Analog Devices

The latest MEMS and sensors advancements in markets ranging from displays to biotech and in key areas of manufacturing including sensor devices and fabrication came into sharp focus at the 2022 MEMS & Sensors Technical Congress (MSTC) in late April as 120+ industry experts gathered in Berkeley, CA.

Areas packed with dense foliage. Mile-deep mines and tunnels. Urban canyons. Indoor environments. Global Positioning System (GPS) technology has long been a boon to location tracking of aerial, terrestrial and aquatic vehicles — as well as to people in motion — but in many cases it can’t function with a high degree of reliability, either because the GPS signal is somehow obstructed, or worse, is jammed or spoofed. Delivering higher precision and higher reliability in GPS-denied environments — as well as immunity to jamming and spoofing — positioning, navigation and timing (PNT) represents the next evolutionary step in location positioning and tracking. With PNT so critical to a range of defense, commercial and industrial applications — and with sensors the building blocks of PNT solutions —the MEMS Sensors Industry Group, a SEMI Technology Community, is ensuring that our members play a transformative role in PNT innovations. We’ve secured $14.9 million in research dollars for PNT R D over the past 18 months, marking Phase I of a project funded through a public-private consortium with the U.S. Army Research Laboratory (ARL). With the typical funding structured as a 50/50 cost share with the industry participant, the research dollars go farther, and the level of commitment that each recipient makes is more pronounced. As we look ahead to Phase II of the MSIG PNT R D project, the details of which we’ll announce later this year, we’d like to reflect on the companies and research labs that won bids through a competitive process supported by the SEMI-MSIG PNT Technical Advisory Council and the SEMI-MSIG PNT Governing Council. Winners submitted proposals that both met our criteria for advancing PNT technologies relative to mobility, size and weight, and that laid a path toward greater cost efficiency and lower product price. “PNT doesn’t displace GPS,” said Tim Brosnihan, executive director of SEMI-MSIG. “Rather, getting the two technologies to work together improves position and tracking. While current PNT solutions use inertial measurement units, or IMUs, to effectively maintain positioning accuracy in the absence of a GPS signal, it’s also true that accumulated bias and noise-related errors in the IMUs make positional determination unreliable. Like most great pairings, GPS and PNT can work together. We can use IMUs when GPS is unavailable, and when GPS returns, it can be used to reset the IMU errors. So when the GPS signal is lost again, the IMU can maintain navigation and location. “We’re focusing this PNT project on technologies that will allow accurate positional determination in the absence of a reliable GPS signal for prolonged periods,” added Brosnihan. Here are snapshots of the 10 companies and research institutions that won awards for their PNT-focused developments. Analog Devices is developing an optimal size, weight, power, and cost (SWaP-C) solution for applications requiring high-accuracy navigation and uncompromised reliability. The company’s mode-matched navigation-grade gyroscope with system ID leverages an innovative sensor and its associated process design, a robust high-volume manufacturing flow, and system-control algorithms to achieve very high-performance (0.01 degree/hour bias instability and 0.005 degree/√hr angle random walk). Carnegie Mellon University (CMU) is developing a CMOS MEMS high-stability accelerometer through machine learning (ML). If embedded in footwear, these ML-optimized accelerometers could be used in personal navigation. If embedded in a golf ball, baseball or hockey puck, the accelerometer could extract the trajectory of the object in motion by measuring its shock (force). The CMU device validates state-of-the-art performance of the university’s high-dynamic-range accelerometer systems-on-chip. It also validates and tests ML models by measuring the accelerometer and auxiliary sensor output over long time periods (e.g., 1 hour, 10 hours, days) to collect independent long-duration time-series data. By modeling drift from environmental influences — along with possible overall system changes from extreme events, such as high-temperature excursions and shock — designers can dramatically reduce navigation errors to support more accurate navigation over longer time periods. GE Research is developing a novel MEMS gyrocompass that will enable high-end north-finding systems, traditionally unaffordable for automotive and consumer applications. The device will be available in mass-market applications such as robotics and autonomous vehicle navigation in GPS-denied environments. The MEMS gyrocompass enables a 10x reduction in SWAP-C with high accuracy. An additional benefit of this work is that GE will offer a foundry service process development kit (PDK) for its Polaris MEMS process, speeding the development and manufacture of MEMS devices in an advanced processing facility. Georgia Institute of Technology