EVs

Handel Jones, a well-known, longtime strategic analyst and commentator covering the semiconductor industry, authored the recently published book – When AI Rules The World: China, the U.S. and the Race to Control a Smart Planet. I spoke with Jones about the fascinating read.

Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan, recently discussed technology trends with Young Liu, Chairman of Hon Hai Technology Group (Foxconn), as a prelude to SEMICON Taiwan’s five online forums.

The automotive industry is changing. Our vehicles are getting electrified, connected and automated. As this trend is accelerating, it’s having an impact on how semiconductor devices, including MEMS sensors, are designed and qualified for automotive. As automotive semiconductor designers carefully consider product definition, product validation, and long-term reliability, MEMS sensor suppliers are responding to new opportunities created by electrified and automated vehicles by developing inertial measurement units (IMUs) for automated driving as well as battery pressure monitoring sensors for Li-ion EV batteries. The most complex MEMS device of all The automotive MEMS IMU is probably the most complex MEMS device that will be used inside a vehicle. This type of IMU is a System-in-Package (SiP) comprised of multiple gyroscope and accelerometer sensing elements plus a signal processing ASIC, integrated into one package that creates an inertial sensor able to measure up to six degrees of freedom (6DoF): yaw, roll and pitch for rotational movements, and lateral, longitudinal and vertical acceleration for linear movements. Degrees of freedom in a vehicle For vehicles with Level 3 autonomy and above (per SAE definition), the IMU is mandatory for taking over the trajectory control of the vehicle in case other sensors, such as the camera, radar or LiDAR, become impaired. Should such a failure occur, the IMU will function as a guidance sensor to bring the car to a safe stop within a short period of time and distance. The IMU is also used to control the regular movement of the car while driving in automated mode. While IMU technology already exists for aerospace applications, there are significant challenges to adapting it for automotive. The automotive IMU requires high performance at costs that are compatible with the automotive industry. Because automotive life cycles are long, MEMS sensor suppliers must produce the device in high volume for an extended period of time. They must also guarantee the sensor’s performance and reliability over a 10- to 15-year lifetime with no maintenance or recalibration of the sensor required. Only a few MEMS suppliers have the capability and willingness to embark on this kind of journey. Electrification is creating new applications for MEMS sensors The conversion from internal combustion engines to electrified propulsion is going to affect the powertrain MEMS market. For example, pressure sensors used in engine management for air pressure and fuel pressure will simply go away with electrification. However, the use of large Li-ion batteries in electrified vehicles has created a new application for MEMS sensors. One of the known risks of Li-ion batteries is the small probability for a battery cell to go into a thermal runaway situation that will lead to a fire. The press has reported multiple cases of EV batteries catching fire. Thermal runway effects When it comes to thermal runaway events, every second counts. Detecting the event as early as possible enables the vehicle safety system to take all necessary measures to warn occupants of an imminent fire and activate timely countermeasures (e.g., trigger fire extinguisher and call fire brigade) to mitigate the impact of the fire. Published studies have shown that measuring the pressure inside the battery pack is a good indication that a thermal runaway is starting. The outgassing of a battery cell, plus a sudden rise in temperature, will increase pressure inside the battery pack, which will generate a pressure pulse. To detect such a pressure pulse, a MEMS pressure sensor must permanently measure the pressure inside the pack. It must also report to the battery management system any suspicious change in pressure, independent of atmospheric pressure changes. It’s important to keep this kind of sensor on all the time to detect any pressure anomaly in the system, even when the vehicle is completely off. NXP has developed a pressure sensor to specifically address this new safety application in EVs, and several automotive manufacturers are already using this solution. NXP battery pressure management sensor The quest for zero defects While the automotive industry is targeting zero fatalities as its ultimate goal, the semiconductor industry and module suppliers are targeting zero defects for each and every semiconductor device. For safety-critical automotive MEMS sensors complying with the Automotive Electronics Council (AEC) Q100 qualification for semiconductors, it’s necessary but clearly not sufficient to guarantee a zero defects production launch and long-term reliability of the device. To boost the reliability and robustness of automotive sensors, NXP has developed Above and Beyond (AaB), a new methodology that studies advanced reliability and robustness well ahead of the device’s qualification and production release. Based on risk-mitigation analysis, AaB consist of extensive testing, such as test-to-fail, corner lot testing, and new use-case testing combined with advanced statistics, all of which help NXP understand how these different parameters interact with each other. As sensor suppliers must integrate AaB into their project planning, it does add time and cost to the project. The upside is that this early investment pays off as long as weaknesses in the device can be detected and corrected before a production launch. Field failures, on the other hand, can lead to unplanned redesign and requalification of a device. Worst-case, they can lead to a recall campaign that costs a huge amount of money. We’re systematically using the AaB methodology at NXP for safety-critical MEMS sensors because its potential benefits far outweigh its costs. For more information about NXP MEMS sensors, register for the upcoming webinar series, MEMS to Market: Ingredients for Success, where NXP will discuss The Growing Importance of MEMS Reliability (May 5, 2021). Register by March 10 to watch all the webinars LIVE. Each webinar will also be available to watch on-demand at your convenience. Contact the author via LinkedIn or learn more about NXP sensors. About the Author With nearly 30 years of experience in the field of automotive and MEMS sensors, Marc Osajda is responsible for European automotive MEMS sensors business development activities at NXP Semiconductors. Osajda holds an engineering degree in mechanics and electronics from the French Ecole Nationale Superieure d’Arts et Métiers (ENSAM). NXP Semiconductors is an active member of MEMS Sensors Industry Group®(MSIG), a SEMI technology community that connects the MEMS and sensors supply network in established and emerging markets to enable members to grow and prosper. Visit us today.

Augmented reality (AR) tyrannosauruses towered on-screen as I interacted with the creatures in a mix of prehistoric and cutting edge. Or, rather, my AR double was doing the playacting. Minutes later, virtual doppelgangers of a small lineup of chip industry executives cut the ceremonial ribbon. Seemingly sweeping away the winter chill, the opening of SEMICON Japan 2019 dazzled with smart technology and the promise of lives, cities and workplaces transformed, with uber-intelligent applications in full display at Tokyo Big Sight. But what resources does the industry need to harness to drive the next era of innovation? The semiconductor industry’s unwavering passion and young talent are key, said Hiroshi Imano, Chairperson of the SEMICON Japan Initiatives Committee, in his opening keynote. And hardly any region of the world is in a better position to help realize that future than Japan, Imano said. The region supplies one third of the equipment and more than half of all materials to the global semiconductor manufacturing industry.Talent was also top of mind for SEMICON Japan 2019 keynote speaker Makiko Eda, Japan's Chief Representative Officer at the World Economic Forum (WEF). Serving as a platform for public-private partnerships, the organization's mandate is to tackle global issues such as climate change and geopolitical strife in making world more resilient to risk and, by extension, more sustainable.Spanning ecology, economy, technology, society, geopolitics and industry, that mission includes reskilling and upskilling a billion people over the next decade, a high priority for WEF, which hosts a conference every January in Davos, Switzerland. The theme of this month's conference – Stakeholders for a Cohesive and Sustainable World – reflects the vital importance of building the international partnerships and global consensus necessary to achieving WEF's goals.One key to that sustainability will be technology and Arm, a global chip design company, will play a key role, with the company’s chips touching over 70 percent of the world’s population, Arm president Yuzuru Utsumi said in his keynote. Today, Arm is driving toward an ambitious goal: Ship 100 billion chips from 2017 to 2021 – the same number produced over the previous quarter century – by powering advances in mobile computing, server and networking infrastructures, and automotive applications.Arm’s innovation ecosystem of more than 1,000 partners will deliver these chips as they continue to work together to develop differentiated technology. Arm plans to increase investments not only in its primary processor business to accelerate market share gains but in the company’s new IoT business to create new revenue streams. The goal: Deliver long-term sustainable growth, Utsumi said. SEMICON Japan 2019 showcases SMART manufacturing and transportation Billed as a showcase of smart technologies, SEMICON Japan 2019 delivered with an array of eye-grabbing exhibitions in the popular SMART Applications Zone. In the SMART Transportation area, the automatic operation pavilion featured a car equipped with open-source software for autonomous driving. The exhibitor, Tier IV, aims to help lead the early commercialization of self-driving vehicles through