defense

Spend any time with Ansys’ John Lee, Rich Goldman or Marc Swinnen and you’ll hear plenty of optimism about the semiconductor industry even though they tick off a long list of looming design challenges. The need for reliable and effective electronic systems, they emphasize, is great and runs through high tech, aerospace and defense, automotive, IoT and 5G with communications being a common denominator. The three are especially bullish these days on changing market dynamics brought on by systems companies building company-specific bespoke, or custom, silicon. These systems companies are building chips with a different perspective and a fresh look at silicon design, a move away from the more traditional segment-specific silicon due to much more complexity. Ansys, a member of the ESD Alliance, a SEMI Technology Community, is a 4,100-employee company with a comprehensive portfolio of multiphysics engineering simulation software for product design, testing and operation products and services. John, Rich, Marc and I focused on Ansys’ semiconductor and electronics segment for our conversation. Smith: When did you notice the move by systems companies to build their own chips? What drives this trend? Lee: The inflection point was about three years ago when hyperscale data center and system companies recognized they needed an enterprise system design platform. They are designing bespoke silicon, driven to do this for cost efficiencies and to avoid relying on outside suppliers. They also want differentiation based on their specific platform needs so they can optimize compute power to their specific needs. Smith: What is driving the trend for multiphysics experience to ensure effective and reliable electronic systems? Lee: The increasing need for multiphysics analysis is acute. The physics of 3D IC, for example, brings in mechanical engineering with the convergence of mechanical and electrical as 3D emerges at the intersection of IC and System. As a result, physics becomes a necessity to analyze the stability of the chip in the package. Goldman: As well, the move to stacked chips, 3D IC and wafer-on-wafer requires thermal, electromagnetic and mechanical analysis in addition to the traditional analysis for function, performance and power. They all need to be analyzed together, not serially. It becomes multiphysics, not multiple physics. Smith: Two distinctly different disciplines – multiple physics and multiphysics – are needed for semiconductor design. How are they different? Why the need now? Swinnen: Multiple physics refers to the sheer breadth of physics that is now needed to analyze from the IC up to the largest system whereas multiphysics refers to the capability to analyze several physical effects concurrently, accounting for their impact on the design and interactions between various physics. Multiphysics are necessary to analyze the full context of the system environment – from nanometers to kilometers – for multi-chip packaging, chip-to-package-to-silicon and systems with multi-domain guidance. Goldman: A self-driving car, as an illustration, includes AI systems-on-chip, solid-state sensors, infotainment systems and radar/lidar detectors that must all work in the rain, the heat and the bitter cold. Smith: Why are design groups being reorganized to include expertise in mechanical and electromagnetic issues? Swinnen: Complexity has exploded, driven by a long list of technical requirements and, perhaps, mischaracterization. Goldman: Just consider the system on chip, mischaracterized by the semiconductor industry. The chip is never a system by itself. Rather, it is a complex component in a larger system and must be analyzed in that context. 3D IC is where this comes together and forces a recognition of physics outside the traditional scope of SoC design. 3D IC chips are much closer together on the board and it takes multiphysics embedded into the workflow of semiconductor design, packaging, system design and 3D IC to ensure they work reliably and efficiently. Smith: What is the solution? Goldman: It’s clear a specialized digital thread is necessary to move disparate groups with expertise in systems, physics and silicon together. Today, these groups or disciplines might not exist in the same company, whether it be a foundry, fabless or outsourced semiconductor assembly and test (OSAT) company. Lee: In order to unify the entire system design environment, a cloud-based, open and extensible heterogenous enterprise compute platform is required. It is similar to the SaaS-based business model and known as Simulation-as-a-Service (also SaaS). While vertical integration of design groups is already taking place at leading system design houses, there have also been advances in electronic design tools. These are starting to offer more comprehensive multiphysics capabilities including thermal, fluid dynamics (CFD), mechanical stress and reliability analysis in a single analysis cockpit. Today’s system designers face two platform challenges: First, they need an environment that is open enough to accept analysis results from multiple sources so that they can be overlapped and cross-analyzed. Second, the design platform must have the capacity to handle the enormous amounts of data generated by the latest 3-nanometer chips and 3D IC systems, and this implies an intimate coupling to elastic cloud computing. The days of an engineer writing Perl scripts and handing it off to someone else are gone. We believe that the industry is responding to this challenge with a new generation of design platforms that a cloud-native, open and extensible to allow heterogenous enterprise design. We are definitely at an inflection point in electronic design today, but the electronic industry has faced these before an we are confident it will master these challenges as well. About Rich Goldman Rich Goldman is director of marketing for the Electronics and Semiconductor Business Unit of Ansys. He holds a Bachelor of Science degree from Syracuse University and an MBA and Master of Science degree in Engineering Management. Moscow Institute of Electronic Technology (MIET)’s first honorary professor, he is also the recipient of honorary PhD degrees from Russian-Armenian (Slavnoic) University and State Engineering University of Armenia for contributions to the advancement of Armenia’s high-tech education and economic ecosystem. Rich served on EDAC’s board of directors. About John Lee John Lee is general manager and vice president of the Ansys Electronics and Semiconductor Business Unit. Lee co-founded and served as CEO of Gear Design Solutions (now Ansys), developer of the first purpose-built big data platform for integrated circuit design. He cofounded two other startups (Mojave Design and Performance Signal Integrity), which successfully exited into companies now part of Synopsys. He holds undergraduate and graduate degrees from Carnegie Mellon University. About Marc Swinnen Marc Swinnen is director of product marketing for the Electronics and Semiconductor Division of Ansys. He holds Master degrees in Electronic Engineering and Industrial Management from KU Leuven, Belgium, as well as an MBA from San Jose State University. About Bob Smith Robert (Bob) Smith is executive director of the ESD Alliance, a SEMI Technology Community. He is responsible for the management and operations of the ESD Alliance, an international association of companies providing goods and services throughout the semiconductor design ecosystem.

