ITRI

High-tech industry clusters in the bustling northern Taiwan port city of Hsinchu look set for an upgrade. Long a world-class hub of the semiconductor and optoelectronic technology industries, Hsinchu City is laying out plans to work with SEMI to attract more international companies, generate more jobs, promote Hsinchu’s development and help grow Taiwan’s microelectronics industry. High-tech heavyweights such as TSMC, UMC, MediaTek, Realtek, and AUO are all headquartered in The Windy City. The Industrial Technology Research Institute (ITRI), a leading Taiwan research center and incubator, also calls Hsinchu home, and the city boasts one of the highest concentrations of educational institutions in the region, a roster that includes National Chiao Tung and National Tsing Hua universities. Hsinchu’s thriving relations with these industry, academic and research partners have made it a hotbed of innovation, with numerous large Taiwanese and foreign companies having opened local offices. No less than these partners, the city – like SEMI – is committed to innovation.In a recent visit to the SEMI Taiwan office in Taipei, a Hsinchu City government team led by mayor Lin Chih-Chien, met with Terry Tsao, global SEMI chief marketing officer and president of SEMI Taiwan, to explore collaboration opportunities in areas such as technology subsidies, policy, education, and infrastructure. The meeting built on a relationship between the city and SEMI Taiwan that sprouted after SEMI executives and Hsinchu officials joined ITRI to host the Autonomous Driving System Platform in Open Fields kick-off ceremony – an initiative to accelerate Taiwan’s adoption of smart transportation technologies – at SEMICON Taiwan 2019.At the meeting, Mayor Lin highlighted that Hsinchu has long attracted high-tech companies by cultivating a business-friendly climate through incentives such as subsidies for infrastructure buildouts. He hopes to work with SEMI to promote to members the benefits of setting up local offices in Hsinchu City.With both Hsinchu’s high-tech clusters and SEMI’s global members deeply reliant on skilled workers for sustaining innovation and growth, Tsao and Mayor Lin agreed that inspiring students to pursue an education and careers in science, technology, engineering and mathematics (STEM) is vital to building a high-tech talent pool. One collaboration opportunity SEMI Taiwan is eyeing is to launch Taiwan’s first SEMI High Tech U (HTU) program in Hsinchu to spark the interest of school-age children through STEM educational activities at school camps or art and cultural centers. SEMI’s STEM discovery program offers hands-on activities and experiential learning led by industry volunteers. Since 2002, HTU has reached some 8,000 high-school students in 12 U.S. states and nine countries.Emmy Yi is a marketing specialist at SEMI Taiwan.

It’s official.The first autonomous vehicle has been verified for operation on the open road in Asia with no traffic restrictions. And this is no corner case, flash-in-the-pan technology. The white 4-door minivan’s modular software can be integrated into all manner of vehicles including cars, trucks and buses. More promising still, the minivan – proven roadworthy after more than 1,300 miles of testing – will lead not only to an upgrade of Taiwan’s automobile electronics industry but to groundbreaking smart transportation service models.Imagine, for example, hopping a driverless shuttle to the hottest attractions in Hsinchu City, Taiwan such as Big City, Hsinchu Cheng Huang Temple, 19 Hectares Grassland, 17KM Coastline Scenic Area and Siangshan Wetland. The autonomous ride could become another transportation option sooner than you think.“We have every intent to make available self-driving sightseeing shuttle services soon,” said Chih-Chien Lin, mayor of Hsinchu City. “The services will be our first step to substantially improving the traffic flow, highlighting the unlimited applications associated with autonomous vehicles.”Bearing the license plate number Taiwan No.0001 – the first issued for an autonomous vehicle in Taiwan – the minivan is an early but important advance in the region’s autonomous-driving technologies under a new initiative led by the Industrial Technology Research Institute (ITRI), which developed the test vehicle’s software, and the Hsinchu City government. SEMI president and CEO Ajit Manocha joined Hsinchu City mayor Chih-Chien Lin and ITRI vice president Pei-Zen Chang to promote the initiative at SEMICON Taiwan 2019 in the run-up to its launch during an October 22nd press conference in Hsinchu City. Taiwan luminaries attending the press conference were (L-R in photo below) Terry Tsao, SEMI Chief Marketing Officer and SEMI Taiwan President; Jwu-Sheng Hu, Vice President and General Director, ITRI Mechanical and Mechatronics Systems Research Laboratories; Der-Sheng Lin, Deputy Director General, MOEA Department of Industrial Technology; Chih-Chien Lin, Mayor of Hsinchu City; Pei-Zen Chang, Vice President, ITRI. ITRI and Hsinchu City government officials kick off the next phase of Taiwan’s smart transportation initiative in an October press conference near Nanliao Fishing Harbor, Hsinchu City. “This milestone in self-driving technology is a shining example of public-private partnerships in action to advance smart mobility and dovetails with SEMI's work building communities consisting of the automotive and microelectronics industries, government, and academia for collaborative innovation,” said Terry Tsao, SEMI chief marketing officer and SEMI Taiwan President. “We are thrilled to have joined ITRI and the Taiwan government in promoting the extraordinary power of technology to make automobiles and cities smarter.”Emmy Yi is a marketing specialist at SEMI Taiwan.