the adoption of its software, Autoware, which makes it easier to develop self-driving vehicle prototypes using low-power platforms.Sony Semiconductor Solutions demonstrated a vision sensing processor designed to guide autonomous drones. Using two cameras, the processor measured the changing distance between visitors moving about the exhibit and stationary objects in real time, indicating proximity in hues of red (nearby) and blue (at a distance). Many visitors were wowed, describing the multichromatic display as futuristic.Others rode a simple wooden swing hanging by two ropes, but from dizzying heights thanks to Solidray’s Duo-Sight, a virtual reality (VR) system that projects 3D images stretching from wall to floor for immersive experiences. One visitor thrilled at how riding the swing, suspended only a few feet from the floor, felt like soaring on a flying trapeze. Target applications for the technology include virtual rides at amusement parks and presenting interior design options to homeowners.In the SMART Manufacturing area, one highlight was the demonstration by the National Institute of Advanced Industrial Science and Technology (AIST) of a remote-controlled Minimal Fab System designed for low-volume, high-mix chip production with little staffing. Designed to increase production efficiency, the system allows a circuit designer to manufacture a semiconductor by singlehandedly operating equipment up and down the production line. Controlling nearly 50 pieces of equipment, the Minimal Fab System on display manufactured chips that were verified for functional operation and exhibited afterwards.On the SMART Applications stage, exhibitors DENSO and Toyota Motor Corporation announced a new joint venture to conduct research and advanced development of the next-generation in-vehicle semiconductors critical to electric and autonomous vehicle innovation. The venture, operating as MIRISE Technologies, will combine Toyota’s mobility expertise with DENSO’s in-vehicle component prowess. The goal is to build a rapid, competitive development system by 2030, said Yoshifumi Kato, executive director of the DENSO Research and Development Center, and president and representative director of the venture. On track to begin work this year, MIRISE will span three fields of technology development: power electronics, sensing and SoC (System-on-a-Chip). The name MIRISE combines word the Japanese word "mirai" (future) with "rise."Business Continuity PlanningNatural disasters and other emergencies are an ongoing threat to uninterrupted business operations across the semiconductor manufacturing supply chain and particularly in earthquake-prone Japan. To better prepare for business disruptions and restore normal operations as soon as possible after disaster strikes, more companies are teaming on Business Continuity Planning (BCP).THK's Seismic Isolation Experience Car demonstrated one technology designed to help – a seismic isolation device. The car shakes like an earthquake to give people inside a taste of how a building heaves and sways during a quake with and without the device deployed. Visitors were struck by how much the isolator dampens tremors to prevent or minimize damage. In the BCP seminar, representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting shared lessons learned from actual disasters and discussed the critical importance of daily disaster drills. Yukihide Keigo, Executive Engineer in charge of Products and Development at Sony Semiconductor Manufacturing, recounted how the company’s Kumamoto Prefecture plant struggled for 96 days to restore full operations after the facility sustained heavy damage in the 2016 earthquake. Keigo said the plant lacked the structural reinforcements necessary to withstand the impact and fell prey to poor planning and accountability. The Kumamoto plant has since implemented measures – structural and procedural improvements – that more accurately account for seismic risks to ensure full recovery within 56 days. The plant’s new procedures include emergency drills for staff including night-shift workers.Innovation abounds at six SuperTHEATER forumsSEMICON Japan 2019 was held in the West and South Halls of Tokyo Big Sight as organizers of the Tokyo Olympics occupied the East Hall, the exhibition's usual home at the venue, to prepare for the 2020 games. For the first time, the main stage, SuperTHEATER, was set up in the cavernous arena near the main entrance. The SuperTHEATER featured six forums over three days. Semiconductor Executive Forum – View by Top Two in the Era of Digitalization with thought leaders from IHS Markit and Sony Semiconductor Solutions SMART Connectivity Forum – Infinite World Brought by 5G Innovation with experts from Softbank and Nokia Solutions Networks SMART Transportation Forum I – Front-line of Automated Driving featuring speakers from Intel and DENSO SMART Transportation Forum II – Revolution of Sky Transportation, supported by the U.S. Commercial Service in Japan, with presenters from Ministry of Economy, Trade and Industry (METI), Subaru and Bell Helicopter Manufacturing Innovation Summit – Issues and Innovation: What will Drive Growth to 2030 featuring thought leaders from VLSI