heterogeneous integration roadmap

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.

In the first part of this double feature, we looked at the automotive industry’s transition toward a mobility ecosystem and the shifting business model perspective from selling vehicles to miles. At the core of these changing dynamics are four trends represented by the acronym ACES: Autonomous, Connected, Electric, and Shared mobility. Each of these trends is largely enabled by microelectronics through computer processors, sensor units, and communication architectures. Part 2 of this series explores the business opportunities at the transition from automotive to mobility, and the specific role SEMI can play as a natural bridge between the two ecosystems.Electronics and Software as Drivers for Automotive InnovationThe ACES trends represent an acceleration of the shift in automotive from the industry’s traditionally strong focus on mechanics and hardware toward electronics and software. This transition to electronics and software as drivers for automotive innovation already started in the 1970s with electronic fuel injection, anti-lock brakes, trip computers, and many other attributes that are now considered standard features. As a result, there are now hardly any automotive systems that are not computer-controlled. A vehicle without power windows and locks, electronic climate control, or MEMS-reliant airbags are basically unimaginable in many markets.As shown in the graphic[1] depicting the electronics share of total vehicle cost, the numbers paint a clear picture of the continued growth of electronics over time, with a 44% share today expected to grow to 50% by 2030. McKinsey Company estimates the automotive software and electrical/electronic (E/E) components markets combined will grow at a 7% CAGR from USD 238 billion in 2020 to US$469 billion by 2030[2].The assumption of continued and sustained growth presents a promising outlook for semiconductor and sensor content in vehicles over the next decade, which is particularly strong in the electrification space. Hybrid electric vehicles (HEVs) already contain $900 worth of semiconductor content, and battery-based electric vehicles (EVs) contain $1,000 worth of semiconductors – much higher than the average of approximately $450 of content in conventional vehicles[2]. Other business opportunities in the mid-term (3-5 years) include software, battery technology, infrastructure (charging stations, other hardware components, etc.), as well as vehicle-to-vehicle (V2V) and vehicle-to-environment (V2X) communication. These technologies also demonstrate how the industry’s business focus is expanding beyond the confinement of an individual vehicle to increasingly contemplating the evolving ecosystem around it, resulting in real mobility solutions. Image credit: Continental AG This creates significant opportunities for a large number of SEMI members in the semiconductors and sensors business by connecting them with new customers and partners in the automotive and mobility supply chains, primarily vehicle manufacturers and Tier 1 suppliers, and together realizing new business in new automotive applications such as: Autonomy, including ADAS (GPUs, LiDAR, radar, camera, accelerometers...) Connectivity (link to outside infrastructure and in-cabin devices, roadside units...) Electrification (power electronics, battery monitoring, H2 detection in fuel-cell...) Sharing (customizable vehicle interior, trackable mobility devices such as scooters...) In-cabin experience (media systems, displays, VR/AR, occupant detection...) Vehicle architecture (flex-ray, automotive ethernet, diagnostics, smart parts...) Safety and security (HW/SW firewall, parts authentication, upgradability...) In these partnerships, the vehicle manufacturers and component suppliers clearly benefit from leveraging semiconductor capabilities including: Device and system reliability/robustness/quality (“Zero Defect”), which creates opportunities for new SEMI Standards (e.g. wafer-to-device/system traceability) New design architectures for added functionality, safety and security New packaging solutions (automotive OEMs are already participating in the Heterogeneous Integration Roadmap, seeking to collaborate with device manufactures and Original Semiconductor Assembly Test (OSAT) companies to reduce costs and differentiate on automotive-grade solutions Sensors and imaging (cameras) SEMI Smart Mobility Initiative – Connecting Mobility and ElectronicsSEMI launched its Smart Mobility Initiative in 2018 based on the mandate of providing “SEMI members with access to new business opportunities and collaborative platforms in the automotive electronics supply chain.” The initiative is currently focused on synchronizing the automotive and microelectronics supply chains for automotive electronics innovation – in particular semiconductor devices, sensors, and related products manufactured for this space and sold to vehicle OEMs and Tier 1s. To facilitate closer dialogue among stakeholders from this combined ecosystem, SEMI formed the Global Automotive Advisory Council (GAAC) which now has five regional chapters and represents dozens of companies. Collectively, GAAC members discuss and act on a wide range of topics, from Silicon Carbide (SiC) standardization to new design architectures and closing the OEM requirement gap.While continuing to build on the strong automotive foundation, SEMI’s Smart Mobility Initiative is now expanding its reach and scope of activities to broader mobility themes, such as infrastructure and battery technology and Smart City, to infuse SEMI member communities and the GAAC with new stakeholders and new ideas. These are exciting times!Please contact Bettina Weiss, Chief of Staff at SEMI, at [email protected] for further information about SEMI’s Smart Mobility Initiative, the Global Automotive Advisory Council, and how SEMI can help your organization navigate electronics in the automotive industry to drive innovation in the mobility space.[1] see graphic, created with data from NXP / Freescale[2] Source: McKinsey Company, 2019Microelectronics Power the Future of Mobility – Part 1: Autonomous, Connected, Electric and SharedBettina Weiss is Chief of Staff and Global Smart Mobility Lead at SEMI. Sven Beiker is Smart Mobility Consultant at SEMI.