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Korea is on track to top all other regions in fab investment, spending $63 billion between 2017 and 2020, with powerhouses Samsung Electronics Co. and SK Hynix leading the way, according to latest World Fab Forecast Report by SEMI. Samsung Electronics increased fab investments $770 million to $12 billion this year, and SK Hynix upped its spending a significant $2.8 billion to $7.25 billion in 2018.Korea's investment companies anticipate continued growth for both companies in the second half of 2018.Under this halo of extraordinary investment, nearly 380 SEMI Korea members and industry analysts gathered for 2018 SEMI Korea Members Day on September 13 to share insights on semiconductor market trends and new technologies that could help members bolster their competitiveness. Following are key takeaways from the event. Korea semiconductor market to grow 16% in 2018That’s according to IDC Korea VP Kim Soo-kyung, who noted that data center, memory and Internet of Things (IoT) are becoming key growth drivers for the semiconductor industry. He encouraged semiconductor companies to closely track development of automotive technology and the industry semiconductor market, both key growth areas. SEMI Korea president H.D. Cho opens SEMI Korea Members Day 2018 Continuing fab investment will lead to oversupply, but display will shineMarket entry by Chinese companies will also spur the oversupply, said Jeong Won-Seok, an analyst at HI Investment Corp. He noted that the oversupply will force Korea into stiffer competition with other regions. However, with OLED used for a wide variety of devices and the display industry seeing rapid growth, the sector will remain ripe for growth among Korean companies.Interconnecting various applications is a big semiconductor industry trendThe need for these interconnections will stand out in the mobility and high-performance computing (HPC) markets, said Park Sung-Soon, principal research fellow at Amkor Technology Korea, who addressed trends in packaging technology. He also emphasized interconnection cost efficiency as key to maximizing competitiveness.Smart Manufacturing is driving mass customizationAs semiconductor industry growth continues, production methods are shifting from ‘mass production’ to ‘mass customization,’ increasing the importance of Smart Manufacturing in driving greater production efficiency, noted BISTel VP Jeon Kyeong-Sik. Building a Smart Manufacturing platform to support large-scale production of specialized database and artificial intelligence (AI) chips will boost production efficiency, reduce costs and improve risk management. Virtual simulation will be a key enabling technology. SEMI analyst Clark Tseng presenting at SEMI Korea Members Day 2018 Surge in data volume and technology advances to drive long-term semiconductor industry growthThese key industry drivers will continue to power fab investment growth, with spending focused on 3D NAND, DRAM, and foundry, said Clark Tseng, director of Industry Research and Statistics at SEMI. China alone will see eye-watering growth with the region’s investments in domestic companies surging 46% from 2018 to 2019 and fab investment by Chinese domestic companies outpacing spending by foreign companies in China, Tseng predicted. SEMI membership rises with industry growthCulminating the event, SEMI Korea president H.D. Cho said, "With the growth of the semiconductor market, the number of SEMI members is gradually increasing, and we will help member companies grow with various activities such as Korea Members Day.”Jaegwan Shim is a marketing specialist at SEMI Korea.