Research, Applied Materials, KLA, Nikon and Tokyo Electron Mirai Vision Forum – Future Relation of Technology and Body 2.0 with speakers from Leave a Nest, Ory Lab and Autonomous Control Systems Laboratory The Mirai Vision Forum highlighted advanced technologies that could lead to societal improvements. One presenter, Kentaro Yoshifuji, CEO at Ory Lab, recalled how, as a child, he once stayed home from school while recovering from an illness. His imagination in full flight, the youngster imagined having a clone that could attend school and be with his classmates. The experience eventually inspired him to develop OriHime, a robot that gives socially isolated people a way to communicate with friends or colleagues remotely. Originally developed for physically impaired people, OriHime today is used to help the able-bodied. The robot is situated with the companion and the user operates OriHime remotely. A camera and monitor in OriHime’s face provide the visual and audio connection and the user controls the device with a smartphone or tablet or, for those who are paralyzed, through eye movement. One potential application: With OriHime stationed at a business office, working mothers could use OriHime to telecommute to better balance their careers with their parenting responsibilities at home. The robot would be a mother’s go-between, enabling her to communicate directly with colleagues.The next generation of innovators also took the stage as five teams presented innovative business ideas in friendly competition. The top prize in The TECH CAMP Hackathon went to the group that hatched an ingenious plan to develop a jacket that trains users to move their bodies in preprogrammed ways. For example, legendary Japanese professional baseball player Shigeo Nagashima could wear the gear while batting to program the device, then give the jacket to someone who’s never swung a baseball bat. The jacket would help the user replicate Nagashima’s swing. Now comes the real work of any innovator – executing on the vision.And then came two soccer-playing artificial intelligence (AI) robots that squared off and ... Scored! The demonstration by the Toyota National College of Technology started as a research project by Toyota National College students in 2002. The young innovators designed and developed all the robotic hardware and software from scratch. Looking ahead to SEMICON Japan 2020!SEMICON Japan 2019 not only gathered leading Japanese semiconductor materials and manufacturing equipment providers to demonstrate their latest innovations. The premiere regional event also provided insights on key trends critical to the entire electronics manufacturing supply chain. This year’s event drew more than 51,000 visitors and 695 exhibitors from 15 regions filling more than 1,700 booths.SEMICON Japan 2020 returns to East Hall at Tokyo Big Sight in December 2020. I look forward to seeing you there!Jim Hamajima is president of SEMI Japan.

The microelectronics industry is entering the era of Cloud Engineering Simulation to slash the costs and risks of new technology development and speed time-to-market in spaces like semiconductors, MEMS sensors, RF front ends, biomedical and driverless cars. In the run-up to SEMICON Europa, 12-15 November, 2019, in Munich, Germany, SEMI spoke with Ian Campbell, CEO of OnScale, about the new paradigm of Cloud Engineering Simulation. Campbell shared his views ahead of the SMART Design Forum, 14 November, 2019, 14:30 to 17:00, in Hall B1, TechARENA 1 at SEMICON Europa. Registration is open. Join the forum to meet experts from OnScale and other key industry influencers. Attendance is free of charge for all SEMICON Europa visitors.SEMI: How did your adventure with OnScale start?Campbell: I’m an engineer. When I was still in high school, I took a night class at Nashville Tech to learn AutoCAD R14, and I’ve been designing and engineering things ever since. I was introduced to Desktop Simulation in my bachelors of mechanical engineering program and used many types of simulation tools for massive design studies at the Aerospace Systems Design Lab at Georgia Tech. I’m a simulation junkie.I started my first Silicon Valley high-tech company, NextInput, in 2012 with Dr. Ryan Diestelhorst (now VP of Strategy at OnScale), to commercialize new ForceTouch and 3D Touch technologies based on our patented MEMS force sensors. At NextInput, we bought hundreds of thousands of dollars of engineering software, but were always frustrated by slow, inaccurate engineering simulation results. We dreamed about running massive simulations on Cloud Supercomputers and creating true Digital Prototypes that could replace costly, time-consuming, and risky physical prototypes.When I got the chance to join the team that became OnScale in 2017, I jumped at the opportunity. At OnScale, we took engineering simulation solvers that had been developed for the U.S. military to run on U.S. Department of Defense and DARPA supercomputers and built a cloud supercomputer platform on Amazon Web Services to run the solvers. The net-net is the world’s first on-demand, infinitely scalable Cloud Engineering Simulation platform. Now, we routinely run massive multi-billion degree of freedom