is developing high-aspect-ratio monocrystalline silicon carbide-on-Insulator (SiCOI) MEMS devices that will reduce navigation angle errors, potentially making widescale pedestrian navigation available in mass-market applications such as smartwatches and smartphones. The platform for ultra-high-performance bulk acoustic wave (BAW) gyroscopes and timing resonators will feature material properties that allow a much better structural symmetry and a higher-resonant quality factor (Q) than silicon MEMS (Si MEMS). Honeywell is working to enhance the navigation accuracy of commercial and military vehicles in GPS-denied environments through an innovation that dramatically improves the performance of a MEMS IMU by both refining candidate ML algorithms, including recurrent neural networks (RNNs), and by combining deep neural network (DNN)-based calibration and sensor fusion algorithms. PARC is developing a new materials platform for photonic integrated circuits (PIC). Aluminum gallium nitride (AlGaN), an ultra-wide bandgap semiconductor, is epitaxially grown to produce single-crystal layers for fabrication of optical components, such as waveguides and micro-ring resonators for optical signal processing. The project includes design and fabrication of specialized laser diodes at wavelengths needed to probe qubits based on atomic ions (e.g., strontium and ytterbium). The new platform offers several benefits: low optical loss from the ultraviolet (UV) to infrared spectral bands excellent non-linear optical properties for efficient frequency-generation processes (e.g., optical frequency combs); and enabling technology to realize compact, field-deployable quantum systems for PNT applications, such as ultra-fast distance measurements, microcombs for optical atomic clocks, photonic radar, optical coherence tomography, and coherent communications — all applications that benefit from the lower cost and small chip size of these integrated photonic circuits By expanding its proprietary EpiSeal encapsulation process to include new materials and topologies, SiTime is developing low-impedance and low-noise MEMS resonators with an ultra-stable wafer-level package. Because these novel MEMS resonators are highly reliable and very compact — while using less power and providing lower RF noise — they’re ideal for 5G RF timing applications, IoT devices, and smart vehicles. Teledyne Scientific Imaging (CSAC project) is conducting a study to identify paths to reduce the cost of battery-operated chip scale atomic clocks (CSAC) that provide affordable precision timing for denied environments. The project goal is to identify viable paths of reducing cost by an order of magnitude, without sacrificing performance. In addition to exploring design and manufacturability solutions, project researchers are performing short loop experiments as proof-of-concept validation. Through a second award, Teledyne Scientific (IMU project) is advancing packaging and integration for compact, navigation-grade six degrees of freedom (DOF) MEMS IMUs. Featuring reduced bias instabilities associated with packaging stresses and ambient temperature influences, the Teledyne Scientific IMUs promote environmentally robust low-stress packaging of wafer-level vacuum packaged (WLVP) MEMS gyro resonators, facilitating a lower-cost, smaller and more accurate IMU for performance-driven PNT applications. Twinleaf is developing a new light source module ideally suited for integration directly into quantum sensors. This project integrates a bright, tunable distributed Bragg reflector (DBR) near infrared (IR) 795nm wavelength laser made by the project’s subcontractor (Photodigm) into a package that locks the laser to an atomic reference line in a microfabricated vapor cell. The laser module’s high-output intensity and low magnetic signature will enable breakthrough performance levels for Twinleaf’s magnetometer and other quantum sensors requiring the light source integrated into the sensor module. Request for Proposal for Phase II of SEMI-MSIG PNT Program Opens Q4 2021 SEMI-MSIG will accept request for proposal (RFP) submissions for Phase II of its PNT program starting in Q4 2021. This year, in addition to funding IMU and timing device projects, MSIG will also consider proposals on imaging-based navigation solutions. If you’d like to submit for Phase II, sign up to receive more information on the RFP by visiting SEMI’s R D Programs page. You can also connect with Paul Carey by email, [email protected] or LinkedIn. Paul Carey, Ph.D., is the director of the MEMS Sensors Industry Group. With deep domain expertise in X-ray imaging backplane platforms — and their supply-chain technologies such as flexible substrates, laser annealing for semiconductors and silicides, thin film transistors (TFT) for flexible OLED displays, and polysilicon-on-plastic TFT technology — Carey has held technical leadership positions at dpiX, Applied Materials, and Lawrence Livermore National Laboratory. He received a double-major B.S. from UC Berkeley in Electronical Engineering and Computer Science (EECS), and Materials Science and Engineering (MSE). Carey holds an M.S. in EECS from UC Berkeley and a Ph.D. in MSE from Stanford University.