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Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.These were among the insights foreshadowing the future of the FHE, electronic textiles, IoT, MEMS and sensors industries at the FLEX Japan and MEMS Sensors Forum Japan 2018. At the April event, organized by SEMI-FlexTech-MSIG, nearly 200 attendees shared their observations and lessons learned in the development of processes, products and applications. Presentations and discussions revealed these five takeaways.1. Expect the unexpected with FHE developmentFlexible Hybrid Electronics (FHE) continues to shrink the size and weight of products, enabling new markets and concepts. “FHE takes printed electronics and adds ICs for getting performance out of the PE structure,” said Wilfried Bair of NextFlex, adding that “peel- and-stick electronic products are one example of unexpected new markets enabled by FHE capabilities.” One potential application is large peel-and-stick safety sensors adhered to buildings to warn of structural dangers.Another surprising turn: With new insights into OLED technology originally developed for flexible displays, Cambridge Display Technology (CDT) has devised an innovative medical diagnostic tool for markets such as biomedical and agricultural monitoring. The tool features an atmosphere-processable OLED component with a simplified OLED structure encapsulated in aluminum foil.2. IoT and FHE devices should change hardware business modelsThis is the standard business model for many new FHE products: develop a product, manufacture it, find customers and sell. FHE and IOT device developers were encouraged by Jam Kahn of Gemalto to consider flipping the script: During FHE product development, explore building an after-market revenue stream by controlling and mining the data for trends it reveals. Because of its data harvesting potential, IoT is an excellent emerging technology for this strategy.The “Experience Economy” could create 200 connectable items per person, generating strong revenue streams from the collection and analysis of massive amounts of sensor-generated data. The key is for the data to be actionable. That means hardware suppliers must extend their focus to software development. “A recent study of California investors found that by 2025, 60 percent of global business profits will be from data,“ noted Harri Kopola of VTT, who advised hardware producers to examine business models that produce continuous value by leveraging software. “With FHE, we are creating the path to digitization for non-digital industries, and these industries need complete solutions,” he said.Hardware provider Xenoma, for example, sells an electronic shirt with sensors for measuring muscle movements, heart rate and other health-related data. Xenoma’s Ichiro Amimori said the company offers its open-source software development kit for free under one condition: The developer must share the collection data with Xenoma. The idea is that the more data collected, the greater Xenoma’s ability to improve human health over the long term and achieve its long-term vision of alleviating disease.3. Roll-to-roll and sheet-to-sheet manufacturing will meet in the middleOne of the big advantages of flexible and printed electronics was its promise to enable the manufacturing of electronics on a roll-to-roll (R2R) process in atmospheric (or close) conditions, like newspaper, rather than one sheet at a time, as with displays or wafers. But as development of inks and interconnects progressed, along with the placement of discrete and thinned-die components and basic flexible substrates on a moving web, most research and development (R D) and limited-production runs moved to sheet-fed systems to control material costs for experiments and low-volume production. R D on printing electronics processes split into two camps: the simple printed components camp on R2R, and the camp backing more flexible hybrid electronics development on a sheet-by-sheet basis. But progress didn’t stop.Harri Kopola of VTT highlighted new R2R inspection and test capabilities in the VTT pilot line in Finland. R2R processing advances incorporate ideas from biology, chemistry, optics, optoelectronics, advanced inspection and test capability, illustrating the multidisciplinary nature of FHE. While accurate, high-speed, pick and place of thinned, bare die remains the domain of sheet-to-sheet manufacturing, look for more improvements in accuracy and speed.Another new manufacturing concept that turns business models on their heads – “minimal fabs” – focuses on creating limited-run equipment and processes that use 3D printing and do not require cleanrooms. With a relatively low cost of entry, the approach enables electronics to be produced affordably anywhere.4. Powering the IoT is a grand challengeThe requirement for edge devices to function without intervention for long periods raises hard questions about how to power the devices. Using organic photovoltaics (OPV) in textiles to harvest energy from light could be one solution, according to Kasimaesttro Sugino of the Suminoe Textile Technical Center. ULVAC’s answer to the IoT power issue are requirements for edge device micro-batteries to be environmentally benign, safe, flexible and compatible with semiconductor processing less than .1 mm in height. The micro-batteries must also feature a long life and support continuous power output, high power density, low self-discharge (over 10 years) and mass production, said Shunsuke Sasaki of ULVAC. The batteries are being built on silicon, glass and stainless steel with dry, thin-film vacuum processing. 5. Flexible displays bring any surface to lifeWith their durability, flexibility, low-cost processing and programmability, flexible displays can transform any surface into a content-rich display with messages that make lives healthier, simpler and safer.One example is FlexEnable’s organic thin-film transistor (OTFT), a device made possible not only by recent advances such as the ability to build organic material transistors on plastic and the increasing clarity of new film materials but by continuous manufacturing process improvements. These advances are improving switching times and the color and video capabilities of thin-film transistors while retaining their flexibility, low power consumption and communication capabilities. Simon Jone of FlexEnable gave the examples of wrapping a display around the blind spots of automobiles or replacing side-view mirrors with interior monitors showing feeds from an external camera, approaches that would improve safety while reducing wind drag and increasing fuel efficiency.E Ink’s reflective technology and flexible products are coming to market with a wider color spectrum. The company’s Michael McCreary said its designers are specifying the panels for innovative projects such as the exterior walls of the San Diego International Airport parking garage. Used to communicate with airport visitors, the installation is weather-proof, programmable and self-powered.