As the global economy is constantly transformed, the need for new skills has never been higher. The microelectronics industry is thoroughly affected by this urgent need. To develop a workforce fit for the future, it is crucial to invest not only in reskilling and upskilling, but also in skills anticipation and inclusivity. To tackle this need, the European microelectronics ecosystem has adopted many bottom-up initiatives and good practices supporting lifelong learning. Many companies collaborate with universities and training institutes to offer work-based training, and numerous events take place to support women participation in STEM and to attract more young talent to a microelectronics career. Despite these great efforts, further pooling of investments is necessary if Europe is to develop efficient lifelong learning programs. Creating strong skills partnerships is vital for sustainable upskilling and reskilling initiatives. According to the World Economic Forum (2021), greater private-public collaboration on large-scale upskilling and reskilling initiatives could boost global GDP by $6.5 trillion and lead to the creation of 5.3 million net new jobs by 2030. What is the Skills Partnership? Against this backdrop, SEMI Europe is launching the Skills Partnership for Microelectronics. The partnership brings together industrial and education partners from the microelectronics ecosystem to implement the Pact for Skills, an EU initiative which aims to boost upskilling and reskilling investments in key ecosystems for Europe’s competitiveness. Following the high-level roundtable with SEMI Europe’s Advisory Board, hosted by European Commissioners Thierry Breton and Nicolas Schmit, the microelectronics sector was selected in November 2020 as one of the key ecosystems for the first wave of implementation of the Pact, alongside automotive and aerospace/defense. Read more details about the October 2020 roundtable. 59 partners have already endorsed the Pact for Skills for Microelectronics. The Skills Partnership for Microelectronics aims to: Exchange good practices of upskilling and reskilling initiatives of the microelectronics industry Develop sustainable collaboration mechanisms that will monitor microelectronics skill needs, learning from the examples of the METIS blueprint project Promote the microelectronics sector as a career choice Boost the presence of women and other under-represented groups in the sector. The partners will have the opportunity to liaise not only with European, but also with national and regional authorities and clusters, so that a pan-European holistic approach to microelectronics skills development is achieved, and a significant flux of public and private investments on skills is mobilized. To launch this ambitious partnership, SEMI Europe held an initial workshop on March 17. Participants included representatives from the European Commission’s DG Connect, DG Employment and DG Grow, national and regional authorities, and over 70 industry and education partners. The workshop opened with representatives from the European Commission informing all stakeholders about the Pact for Skills initiative, as well as about EU skills-related funding opportunities. In the framework of the Pact for Skills, the Commission will support the ecosystems with a Networking Hub, a Knowledge Hub and a Guidance Resources Hub. These platforms will be available later in 2021 and will act as a one-stop-shop to support the partners and provide information on EU policies and funding opportunities. Other presentations went on to set the scene, presenting the main priorities of the partnership. Françoise Chombar, CEO of Melexis, highlighted the skills challenge experienced by the microelectronics industry. She emphasized the importance of lifelong learning and the danger of the gender disbalance in the sector and underlined the huge innovation potential and profitability that could be unleashed for Europe if the gender gap is successfully addressed. Moreover, the preliminary results of the METIS Microelectronics Skills Strategy were presented, to offer the basis for the partnership’s approach to skills anticipation. The partnership will establish working groups that will investigate the industry needs, leading to a better connection with the offer of education and training programs. Last but not least, the partnership aims to promote national and regional funding of upskilling and reskilling initiatives. In this regard, representatives from national and regional authorities and clusters participated in the meeting. The government of the Basque region had an active role, presenting the region’s priorities, incentives and main actions on promotion of lifelong learning initiatives. The next steps The meeting concluded with an overview of the next steps for the newly launched partnership. In the next workshop, the partners will align on the specific KPIs, as well as on the focus areas where they would like to engage (skills anticipation in semiconductor manufacturing, skills anticipation in semiconductor design, gender balance, etc.). In that framework, the executive board will be established, as well as the working groups that will lead the work of the partnership and set targeted objectives. If you want to take active part in the creation of this large-scale initiative, please fill in your details here. To learn more about the initiative, click here or contact [email protected]. Stefania Gavra is public affairs manager at SEMI Europe.