simulations for Fortune 100 companies, including many from the semiconductor and MEMS industries. Since our business model is to charge per core-hour for simulations, the incredible capability we built is cost-effective and available to small startups as well. SEMI: How is the semiconductor design ecosystem evolving? How is Cloud Engineering Simulation applied to semiconductor and design industries?Campbell: The entire industry is experiencing a massive acceleration in product launch cycles and increased competition. New markets like IoT and 5G are reducing semi/MEMS product cycles from years to months. That, in turn, puts enormous pressure on semiconductor and MEMS designers. Missing a key product introduction like a flagship smartphone launch can literally make or break a company.A reliance on traditional engineering methods – schematic capture and layout of a chip, taping out (physically prototyping the chip), performing engineering validation on an e-bench, qualifying the chip (or not qualifying it and going back to the drawing board), and finally launching mass production – is no longer sustainable from a competitive perspective.Instead, market-leading firms are turning to Cloud Engineering Simulation and Digital Prototypes to explore massive design spaces, find optimum designs that beat the competition in every KPI (size, power, performance), and digitally qualify designs before ever cutting silicon, ensuring that designs are robust over their intended operating environments and performance envelopes. Large thermal analysis of a chip on a circuit board executed quickly on the OnScale Cloud Simulation Platform SEMI: Can you give us an example? Campbell: A great example is thermal analysis. Thermal effects have always had huge impacts on MEMS device performance and, more recently, they are beginning to impact performance of next-gen semiconductors, especially GaN power electronics for electric vehicles (EVs).Conducting a full system-level thermal analysis of something like an EV power management system – a power IC in a package, on a board, in an enclosure, under various loading conditions – has been a challenge from a simulation complexity perspective (degrees of freedom) and from a parametric sweep perspective (running hundreds or thousands of simulations to optimize chip placement, routing, etc.). To run these sets of simulations using legacy desktop simulation would take weeks, perhaps even a month or more. To run these massive simulations in parallel on cloud supercomputers using OnScale takes days or even hours.Our customers routinely run very large simulation studies on OnScale Cloud for thermal simulations, RF filter simulations, MEMS simulations, packaging simulations (what we call Digital Qualification), and many more use cases.SEMI: What’s one of your strategic objectives for 2020? Campbell: For 2020, we’re doubling down on MEMS and semi simulation capabilities. We will be launching additional solver capabilities like EM that will be critical in our strategic markets like 5G. We will also be launching a Cloud API so that engineers can integrate OnScale directly into their existing engineering workflows (e.g. MATLAB or EDA/CAD tools) with just a few Python commands.SEMI: Can you share one prediction for the future of semiconductor design solutions? share?Campbell: I think we will continue to see MEMS and semi designers push the envelope and bring smaller, more performant, more cost-effective solutions to market. I’d like to see more highly cost-effective flexible semi/MEMS designs come to market to enable next-gen IoT and IIoT applications. I’d also like to see more biomedical applications – biomems, microfluidics, and labs on a chip for all sorts of life-enhancing applications.SEMI: What are your expectations regarding the SMART Design Forum at SEMICON Europa 2019 in Munich? Campbell: I’m looking forward to getting back to my roots in MEMS/semi design and chatting with other designers about the future of engineering and the future of semi! Ian Campbell is a twice venture-backed Silicon Valley CEO and expert in MEMS sensors, semiconductor technology, and engineering software. Most recently, Ian co-founded OnScale, a Cloud Engineering Simulation startup backed by Intel Capital and Google’s Gradient Ventures. OnScale is revolutionizing engineering by combining world-class multiphysics solvers with Cloud supercomputers, machine learning, and artificial intelligence. Prior to co-founding OnScale, Campbell served as founder and CEO of NextInput, where he led the startup through multiple rounds of funding – totaling $12 million and an additional $4 million in research contracts with government and industry partners – and built a world-class team of engineers and scientists who developed 3D Touch and ForceTouch technologies for smartphones, wearables, industrial, and automotive interface applications. He also secured the first major smartphone OEM design wins in Asia. Campbell earned his B.S. in mechanical engineering from Middle Tennessee State University, and his MSAE in aerospace engineering and MBA from Georgia Institute of Technology.Serena Brischetto is senior manager, marketing and communications, at SEMI Europe.

