ultrasonics

Earlier this year when the novel coronavirus, SARS-CoV-2, began sprinting around the world, public health officials told us that social distancing was the most effective way to slow its spread. We’re now many months into the pandemic, and social distancing, combined with mask-wearing, is still the best way to prevent new cases of the disease.On March 20, 2020, governors on opposite coasts, Gavin Newsom in California and Andrew Cuomo in New York, shut down their states, and other states soon followed. Only essential businesses, such as select retailers – grocery and hardware stores as well as pharmacies, for example – were allowed to remain open. Depending on location, however, it was days or weeks before strict social distancing measures were in place. Tape stuck six feet apart on store floors has helped shoppers keep their distance. But shouldn’t there be a more exact and reliable way to gauge social distances in retail stores, gyms, workplaces and other settings?David Horsley, founder and CTO of Chirp Microsystems, a TDK Group company, believes so, and the company is developing technology that does just that. Horsley will share the details in his keynote A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors October 14 at MSEC 2020, SEMI’s first virtual MEMS Sensors Executive. The event is October 6-8 and 13-15, 2020. Register now for MSEC 2020.I spoke with Horsley to learn more about the sensors.SEMI: What was the inspiration for providing Chirp’s ultrasonic Time-of-Flight (ToF) sensors for social distancing?Horsley: Companies actually started contacting Chirp about six months ago to inquire about social distance tags to measure distance between people. They already knew about us because we’ve been supplying MEMS ultrasonic ToF sensors for virtual reality and robotics for several years, so they knew we could provide the same kind of low-power range-finding accuracy for resource-constrained devices. SEMI: How are your customers using Chirp-based social distance tags?Horsley: They’re designing Chirp’s ultrasonic ToF sensors into wearable tags worn by workers in distribution centers, in factories, and in oil and gas production, to name a few areas. The tags alert workers when they’re closer than two meters from another worker to ensure social distancing. Chirp’s ToF sensors also support contact tracing without recording any personal information, which is a major advantage over contact-tracing applications from companies like Google and Apple. Because those apps use Bluetooth Low Energy (BLE), which is already in your smartphone, the user has to enable location services. This records your GPS location, a privacy concern.BLE is problematic on some other levels as well. It only provides one-meter accuracy while Chirp’s ToF solution for social distancing delivers one-centimeter accuracy. Because BLE is only accurate within one meter, it can’t alert you in real-time that you’ve crossed that two-meter boundary to another person. Imagine you’re in the checkout line at the supermarket. BLE can tell you that other people are in your general vicinity, but it doesn’t have enough resolution to tell you whether the next shopper is two meters away from you or only one-and-a-half meters away. And because it doesn’t use the air as a medium, it registers a lot of false positives. If, for example, you’re separated from a person by a partition or a wall, and you’re within two or three meters of each other, your phone’s social-distance app will register a false positive.SEMI: Are you talking with customers in other environments, such as college campuses and theme parks?Horsley: There’s great deal of potential in those markets. For example, Professor Prabal Dutta’s group at UC Berkeley is working on a system that uses our sensors. His work also made us aware of some of the privacy concerns around contact tracing because universities are much more uneasy about student privacy than some private-sector companies are today. SEMI: What would you like MSEC attendees to take away from your presentation?Horsley: From the beginning, we believed that MEMS ultrasound was very versatile. We expected it to find a home in different types of applications because of its low power, small size and ease of use, particularly since we provide the enabling software that makes it all work. With design wins in four to five vertical markets, we’re experiencing significant marketplace validation. We’re all hoping that COVID-19 will wind down in the first half of 2021. As the focus on social distancing begins to fade, we’re looking forward to building out our customer base in the markets we’re in today as well as gearing up to explore new markets.Chirp Microsystems and TDK InvenSense are longtime members of MEMS Sensors Industry Group® (MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets, enabling members to grow and prosper. Visit us today to learn how MSIG membership can make a difference in your business.David A. Horsley, Ph.D., is co-founder and CTO of Chirp Microsystems Inc., a TDK Group company. Horsley is also a professor of Mechanical and Aerospace Engineering at the University of California, Davis, and is adjunct professor of Mechanical Engineering at the University of California, Berkeley. Since 2004, he has been co-director of the Berkeley Sensor and Actuator Center (BSAC), the National Science Foundation’s Industrial/University Collaborative Research Center (I/UCRC) focused on MEMS research. Horsley is also a recipient of the National Science Foundation’s CAREER Award, and has authored or co-authored over 150 scientific papers and holds over 20 patents.Maria Vetrano is a public relations consultant for MSIG, a SEMI technology community.

Part 2 of 2-part series on MSEC 2019 highlights. Read Part 1. Neural Networks on ChipTo be sure, low power is king when bringing machine learning to the sensor edge. Battery-powered, always-on sensing devices require it since frequent recharging is the death knell of any electronic product. That’s why semiconductor companies are offering new ways to conserve power.“MEMS sensor suppliers have made significant strides in the power, size and performance of their devices,” said Aspinity CEO Tom Doyle. “Yet these gains deliver only incremental power improvements to the system.”Doyle advocates a new architectural model that uses an analog neuromorphic processor to analyze all sensor data at the start of the signal chain instead of sending it downstream so power-hungry chips such as DSPs can digitize it before analysis.“The technology industry wants to take advantage of the many benefits of always-on sensing applications,” said Doyle. “Before we can reach mass proliferation, however, we need to resolve the power issues that are deal-breakers for some applications. We believe the answer to this challenge is architectural. All the data gathered by always-on sensing systems is analog in nature, yet as soon as it’s captured, it’s digitized immediately for analysis. Determining which data is important up front eliminates the digitization and processing of irrelevant data so that voice-first devices such as smart speakers and wearables/hearables can run for long periods of time without requiring battery recharge.”Syntiant CTO Jeremy Holleman agreed that on-device intelligence is the future.“Did you just fall? Is your heartrate a bit off? Deep learning provides a toolset that yields vastly superior decisions,” said Holleman. “The problem is that deep learning is computationally intensive. The answer is a neural network that performs on-device edge inferencing.”Holleman added that Syntiant’s neural decision processor was recently certified as Amazon Voice Service (AVS)-compliant for wake-word detection, making it easier to design voice control in battery-powered devices such as earbuds and wearables.MSEC Technology Showcase WinnerWith the groundswell of interest in intelligence at the edge, it was no surprise that Cartesiam won top honors among all competitors in the MSEC Technology Showcase for its NanoEdge AI, software that brings AI to the edge of the signal chain, making it easier for designers to create intelligent objects that can learn and understand.“Unlike other AI algorithmic technologies for sensing devices, NanoEdge enables both learning and inference at the edge, providing accurate and adaptive intelligence,” said Cartesiam Managing Director and Co-founder Marc Dupaquier, who accepted the award. “It’s also the only tool of its kind that does not require data scientists on board for implementation, which saves a tremendous amount of money. Our clients can build a machine learning library and embed it into their own code within weeks to realize the same caliber of unsupervised neural network that was once the exclusive domain of AI cloud vendors.”MSIG 2019 Hall of FameAt this year’s conference, MSIG Director Carmelo Sansone recognized two longtime contributors to the commercialization of MEMS and sensors: Peter G. Hartwell, Ph.D., chief technology officer at InvenSense, a TDK group company; and Thomas Kenny, professor and senior associate dean of engineering at Stanford University.Hartwell leads technology strategy and the InvenSense advanced technology research group. He has more than 25 years’ experience commercializing silicon MEMS products, including advanced sensors and actuators, and developing MEMS testing techniques.Kenny’s academic accomplishments include authoring or co-authoring more than 250 scientific papers and holding 50 issued patents. He has also advised more than 50 graduated Ph.D. students from Stanford.MSEC 2020Mark your calendar for next year’s MSEC, October 12-14, at Coronado Island Marriott Resort Spa in Coronado, Calif. Get updates from MSIG on MSEC and other upcoming events including MSTC 2020.Stay in Touch with MSIGMEMS Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, is the industry association representing the global MEMS and sensors supply chain. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Connect with MSIG on Twitter and LinkedIn. Subscribe to SEMI Blog: Technology and Trends.Maria Vetrano is a public relations consultant at SEMI.