The air we breathe is precious yet neglected as anthropogenic pollutants continue to pour into the earth’s atmosphere. Still, there’s hope that greenhouse gas emissions – and the human behavior behind them – can be brought under control for the good of the planet with the help of gas sensors that gauge pollutant levels.Of the many air pollutants, some are more detrimental to our health than others. Figure 1 lists the top seven pollutants, their chief sources and health effects. The Air Quality Index is calculated by combining values from particles and four gases (carbon monoxide, ozone, sulfur dioxide, nitrogen dioxide). The good news is that gas sensors are available in the market that can monitor each of those pollutants.Figure 1 – Top seven pollutants and their health effects. Source: EPA Air Sensor Guidebook The challenge is that many gas sensor end users today have little understanding of how to compare the performance characteristics of sensors offered by various vendors. SEMI is working to help end users clear that hurdle. SEMI-MSIG this year created a group within its Device Working Group focused on developing gas sensor standards aimed at growing the market and defining guidelines affecting areas including testing methods, reliability requirements, packaging and communication interfaces. Importantly, the standards will also make it easier for end users to make a clear choice among rival products.The SEMI-MSIG Device Working Group comprises devoted experts from leading gas sensor companies as well as OEMs. We welcome companies involved in deploying gas sensors to join this fast-growing group to improve air quality standards in sectors including residential construction, factory automation, automotive, consumer electronics and healthcare. One potential market is consumer electronics such as smart phones since concerns about air quality is growing among device users.The MEMS Sensors Industry Group (MSIG) Device Working group was formed in early 2019. Its mission is to develop a series of technical specifications, industry standards and best practices for MEMS and Sensor devices and platforms. The goal is to advance the use and expansion of MEMS and sensors worldwide.Table 1 – Top seven pollutants and their health effects. Source: EPA Air Sensor Guidebook In the past, we focused on inertial sensors (See IEEE2700 standard for inertial sensors as an example of an output of this team). In 2020, our focus shifted to gas sensors and we plan to expand our work to include other types of sensors in the near feature. Industry leaders such as Bosch, TDK Invensense, Renesas, Infineon, Analog devices, STMicroelectronics, GE and Intel meet every month to strategize on a series of initiatives.If you’re interested in joining the SEMI-MSIG Device Working Group, please contact Carmelo Sansone, Director of MEMS Sensors Industry Group.The MEMS Sensors Industry Group (MSIG) is a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.Carmelo Sansone is director of the SEMI-MSIG. He has focused his career on building products and system solutions that have large impact in the marketplace. Sansone launched several sensor processor platforms for low-power applications, including the first microcontrollers with DSP capabilities, the core of today’s portable devices intelligence. Sansone has led the successful integration of the MSIG organization into SEMI by expanding its services and global reach. Carmelo holds a master’s degree in Electronic Engineering with a specialization in Biomedical from the University of Pisa and an MBA from Golden Gate University, San Francisco.