PNI Sensor, a member of the SEMI-MSIG Positioning, Navigation and Timing (PNT) Technical Advisory Council, is developing advanced tracking systems that promise to increase industrial worker safety.The availability of low-cost GPS jamming and spoofing technologies renders GPS-only solutions for location and navigation an increasingly dangerous and ineffective choice for the dismounted soldier in a battlefield environment. This threat to armed forces has spurred development of new self-contained location and navigation technologies for defense applications — an innovation that offers significant advantages for commercial applications.Though not as complex and mission-critical as in defense, self-contained location technology is also essential in commercially available industrial applications. That’s particularly true for workers in industrial sectors such as utilities, mining, and construction, and in environments with lone or remote workers, such as first responders. While jamming and spoofing are not a threat in the industrial sector, determining the precise location of workers in GPS-denied environments is fundamental to ensuring their safety. This makes it a priority to adapt any self-contained, non-infrastructure-based location technology — which was first developed for the modern dismounted soldier — to industrial applications.Bodies in MotionInertial solutions are very difficult to implement properly, even without the challenges uniquely created by human motion dynamics. On a construction site, for example, workers tend to cover a wide range of disciplines: supervisors, electricians, iron workers and equipment operators, among others. While performing their jobs, construction workers change locations, both indoors and outdoors, and perform dynamic motion such as crawling, ducking and climbing. These are all motions that are very difficult to model using traditional adaptive filtering techniques, which are typically applied in vehicular inertial navigation platforms, such as aircraft, ships and tanks. Even if existing inertial navigation systems could be made size, weight, power and cost (SWaP-C)-compatible to be body-worn, their performance accuracy would still need to satisfy the application’s requirements. To properly determine a worker’s precise location to ensure safety on job sites and in remote locations, we must tackle the combined challenges of SWaP-c and human dynamic motion. That’s the most effective approach for creating a complementary positioning technology that augments GPS or other infrastructure-based location systems.To address these challenges, we need to build a high-performance inertial measurement solution using commercially available MEMS inertial sensors. The issues of bias drift error and low sensitivity have traditionally made such sensors practically useless for any meaningful inertial tracking. Fortunately, this is no longer the case. We now have sensors that already conform to the necessary SWaP-C requirements for the application, and have the additional advantage of high dynamic range of measurements without saturation errors, which helps to reduce high-force and rapid movement-induced errors, promoting greater accuracy.Thus, a path forward is emerging. The current generation of high-performance MEMS gyros can now inertially track workers’ locations to step-level resolution very well for up to 30 minutes — without significant location errors due to bias or scale errors. That’s an order of magnitude better than previous generations. With the new MEMS gyros, errors typically remain less than 2% of distance travelled over that time period. Strategically applying algorithm improvements with higher levels of magnetic corrections has the potential to bring that accuracy down even lower, to less than 0.5% of distance traveled for durations of one hour or more. What’s more, the improved gyro and accelerometer bias, gain, and signal-to-noise (SNR) performance allows for better magnetic anomaly rejection. This enables finer and more sustained gyro bias corrections in the fused solution, which creates a system greater than the sum of its parts. We believe that these newer systems will promote greater worker safety at a truly affordable price.PNI Sensor, a member of the SEMI-MSIG PNT Technical Advisory Council (TAC), is developing a tracking system that combines the best elements of the newest-generation MEMS devices with an electronic compass that uses advanced magnetic anomaly detection and rejection algorithms. Based on PNI’s latest attitude and heading reference system (AHRS), the novel PNT system employs a unique Kalman algorithm that intelligently fuses its reference magnetic sensors with gyros and accelerometers. In conjunction with this work, PNI Sensor has developed advanced pedometry functionality for use in its tracking system for very high dead-reckoning tracking performance used in defense industry applications. PNI is initially designing that system to track dismounted soldiers and special forces operating in GPS-denied or contested environments.For more information about PNI Sensor’s advanced location and navigation technology, please visit PNI Sensor. To learn more about the SEMI-MSIG PNT TAC, please contact Carmelo Sansone, director, MEMS Sensors Industry Group.George Hsu is a founder and CTO of PNI Sensor. He has focused his career on the sensor industry, having invented several magnetic sensor breakthroughs, including the magneto-inductive technology, the core of today’s electronic compassing in the automotive, consumer, scientific and military markets. Hsu is a graduate of Stanford University School of Engineering, holds several patents, and is a much-published author of technical articles on sensor theory, design and applications. He is an active member of the MEMS Sensors Industry Group PNT TAC.About the SEMI-MSIG Positioning, Navigation and Timing ProjectMEMS Sensors Industry Group (MSIG) created a member-based PNT TAC to identify and pursue PNT system innovations for GPS-denied environments. To that end, MSIG solicited proposals from its membership for the SEMI-MSIG PNT Project, a U.S. Army Research Laboratory-funded R D project. PNT committee members that have secured funding are pursuing R D platforms that improve accuracy and performance. Platforms may include software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems.