise as semiconductor sectors domestically and abroad invest heavily in a new generation of information technologies such as mobile Internet, cloud computing, big data, Internet of Things. Kang Jin, General Manager, SMIC Beijing For China’s semiconductor industry to flourish, the region must improve its IC supply capacity just as it has brought its PV industry to full maturation, said Kang Jin, general manager of SMIC Beijing. The key to developing China's integrated circuit industry, he said, lies in building a robust semiconductor supply chain. Zong Runfu, Chairman and General Manager, KINGSEMI Semiconductor Equipment Supply Chain DevelopmentLocalization has enabled KINGSEMI to optimize its technology design capabilities to produce high cost-performance equipment for greater competitive advantage, saidZong Runfu, chairman and general manager of KINGSEMI. While the localization rate of supply chain construction was over 50 percent, the localization rate for front-end equipment is still low. Zong Runfu said localization is imperative not only to lowering costs, but also to ameliorating the supply-guarantee rate, maintaining quality and shortening the delivery cycle. Russell Li, VP of Marketing and Business Development, WLCSP Packaging Solutions for 3D Active Sensing DevicesInternet of Things (IoT), artificial intelligence (AI), 5G and other technologies are starting to become a part of daily life as more sensors find their way into new retail stores and smartphones, a trend that will continue as autonomous transportation begins to take hold, said Russell Liu, VP of marketing and business development at WLCSP. The move to bring more human-like capabilities to technology is driving the implementation of perception function in devices, with passive sensors giving way to active sensors and machines translating the physical world into a 3D view through the eyes of a 3D camera. What’s more, the next generation of IoT devices will feature more integrated processors including signal processors, caches, sensors, photons, RF and MEMS, bringing the challenges of miniaturization to system integration. Liu said miniaturization will only be possible by developing advanced packaging technologies that enable highly integrated processors for mobile devices and intelligent automobiles. Wang Ronghua, VP of Technology, Dalian Xinguan Technology Getting Ready for GaN Power Electronics EraGaN offers excellent performance in optoelectronics, RF and power electronics and will coexist with and complement silicon devices for years to come, said Wang Ronghua, VP of Technology at Dalian Xinguan Technology. However, the industrialization of GaN power devices still faces technical challenges in application, reliability, packaging, epitaxy, device and process – all barriers to market adoption. To overcome these hurdles, GaN power devices must meet the reliability and cost-performance requirements of applications to which they are best suited.Ronghau said that GaN power devices, such as cascade and p-GaN enhanced devices, now support end products, proof that the era of gallium nitride has arrived. “Gallium nitride is quite different from silicon in epitaxy, device design and key technology, which requires close integration of upstream and downstream industry chains for effective promotion,” he said. Billy Feng, Executive Director, J.P. Morgan Is the Semiconductor Industry Still Cyclical? Since 2008, the semiconductor cycle has waned, disrupting the traditional thinking of investors, equipment suppliers and logistics channel providers as investors’ appetite for the chip industry investments has grown, said Billy Feng, executive director at J.P. Morgan. The long-term prospects for the semiconductor industry remain bright. But after reaching historic revenue highs in 2017 and 2018, the industry – and investor expectations – will enter a period of adjustment. Dr. Adam He, Executive Director, CGP Tech Fund The unique gene of the semiconductor industry consists of the blend of its lofty requirements for quality, reliability and consistency; cooperation between upstream and downstream sectors; internationalization; and a powerful ambition to innovate, said Dr. Adam He, Executive Director of CGP Tech Fund. He described Chinese chip enterprises he often encounters as falling into one of two entrepreneurial categories – IC experts and cross-border business people. Both want the answer to "how to make money and how to establish a solid competitive position?” He said. Adam believes that accessing the genes of the semiconductor industry is the answer to both questions and crucial to the maturation of China’s chip industry. The genes must be used to strengthen the Chinese manufacturing and materials sectors. Du Shanshan, Senior Analyst, SEMI China SEMI Market Outlook: Fab Investment, Equipment and Materials Market ForecastsEmerging technologies have sparked explosive semiconductor industry growth, said Du Shanshan, a senior analyst at SEMI China. While the industry will see a slight recession in 2019 due to memory market softness, trade wars and other factors, it is on stable footing for the long run. At the same time, China continues to optimize its IC industry chain, and semiconductor design and manufacturing companies have gradually grown in number. Over the next decade, the average growth rate of China's production capacity is expected to exceed 10 percent. Richard Feldman, VP of Global Expositions and Events, SEMI Richard Feldman, vice president of Global Expositions and Events of SEMI headquarters, presented the new SEMI Asia semiconductor business development plan to members and called on companies in mainland China, Taiwan and Malaysia to participate in SEMICON Europe to strengthen the influence of globalization.After the meeting, participants visited KINGSEMI Co., Ltd., Shenyang Piotech Co., Ltd, Shenyang SIASUN Robot and Automation Co., Ltd., Shenyang Fortune Precision Equipment Co., Ltd. and SKY Technology Development Co., Ltd. The event facilitated communications between upstream and downstream companies. SEMI China Member Day 2019 Group Photo Cherry Sun is a marketing manager at SEMI China.

Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Advanced nodes no longer bring the desired cost benefit, and R D investments in new lithography solutions and devices below 10nm nodes are rising substantially. In order to satisfy market demands, the industry is looking for technology solutions to bridge the gap and improve cost/performance while at the same time adding more functionality through integration.More than-Moore devices (including MEMS and sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.In 2017, wafer demand for More than Moore devices1 reached almost 45 million 8-inch eq. wafers. This figure is expected to reach more than 66 million 8-inch eq wafers by 2023, showing an almost 10 percent growth during this period.This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications2, performed by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure and mobile segments, mobile including additional functionalities, voice processing, smart automotive and electrification, AR/VR3, and AI4.For the first time, the market research and strategy consulting company presents a dedicated technology and market analysis focused on the overall wafer demand for More than Moore devices. The aim of this report is to give an overview of wafer shipments for More than Moore devices, from wafer size to semiconductor material substrate type including silicon, glass, SOI5, SiC6, SiGe7, GaN8, InP9, GaAs10, sapphire and ceramic, and thus identify business opportunities in the More than Moore industry.For over 20 years, Yole has been analyzing the industry evolution, discussing with leading companies to understand market challenges, and identifying technical breakthroughs. The Wafer Starts for More Than Moore Applications report is the result of this 20-year research. Yole’s analysts combine technical and market expertise to describe the More than Moore world. Market size (volume and value), substrate sizes and formats, value chain, technology processes and market drivers, business opportunities and competitive landscape are all part of Yole’s analysis.The various research teams at Yole, encompassing power electronics, imaging and sensing, RF and semiconductor manufacturing, collaborate to present an in-depth understanding of the current market evolution, taking into account innovations and emerging businesses. This methodology allows Yole to cover the overall megatrends and illustrate the links between wafer substrate, device, module, sub-system, system and high-end product.Under this dynamic ecosystem, the deployment of renewable energy sources and industrial motor drives as well as the electrification of the automotive industry are good examples of the impact of megatrends on the semiconductor industry development. They are directly impacting the power devices’ wafer market, resulting in an expected 13 percent CAGR between 2017 and 2023. Already in 2017, this market represented more than 60 percent of the overall wafer market for More than Moore devices, and is currently still dominating the More than Moore industry.5G is one megatrend driving wafer demand. 