Flexible hybrid electronics (FHE) is innovation and modern technology at their best, giving rise to lighter, more malleable sensors that better conform to the human body while breeding new applications across a number of markets. For the semiconductor industry, FHE technology is enabling the development of a new generation of chips with the high performance, light weight, scalability, softness and flexibility usually seen in printed electronics. The technology is a boon to chipmakers, giving them novel ways to innovate for the Internet of Things (IoT) market.“The global printed electronics market is expected to garner 14.9% GAGR from 2018 to 2023,” said Stanley Wong, Director of Asia Business Development, Brewer Science, said in his presentation at FLEX Taiwan 2019 in late May. Representatives from industry, government, academia and research institutions gathered at the event in Taipei to explore flexible electronics innovation and growth opportunities.One shining star of FHE innovation is the foldable smartphone. So bright is the future of the bendable devices that not even recent trade tensions between the United States and China have dimmed prospects for the fledgling industry.“While the US-China trade war might slow down shipments of Huawei’s phones, the industry remains bullish on foldable phones,” said Stacy Wu, Principal Analyst at IHS Markit. “When the first generation of flexible AMOLED displays was launched in 2016, the rolling radius was 3mm and it could be folded 200,000 times.”For foldable phones, the 200,000 mark was a major milestone – the industry’s consensus standard for foldable phone display reliability. The industry reasoned that phones capable of being folded and unfolded 200,000 times without distorting color or images or the display itself cracking was a safe bet for consumer adoption. Earlier this year, both Samsung and Huawei announced foldable phones using the thin-film-display technology, ushering in the era of mass-market availability of the devices. Steve Chiu, Division Director for Electronics, IC package, Industrial Technology Research Institute (ITRI), believes that breakthroughs in the next generation of flexible AMOLED technology will allow thin films to be folded 100,000 times with a rolling radius up to 30mm and electric resistivity of less than 10 percent. The rolling radius of 30mm, 10 times higher than today’s phones, will give foldables a higher bending radius, while the lower electric resistivity will help maintain the brightness of the AMOLED panel after tens of thousands usages and extend the service life of foldable smartphones.The biggest challenge facing the foldable phone industry remains developing new materials that are flexible yet durable, stressed Francesco Lemmi, Business Development Director, Flexible Display, at DuPont. Today, the prevailing practice is to layer polyimide (PI) and hard coating on the display module. These stacked protective films replace traditional glass panels but present technical challenges related to impact resistance and the durability of the display as it is folded and unfolded over time.Smart clothing market is another hot market, with 33 percent global growth annually and revenue expected to reach US$ 3.26 billion in 2026. Yet for all the promise of smart clothing, reliability and accuracy remain a big challenge chiefly due to a lack of industry standards. Another gap is the unanswered question of whether consumers will embrace light and energy-efficient products.FLEX Taiwan 2019 speaker Satoshi Maeda of Toyobo is confident they will, pointing out that in the future consumers will enjoy a wide selection of comfortable smart clothing products and applications. The industry is still working to better understand how to develop human-machine interfaces, the essential seam between the human body (the outer layer of skin) and electronics, said Dr. Reinhold H. Dauskardt of Stanford University. Still, he sees great promise in an innovative somatosensory communications platform involving human skin. Human-computer interactions have historically been defined by human touch and vision (for example, typing at a computer keyboard and checking our monitor for the accuracy of our inputs). Dauskardt believes that, in the future, electrical impulses from the skin (conductance) will interact with signals from electronic devices to establish a more intimate human-machine interface that could be adapted one day to extend the visual and auditory abilities of humans.David M. Yeung, co-founder and CEO of Lionrock Batteries, pointed to another challenge in wearables: battery size. Today, large and heavy batteries account for 50 percent to 70 percent of the space in wearable devices, making many of the products too cumbersome to wear. Nanofiber lithium-ion batteries now under development can be as small as ultra-thin 2mm with a rolling radius of up to 20mm in radius and support for high electrical currents, significantly lightening their weight and improving comfort.Nardev Ramanathan, Lead Analyst, Digital Health and Wellness at Lux Research, predicts that, of all flexible electronics products, smart watches will win the largest market share and with the fastest rate of adoption. The devices will get a boost when they shrink as flexible batteries are integrated with the bands. The next wave of smart wearables will feature devices for exercise or medical monitoring. Already, FHE materials have led to advances in medical devices. One example is that smaller hearing aids are now possible thanks to flexible electronics and dressings used to promote skin regeneration, reduce wrinkles and remove scars.Gillian Ewers, VP Marketing at PragmatIC, sees fertile ground for FHE applications in IoT solutions. As FHE manufacturing costs drop, she believes IoT technologies will significantly deepen their penetration into a broad range of industries. For example, the number of electronic tags used in convenience stores worldwide will exceed 100 billion in 2025. Thinner than human hair and more durable than traditional wafers, these tags are expected to spawn a host of new business opportunities. FLEX Taiwan attracted more than 270 attendees from more than 30 fields including smart healthcare, e-paper, displays, system integration, automotive electronics, textiles, wearables, and avionics. On the first day of the event, industry, academia and research center representatives from the United States, Japan, China, Singapore and Taiwan gathered to discuss common goals on a range of FHE-related issues and deepen cross-regional cooperation. Like the FHE industry itself, SEMI-FlexTech remains focused on the future by strengthening cross-border cooperation to help manufacturers find killer applications and test profit-making models. For Taiwanese companies, the event will continue to provide insights on market trends, equipment, materials, advanced manufacturing technologies, product applications and new business opportunities, helping the organizations hone their competitive edge in the global market.Emmy Yi is a marketing specialist at SEMI Taiwan.