Inertial sensors have continued to underpin the success of wearables in increasingly important ways. Propelled by evolutionary advancements in inertial sensors, wearables have strayed from their humble beginnings in simple activity and wellness, which defined the user experience over the past decade. What started with the simple act of telling people their daily step count has morphed to provide deeper insights into swim stroke and run cadence, all the way to mapping out a person’s off-piste ski route. Layered on top of this foundation of inertial sensors, we’ve fused optical, temperature and other sensor technology to provide clinical-grade healthcare snapshots available previously only by visiting the doctor’s office.Inertial sensors today are again leading the way in improving health and wellness. Instead of humans, however, this time the patients are machines. In fact, the health of critical assets – whether factory-based equipment, windmills, train bogies or aircraft – has been assessed through sophisticated analysis of their vibration signatures for many years. The sensors used for these applications have depended on piezoelectric technology because their vibration amplitude signals are very small and difficult to detect and because of the importance of understanding their spectral content over a wide bandwidth. When it comes to noise and bandwidth, bulk piezoceramics have had a major advantage over electrostatic MEMS technology – until recently.Using bulky expensive piezoelectric sensors for condition-based monitoring has been akin to going to the doctor’s office to have an MRI. The equipment required (sensors, receivers) is expensive and requires highly trained specialists to operate the machine and to interpret the information. For this reason, only mission-critical assets are instrumented. For nearly all other equipment, we tend to use inefficient schedule-based maintenance approaches to cover the gap of not having continuous data. Condition-based monitoring leverages real-time sensing of critical machine parameters to reduce system downtime and improve efficiency. Evolving machine healthMEMS started to democratize machine health several years ago, when suppliers began switching from piezoelectrics to capacitive MEMS. While the performance was still not on par with piezoelectric sensors, MEMS technology could already capture a wide array of faults. One example, the ADXL001, started making its way into Integrated Electronics Piezo-Electric (IEPE) and 4-20 mA sensors, which form the backbone of the vibration monitoring market. Although the bandwidth and noise of the sensor did not allow for very early detection and prescriptive monitoring, it did allow the tracking of faults as they progressed and became more imminent.Other digital accelerometers started finding their way into new wireless prototype systems with the goal to simplify and increase deployment to a greater population of assets. The thinking was that self-contained digital wireless sensor nodes could be deployed more economically and quickly, and that these digital sensors would bring the power of computing to the edge node.Unfortunately, even the lowest-noise MEMS products did not have the bandwidth needed to diagnose and predict faults early enough to influence how and when machines are maintained most economically. Instead, such devices were used to detect imminent failure to prevent irreparable harm. As we all know, however, the earlier the doctor spots a problem, the better the probable outcome. That’s because early detection increases the likelihood that the doctor will have access to the full spectrum of treatment options available to fix the problem.Inertial MEMS is blazing a new frontier with the introduction of next-generation capacitive MEMS such as the ADXL100x portfolio. Offering ultra-low noise density and high-frequency response, these newer capacitive MEMS devices fit the bill. With 3dB bandwidths up to 25 kHz and flat response curves within 0.4dB all the way to 10kHz, these accelerometers demonstrate compelling enabling characteristics such as better DC performance, improved robustness, lifetime stability, linearity, and of course, cost, making capacitive MEMS a better choice than piezoelectrics.With high-bandwidth capacitive MEMS much easier to use and deploy – as well as more affordable – the market is starting to respond. Condition monitoring equipment and instrumentation is becoming more accessible to a larger base of manufacturers. In turn, a wealth of data is being created and mined to develop better and timelier predictive and prescriptive maintenance approaches that rely heavily on machine learning and artificial intelligence (AI).It’s worth paying attention to the sizable condition-based monitoring market. Estimated at $3.5 billion and growing, condition-based monitoring reduces downtime and increases equipment utilization in quantifiable ways. And it’s not just manufacturers who stand to benefit. More sustainable and efficient industrial processes, safer trains that crisscross continents at ever increasing speeds, autonomous cars and trucks that know what’s happening under the hood as well as on the road, and modern infrastructure to support our evolving lives show us that condition-based monitoring has something for everyone.Learn more about Analog Devices’ condition-based monitoring signal-chain options that help customers on the journey from sensor to solution. View ADI’s whole portfolio of condition-based monitoring solutions online or download Next-Generation Condition-Based Monitoring brochure.Tzeno Galchev is product marketing manager in the Inertial Sensor Technology Group at Analog Devices Inc. He oversees the strategic marketing and product definition of the inertial sensor component portfolio. He received B.S. degrees in both Electrical and Computer Engineering in 2004, and M.S. and Ph.D. degrees in Electrical Engineering in 2006 and 2010 respectively from the University of Michigan, Ann Arbor. He has over 30 publications in the area of MEMS, holds multiple patents, and is a frequent lecturer and speaker on topics related to MEMS, energy harvesting and sensors.Analog Devices is a longtime member of MEMS Sensors Industry Group (MSIG), a SEMI technology community that enables the MEMS and sensor industry to address common challenges, innovate and accelerate business results.

Sensors are inextricably linked to the future requirements of partially and fully autonomous vehicles. From highly granular dead-reckoning subsystems that rely on industrial-strength gyroscopes for superior navigation to more intelligent and personalized cockpits featuring intuitive human machine interfaces (HMIs) and smart seats, new generations of partially and fully autonomous cars will use sensors to enable dramatically better customer experiences.Dead reckoning, or, where am I, exactly? Dead reckoning is the process of calculating one’s current position by using a previously determined position, and advancing that position based upon known speeds over a time slice. As a highly useful process, dead reckoning is the basis for inertial navigation systems in aerospace navigation and missile guidance, not to mention your smartphone.Today’s best-in-class MEMS gyroscopes can offer 30-50 cm resolution (this is the yaw rate drift) over a distance of 200 meters — a typical tunnel length where a GPS signal is lost. For semi-autonomous (L3) or autonomous (L4, L5), the locational accuracy is well below 10 centimeters; that’s an accuracy usually reserved for high-end industrial or aerospace gyroscopes with a raw bias instability ranging from 1°/h and down to 0.01°/h. These heavy-duty gyros command prices from $100s up to $1000s. Current performance levels of different gyroscopes by application and performance measure in terms of bias drift (IHS Markit). This poses an interesting potential opportunity for both industrial-performance MEMS-based gyroscope sensor-makers, such as Silicon Sensing Systems, Analog Devices, Murata, Epson Toyocom and TDK InvenSense, and for broader-based sensor component-makers such as Bosch, Panasonic, STMicroelectronics, and TDK (InvenSense and Tronics).While MEMS can master performance, size and low weight, cost remains the challenge. The fail-operational mode requirement for autonomous driving will accommodate higher prices, at least in the beginning, probably in the $100+ range at first, even for the relatively low volumes of self-driving cars anticipated by 2030. Nonetheless, automotive volumes are very attractive compared to industrial applications and offer a lucrative future market for dead-reckoning sensors.Your cockpit will get smarter Automakers are banking on the idea that people like to control their own physical environment. Interiors already feature force and pressure sensors that provide more personalized seating experiences and advanced two-stage airbags for improved safety. In some vehicles, automakers are using pairs of MEMS microphones for noise reduction and image or MEMS infrared sensors for detection of driver presence. Eventually, we might see gas sensors that monitor in-cabin CO2 levels, triggering a warning when they detect dangerous levels that could cause drowsiness. These smart sensors would then “tell” the driver to open the window or activate an air-scrubbing system in a more complex solution. While today’s CO2 sensors are still relatively expensive, we may see them designed-in as lower-cost versions come to market.Future cockpits will need to go beyond such concepts in the lead-up to fully automated driving. Seats could contain sensitive acceleration sensors that measure heart and respiration rates as well as body movement and activity. Other devices could monitor body humidity and temperature.We need look no further than Murata, a supplier initially targeting hospital beds with a MEMS accelerometer as a replacement for pulse oximeters. That same Murata accelerometer could be placed potentially in a car seat to detect heart rate. It’s not the only way to do this: another sensing approach for heart-rate measurement comprises millimeter wave radiation, a method that can even look through objects such as books and magazines.Augmenting sensor-based body monitoring, automotive designers will use cameras to fuse information such as gaze direction, rate of blinking and eye closure, head tilt, and seat data with data gathered by sensors to provide valuable information on the driver’s physical condition, awareness and even mood. Faurecia’s Active Wellness concept—unveiled at the 2016 Paris Motor Show—proves that this technology might be coming sooner than we think. Active Wellness collects and analyzes biological data and stores the driver’s behavior and preferences. This prototype provides data to predict driver comfort based on physical condition, time of day, and traveling conditions, as well as car operating modes: L3, L4 or L5. Other features such as event-triggered massage, seat ventilation and even changes in ambient lighting or audio environment are possible. Faurecia’s “cockpit of the future,” announced at CES 2018. (Faurecia) Meanwhile, there are other commercial