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We fold our clothing. Our bath towels. Our sheets. And for the more artistically inspired among us, our origami. So why not our smartphones and tablets – those marvelously expansive if physically rigid windows to the world?Turns out we’re tantalizingly close to seeing flexible OLED displays, the only barrier to foldable smartphones, a full session on flexible displays at 2018FLEX, Feb. 12-15 in Monterey, California, revealed. With prototype flexible displays in play and the basic technology available, all that’s left before adoption are efficient processing and product development. Ross Young, founder and CEO of Display Supply Chain Consultants (DSCC) put it this way at the mid-February gathering of flexible hybrid electronics (FHE) industry players in Monterey, California: “If panel manufacturers can produce foldable OLEDs at sufficient yields to bring down costs and prices, and brands can develop products that unleash the form factor advantages of OLEDs and better communicate the performance and power benefits of OLEDs, the whole OLED supply chain will benefit.” Of course, prototype development is a key step in proving out designs of OLED displays and other FHE products. Now developers now have help with a process design kit from Hewlett Packard and NextFlex’s open-source Arduino kit for rapid prototype creation and testing, formally unveiled at 2018FLEX, the 17th annual event organized by SEMI-FlexTech, the Nano-Bio Manufacturing Consortium (NBMC) and NextFlex. The conference, which co-located with the 16th annual MEMS Sensors Technical Congress (MSTC), promotes FHE as one way to enable healthier, safer, simpler and smarter electronics products. Typical of a fledgling industry, a slew of flexible display innovators are working to identify viable markets as they develop prototypes. But some designs have vaulted to product development as they edge closer to commercialization or have already hit the market. The list includes FHE printed antennas, smart tags for asset monitoring, a host of consumer health monitors with wireless communication capabilities, and thrilling large-area display installations like E Ink’s Dazzle® -- wrapped around one side of a new car rental center at San Diego International Airport. Dazzle by E Ink Indeed, sensors for wireless medical applications drew some of the strongest interest at the event. Applications included deep brain stimulation to treat conditions including Parkinson’s, epilepsy, OCD and chronic pain (Cortera Neurotechnologies); human hydration monitoring (GE Research); patch-based wearable monitoring to enable better patient outcomes (Graftworx), and measuring blood oxygen levels using oximeters (University of California Berkeley). UMass Lowell presentation summary on printing textiles In the area of manufacturing – long a focus of FLEX – low-cost, low step-count roll-to-roll processes are advancing rapidly as industrial applications adopt these capabilities. At the same time, NextFlex continues to lead the charge in improving FHE manufacturability by providing public/private funds and leading collaboration initiatives. Manufacturing has been at the heart of many FlexTech technical projects and led to FlexTech’s formation of NextFlex, America’s Manufacturing Innovation Institute for flexible hybrid electronics. Paul Gagnon, IHS Markit, keynotes on the progress of flexible displays “2018FLEX splendidly met its objectives,” said conference chair, Bob Praino, CEO of Chasm Technology. “With the keynotes, we explored the breadth of applications enabled by FHE. With the sessions, we dove into the depths of materials, processing, and components demanded by the end-applications. And the exhibit provided the hands-on opportunity to explore new industry collaborations. FHE has clearly moved beyond conceptual and, best of all, many participants found answers to product needs here at the conference.” Beyond technology, the future brainpower for FHE was also on prominent display at 2018FLEX with college students participating in the Student Poster Session, judged by industry experts. The top three entries: First place: Jonathan Ting from UC Berkeley with a poster titled “Fully Screen-Printed NiO thermistor Arrays” Second place: Talha Agcayazi from North Carolina State University with a poster titled “Multi-Modal Array Sensing with Textiles” Third place: Levent E. Aygun from Princeton University with a poster titled “Sound Identification Using Physically-Expansive Sensing System” Outstanding industry achievements and contributions were also recognized at 2018FLEX with the FLEXI Awards. For a copy of the 2018FLEX proceedings, contact Amy Ly at [email protected]. Heidi Hoffman is senior director of FHE, MEMS and Sensors Marketing, SEMI.
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