5G is leading the More than Moore evolution, bringing any service to any user, anywhere. Antennas and filtering functionalities are two of the key innovations of this evolution.Without doubt, the stringent requirements of 5G are driving increasing demand for RF components like RF filters, power amplifiers (PAs), and low-noise amplifiers (LNAs) to ensure access to tomorrow’s radio network.This year, Corning and Menlo Micro announced a major agreement to develop a DMS[11] product platform. Both partners propose an innovative approach based on TGV12 packaging technology. According to both partners, this technical choice allows them to cover operation of frequencies beyond 50GHz. Amongst the numerous megatrends, mobility is not far behind 5G. Demand for advanced mobile applications integrating more and more functionality is growing. In order to compete companies are developing smart combinations of devices such as fingerprint sensors, ambient light sensors, 3D sensing, microphones, and inertial MEMS devices. As an example, impressive developments focused on SOI-based NIR sensors have been released by SOITEC for front-side imager applications including advanced 3D image sensors. This technical evolution will clearly contribute, in the near future, to strong growth of the wafer market for MEMS and sensors. Additionally, the automotive industry, with the development of smart cars, has reached a new level of complexity requiring the development and integration of new sensors. In this context, many companies are aiming to extend their capabilities in ADAS13 and autonomous driving. Recently the leading company On Semiconductor acquired SensL Technologies, the leader in SPAD and LiDAR sensing products for automotive. This acquisition is one sign among many highlighting the evolution of this historic industry, searching for new expertise and welcoming new players, more aware of consumer habits and needs.Yole’s analysts expect smart automobiles to drive consistent growth of CIS14 and sensor wafer production over the next five years. It is fueled by the increasing integration of high-value sensing modules like RADAR, imaging, LiDAR and more. Although automotive will be mainly supported by these growth areas, historic MEMS and sensors such as MEMS pressure sensors and inertial MEMS will continue growing at a reasonable rate, supporting the standard automotive world.Yole Group of Companies including Yole, System Plus Consulting, KnowMade, PISEO and Blumorpho follows and analyzes the industry continuously. The Group has developed in-depth expertise and knowledge focused on the semiconductor manufacturing process and markets. Companies of the Group work together to understand the technical issues, identify business opportunities and propose valuable analyses.Yole invites you to an overview of the Wafer Starts for More Than Moore Applications report during the exclusive online event, titled “Wafer Starts for More than Moore Applications – Webcast”. This hourlong webcast takes place on June 28 at 5:00 PM CEST. The market research company will present key results of this report including megatrends, wafer market evolution and technical trends. Moderated by David Jourdan, Sales Coordination Customer Service at Yole, it welcomes the two leading companies, SPTS (an Orbotech Company) and Corning Precision Glass Solutions: "Trends in Wafer Processing Technologies for RF MEMS" – Speaker David Butler, Executive Vice President and General Manager at SPTS Technologies "Benefits of Through Glass Vias for RF applications" – Speaker: Ravij Parmar, New Product Development Manager for Corning Precision Glass Solutions These results will be also presented by the Semiconductor Software team at SEMICON West (Booth #1320), SEMICON Taiwan and SEMICON Europa (Booth #A-4667). Make sure to meet Yole’s analysts and get a valuable overview of the More than Moore industry. Agenda and more information are available on i-micronew.com. Stay tuned!About the authors:Amandine Pizzagalli is a Technology Market Analyst, Equipment Materials - Semiconductor Manufacturing - at Yole Développement (Yole). Amandine is part of the development of the Semiconductor Software division of Yole with the production of reports and custom consulting projects. She is in charge of comprehensive analyses focused on semiconductor equipment, materials and manufacturing processes. Emilie Jolivet is Director of the Semiconductor Software Division at Yole Développement, part of Yole Group of Companies, where her specific interests cover package assembly, semiconductor manufacturing, memory and software computing fields. 1 Including: MEMS sensors, CIS, and power, photonics and RF devices2 Yole Développement, March 20183 AR/VR : Augmented Reality/Virtual Reality4 AI : Artificial Intelligence.5 SOI : Silicon On Insulator6 SiC : Silicon Carbid7 SiGe: Silicon Germanium8 GaN: Gallium Nitride9 InP: Indium Phosphide10 GaAs : Gallium Arsenide111 DMS : Digital-Micro-Switch12 TGV : Through Glass Via13 ADAS : Autonomous Driving Assistance Service14 CIS : CMOS Image Sensor