Post-Conference Report: SEMI Heterogeneous Integration SummitDemand for high-performance computing (HPC) chips is exploding. These super-speedy chips are critical for data centers and cloud computing infrastructures to support new performance-hungry technologies such as artificial intelligence (AI) and 5G. The challenge is for the devices and their multi-core architectures to couple high bandwidth density with low latency and high energy efficiency. Heterogenous integration offers a potential answer as an advanced packaging technology designed to meet these skyrocketing performance demands on HPC chips and open the door to a whole new world of 3D integrated circuits (ICs).So important are 3D ICs that Intel and TSMC representatives speaking at the recent Heterogeneous Integration Summit hosted by SEMI Taiwan in Taipei declared that the packaging technology will all but dictate the future of the industry. All told, 12 speakers from government, academia and a broad range of leading international companies from sectors including advanced packaging, design, manufacturing, silicon photonics, equipment and materials shared forward-looking strategies, the latest technologies and potential heterogeneous integration market opportunities. Koushik Banerjee, vice president, TMG, Assembly, and Test Technology Integration, at Intel pointed out that using heterogeneous integration for a single SiP (system-in-package) will deliver what the industry has long wanted by enabling multiple process nodes, more diverse silicon IP (intellectual property) and chip functionality, and chips that pair low energy with high frequency. Intel plans to announce its first Forveros 3D packaging product combining a 10nm HPC chiplet with a low-energy 22nm base die and stacked with memory on top. When asked about the future of advanced packaging technology, Banerjee said it will be very much about the combination of Foveros and its very own Embedded Multi-Die Interconnect Bridge (EMIB).For its part, TSMC, will continue to upgrade its CoWoS (Chip-on-Wafer-on-Substrate), InFO (Integrated Fan-out) and other 2.5D IC production solutions while developing 3D chip stacking technology such as SoIC and WoW (wafer-on-wafer). TSMC is ushering in a new age of 3D IC packaging, said Marvin Liao, Vice President, Backend Technology and Service Division, at TSMC. The company’s SoIC is based on Chip-on-Wafer concept, with the flexibility to support one-to-many or different process nodes, whereas its WoW integrates two wafers with solid yields that could be used for products of the same size or manufactured with mature process technology.Speakers also included representatives from ATOTECH, Lam Research, SPIL, Sigurd, Cadence, Grand Process Technology, ITRI (Industrial Technology Research Institute), Industrial Development Bureau, and Lee San-Liang, Distinguished Professor, Department of Electronic and Computer Engineering at National Taiwan University of Science and Technology all shared their perspectives on equipment, materials, and testing and how different industry value chains might contribute to the development of heterogeneous integration technology.Expected to be a key driver of the next wave of semiconductors, heterogeneous integration and related technologies – including 3D IC, FOWLP (Fan-out wafer-level packaging) / FOPLP (Fan-out panel-level packaging), silicon photonics, Micro LED, compound semiconductor, automated optical inspection and SLT (system level testing) – will be a key focus at SEMICON Taiwan 2019, September 18 to 20 in Taipei. The Heterogeneous Integration Innovation Zone – along with featured international programs such as SiP Global Summit, Strategic Materials Conference, the Smart Data Summit and the Smart Automotive Summit – will gather key industry players to reveal the latest technology breakthroughs and market trends.Emmy Yi is a senior marketing specialist at SEMI Taiwan.