expressions of more advanced HMI as well as plenty of prototypes. Visteon’s Horizon cockpit can use voice activation and hand gestures to open and adjust HVAC. Capacitive sensors are already widely used for touch applications, and touchless possibilities range from simple infrared diodes for proximity measurement to sophisticated 3D time-of-flight measurements for gesture control.Clearly, automotive designers will have a lot more freedom with HMI in the cabin space, providing a level of differentiation that manufacturers think customers will appreciate—and for which they will pay a premium.Managing sensor proliferationResearchers are investigating ways to solve the issue of high-functionality vehicles containing myriad sensing inputs, i.e., when we have so many sensing inputs, designers must address wiring complexity and unwanted harness weight. Faurecia, for example, is considering ways to convert wood, aluminum, fabric or plastic into smart surfaces that can be functionalized via touch-sensitive capacitive switches integrated into the surface. These smart surfaces could reduce the explosion of sensing inputs, thereby diminishing wiring complexity. With availability from 2020, Faurecia’s solutions are approaching the market soon.Beyond functionalized switches, flexible electronics and wireless power sources, and even energy harvesting (to mitigate power sources), could provide some answers. Indeed, recent research has shown that graphene-based Hall-effect devices can be embedded in large-area flexible Kapton films, and eventually integrated into panels. OEMs such as Jaguar Land Rover are interested in such approaches to address the downsides of electronics and sensor proliferation, especially in luxury vehicles. While smart surfaces would represent a big change in sensor packaging and a disruption in current semiconductor processes, they remain a long way from commercial introduction.By 2030 or thereabouts, fully autonomous cars that detect our mood, vital signs and activity level could well be available. Cabins could signal us to open the window if CO2 levels become dangerous. HVAC systems could increase seat ventilation or turn up the air conditioning (or the heat) based on our body temperature. Feeling too hot or too cold in the cabin could become a thing of the past, at least for the driver, whose comfort level is the most important! We could feasibly feel more comfortable in the car than in our office, our home or at the movies. Perhaps our car will become our office, our entertainment center and our home away from home as we take long road trips with the family, without a single passenger uttering, “Are we there yet?” Bio: Richard Dixon, Ph.D., is a senior principal analyst for MEMS research at IHS Markit and author of more than 50 MEMS-related consulting and market research studies. He is a renowned expert on automotive MEMS and magnetic sensors used in safety, powertrain and body applications. Along with supporting the overall activities of the MEMS and sensors group, his responsibilities include the development of databases that forecast the markets for more than 20 types of silicon-based sensors in more than 100 automotive applications. In addition, he has supported organizations with future scenarios for sensors in cars and has supported many custom projects for companies in the automotive supply chain.In his prior post at Wicht Technologie Consulting (WTC), Dixon was a senior MEMS analyst where he led research on physical sensors and was the co-author of the NEXUS Task Force Report for MEMS and Microsystems 2005-2009. He has also led commercialization and road-mapping activities on European Commission-funded technology projects, including detailed MEMS chip cost analysis studies.Dixon worked previously as a journalist in the compound semiconductor industry and has five years of experience as a technology transfer professional at RTI International, where he provided business and market intelligence for early-stage technologies.Dixon graduated from University of Greenwich with a degree in materials science and earned a doctorate from Surrey University in semiconductor characterization. He speaks English and German.For more information, visit https://technology.ihs.com/Categories/450486/mems-sensors. ___________________________________________________________________________________________________ Want to hear more from IHS Markit on MEMS and sensors devices and their applications? Top thinkers from IHS Markit will be speaking at upcoming SEMI events. Register today!Disruption in the authentication sensor market Manuel Tagliavini, Principal Analyst, MEMS Sensors, IHS Markit Autonomous and Electric Cars: What's in for Conventional MEMS SensorsJeremie Bouchaud, Director and Senior Principal, MEMS Sensors, IHS Markit