A short trip to Monterey, California provided an exciting glimpse into what is in store for the future. Along with 550 attendees and 60 exhibitors, I took a quick visit through the aisles and conference venue to find several exciting developments this year!So many exciting new products are on the horizon. Dr. Peter G. Hartwell, CTO of InvenSense, A TDK Group Company, provided a view future of the way sensors including optical, audio, balance, direction, location, and chemical will provide improvements over human capabilities. A glimpse into our future experiences with a 360-view winter wonderland experience of riding a snow mobile using two 180°C fisheye lens cameras with his presentation “Sensors: Where Reality Meets Virtual.” The only warning was that with so many cameras and social media privacy is lost!Dr. Hans Stork, CTO, ON Semiconductor discussed some of the recent investigations his company has made on the many LiDAR sensors. He enlightened listeners with more details of the optical/LiDAR Fusion with FUSE ONE that was unveiled at CES 2019. Future cars will have a combination of cameras, LiDAR, radar, and ultrasonics. No one sensor has it all. There are many companies offering LiDAR for automotive applications, but the products are still too expensive and the market will shake out over the next few years. Douglas Hackler, CEO, American Semiconductor presented the company’s achievement in flip chip on flex circuit assembly for a variety of applications, including pharmaceuticals, wearable wristbands, and IoT communications. Interconnects supported include ACA, ACF, advanced z-axis materials, and low temperature solder. He also described flexible hybrid electronics using printed electronics and a wafer CSP assembly for sensors. With this operation located in Idaho, products can be assembled in the U.S. Jean-Charles Souriau from CEA-Leti described the organization’s detailed research in developing in flip chip assembly on a flexible label with a thin die. A gold stud bump flip chip and thermo-compression bonding with glue is used to attach the die to a flex substrate. A polymer fabricated on thin glass was also demonstrated. Clearly, much progress has been made in flexible printed electronics in the last year with many presentations describing progress. Results of a benchmark study conducted at Cal Poly examined some of the key developments in bump materials and interconnect methods. Key areas such as antennas, batteries, PV and energy harvesting, a variety of sensors, and audio technology were investigated. Dr. Pradeep Lall presented work examining developments in conductive inks for 3D printed electronics.Dr. Subu Iyer and his student, Arsalan Alam, of UCLA presented some exciting research on heterogeneously integrated foldable display on elastomeric substrate, FlexTrate™, using vertically corrugated interconnects. This can be considered fan-out wafer level packaging. The work holds much promise for applications including foldable displays, wireless powered systems and surface electromyography systems. Fine pitch ≤40 micron interconnects bendable to 1 mm bending radius passed more than 6,000 bending cycles. Dr. Mark Poliks of Binghamton University described their work on the development of a wearable flexible hybrid electronics ECG monitor. While the work is in the early stages, human trials will soon begin and the results look promising. New materials will be key in the future products. Reliability test data was also presented on aerosol-jet printed traces on Upilex-S, including tensile, peel and bend testing, as well as “healing” of the damage. New product introductions included U.K’s Peratech’s EDGE force-sensing solution targeted form smartphones, wearables, and tablets. In this HMI solution, Peratech’s thin sensors are mechanically integrated into key areas of the smartphone to capture a user’s natural single-handed grip, ergonomic finger movements, intuitive pressure sand squeezes to control key functions. It even works with the users has wet hands or is wearing gloves! This eliminates the need for physical button openings and allows the implementation of a thinner, more contoured device with a rigid-metal chassis. Next year’s event will be in San Jose during the last week of February. Stay tuned to SEMI’s website for more details.Jan Vardaman is president and founder of TechSearch International, Inc., which has provided market research and technology trend analysis in semiconductor packaging since 1987. She is the co-author of How to Make IC Packages (by Nikkan Kogyo Shinbunsha), a columnist with Printed Circuit Design Fab/Circuits Assembly, and the author of numerous publications on emerging trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer as well as a member of SEMI, SMTA, IMAPS, and MEPTEC.