Automobiles have become an even more important segment for MEMS and sensors as carmakers integrate more chips for propulsion, navigation, and control into their designs. However, these advanced functions and their crisp rate of adoption have fragmented the sourcing of automotive chips. IHS Markit’s Jérémie Bouchaud provided a closer look at and outlook for this key market at the MEMS and Sensors Executive Congress in late October in Napa. Following are key takeaways from his presentation.Autonomous and Electric/Hybrid Vehicles to Drive MEMS Market GrowthThe automotive market, approaching 100 million vehicles produced annually, is approaching $6 billion, dominated by MEMS and silicon magnetic sensors for chassis and safety, and powertrain applications. Going forward, the market growth will be in autonomous vehicles and electric/hybrid vehicles. Because the penetration of electric and hybrid vehicles is much higher than that of autonomous vehicles, it has a larger available market, particularly for sensors. Each of these markets has its own dynamics.For example, the electric and hybrid market has historically relied on a significant number of traditional, or non-semiconductor sensors, but new sensor technologies are vying to address multiple sensing needs. The most important limitation on demand of autonomous vehicles is the overall market penetration: IHS Markit expects autonomous vehicle production to reach 10 million at most by 2030.Production of Electric and Hybrid Automobiles Now Growing at Fast ClipProduction of electric and hybrid vehicles is in a rapid growth phase, and IHS Markit expects penetration of such vehicles to reach 50% of the automotive market by 2030, up from 3% in 2016. The core functions of charging and power inversion require, among other capabilities, current, temperature and position sensing. Historically, many of these functions have been handled by non-semiconductor devices, for example negative temperature coefficient (NTC) thermistors for temperature sensing, devices that appear to be strongly positioned. In other areas, semiconductor sensors are competing with traditional devices.For example, silicon magnetoresistive devices are going head-to-head with inductive devices for position and Hall effect sensing. Sensing requirements are also likely to evolve over time, particularly as battery systems become more reliable and robust. While some automakers are looking to sensors to monitor pressure or gas leaks from batteries, battery makers are more focused on maturing the systems and reducing the need for monitoring.Autonomous Vehicles Drive New Source of Demand for MEMS and SensorsThe movement towards automated driving has created a new source of demand for MEMS and sensors, with advanced driver assistance systems driving faster growth than the historical powertrain applications. Currently available vehicles are at Level 2 (partial automation), with multiple cameras and radars. Level 3 vehicles (conditional automation) are likely to enter the market next year, adding driver monitoring cameras, LIDAR systems and, potentially, microbolometers or other night-vision systems. Level 4 and 5 (high and full automation, respectively) will add vehicle-to-vehicle communications and other systems, but are not likely to be widely available for several years.The autonomous vehicle market, while smaller overall compared to electric/hybrid vehicles, provides a more attractive opportunity for MEMS devices, particularly in LIDAR systems. LIDAR and other sensing/surveying systems are at the heart of autonomous vehicles, and MEMS devices are in demand for the critical beam-steering function. However, demand for image and other sensors will accelerate as the higher levels of autonomy are rolled out.Automotive Drives Extremely Diverse Set of Applications for MEMS and Sensor MakersThe automotive market presents an extremely diverse set of applications for MEMS and sensor makers. Some companies have developed broad product portfolios and compete in multiple applications. For example, TDK offers NTC thermistors as well as MEMS and silicon-based sensors. Semiconductor companies such as Infineon are competing in MEMS and with silicon-based sensors such as magnetoresitive and Hall effect.The growth in demand for image and radar sensors used in ADAS, as well as magnetoresistive and Hall sensors in EVs, means that the center of gravity in automotive markets is likely to shift from MEMS over the next several years – a fundamental change, Bouchaud cautioned, that will put automotive sensor suppliers focusing solely on MEMS at risk.Paul Semenza is a consultant in SEMI Industry Research and Statistics.