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Traditionally, defect classification is done manually by operators or using Automated Optical Inspection (AOI) machines, often leading to classification inconsistencies. Also, rules-based AOIs may at times be unable to fully satisfy project requirements due to the rigidity of inspection recipes. SixSense – Breaking the Status Quo with Artificial Intelligence Enter SixSense, an AI-powered defect classification software platform that has been making breakthroughs in defect detection and classification for semiconductors to make manufacturing smarter and more efficient. Founded in 2018, SixSense has already amassed a wealth of experience and chalked up a number of successes such as automating the manual image classification process, reducing manufacturing false rejects, and capturing escapees. Infineon Technologies and GlobalFoundries were amongst the early adopters of SixSense’s platform: classifAI. With Infineon, classifAI has allowed over-rejection rates to be precisely quantified. classifAI – Simple UI, Easy Usage, Powerful Models As a UI-based assistive software platform, classifAI, SixSense’s automated defect classification platform is built with the defect and yield engineer in mind. SixSense takes care of all the back-end complexities – such as coding, algorithm modelling and deployment – to enable end users to get started and use the platform with a simple GUI. The simplified end-to-end AI pipeline offered on the platform includes data labelling to make data AI-ready, model training, and model testing. Ultimately, models are deployed on the production floor for 24/7 inferencing of hundreds of millions of images every year, at scale, across processes, tools and sites. Machine learning models built by the SixSense team have seen strong results, with model accuracy of up to 98% in certain use cases. Track Record of delighting IDMs, Foundries and OSAT Customers SixSense has consistently solved visual inspection problems and enabled the success of IDMs, foundries and OSATs since its inception. The AI technology has helped a range of customers across 100mm-300mm wafer standards, both pure silicon and compound wafers, and caters to specific end-use market requirements such as RF and automotive. Partnerships between startups and established manufacturers are key to actualizing the value of AI in manufacturing. “Our collaboration with AI startup SixSense has enabled us to explore opportunities in yield gain, improving cycle time, and real-time monitoring of process shifts,” said Dato’ Tan Soo Hee, Executive Vice President, Global Backend Operations at Infineon Technologies Asia Pacific. “SixSense has been very attentive to the needs of our engineering team, addressing project requirements using a customer-first approach evident in the design of the intuitive software platform,” said Melvyn Peh, Principal Engineer, Automation-Scan-Pack, Infineon Technologies Asia Pacific. The intelligent annotation module is one of many offered by SixSense, which uses AI to train AI and accelerate the data annotation process by focusing on the semiconductor-specific requirements. Another valuable module in classifAI is advanced analytics that capture the heatmap for defect distribution on the images. Images are stacked on top of each other, with the location of defects aggregated to provide the defect heatmap. Through this, systematic failure patterns were identified that allowed defect engineers to zero in on key sources of failure and assist in root-cause analysis. Infrastructure – Scale Fast, Adapt Quickly, Accelerate Value Creation In the dynamic world of technology, machine learning and AI projects must meet changing infrastructure demands. A cloud-first approach is often favored for the plethora of benefits it offers. “We’re looking forward to a great partnership with SixSense, treading together hand in hand exploring fresh ideas and possibilities,” said Manju Jalali, Vice President of digital manufacturing at GlobalFoundries, who oversees the company-wide roll out of classifAI. For use cases where on-premise deployments are preferred, SixSense offers such options for infrastructure integration, satisfying all possible infrastructure requirements in the market. Contributing to a vibrant innovation ecosystem SixSense was mentioned by Singapore’s Deputy Prime Minister Heng Swee Keat during an event that marked Infineon’s 50th anniversary in Singapore: “I am heartened that Infineon will be investing more than $27 million over three years on an AI initiative in Singapore. Under this initiative, Infineon Singapore will be partnering academia, industry, and local startup SixSense AI to develop new AI solutions and courses.” Explosive Growth of AI in Chip Manufacturing According to a McKinsey Company report, AI contribution to semiconductor company earnings is projected to rise to between $85 billion and $95 billion per year in the coming years. SixSense has been taking great strides in creating value for their semiconductor customers. “SixSense offers tremendous value in a high-growth vertical in the semiconductor industry, marrying the latest deep learning algorithm with the compute power of the cloud,” said Rajan Rajgopal, CEO of DenseLight Semiconductor. “This leads to faster root-cause analysis that helps reduce the cost of non-conformance and improve quality.” Dominic Teo is Enterprise Business Development Representative at SixSense. He can be reached at [email protected].
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The SEMI Smart Manufacturing Americas Chapter, a key driver of the Global Smart Manufacturing Initiative, accelerates awareness of digital and data-driven strategies and implementations to help speed adoption of smart manufacturing. In 2021, the Chapter will focus on expanding its work across the industry to include academic and research initiatives. The semiconductor industry saw an unprecedented focus on improving digital monitoring of manufacturing activity in 2020, partially due to COVID-19. The Americas Chapter shared case studies on new tools and techniques for social distancing in fabs, aides for remote maintenance, and tips for remote workers. The Chapter also introduced its three pillars of Sensing, Connecting and Predicting and offered related programs. The Global Smart Manufacturing Conference (GSMC) highlighted the significance of universities and research institutions in the development of smart manufacturing with their focus on joint research for broad dissemination. To help drive smart manufacturing advances, at GSMC several offered non-proprietary tutorials on topic including the following: Integrating sensors for acquisition – CEA-Leti Applying new AI and ML tools and strategies to manufacturing – Binghamton University Digital tools for planning, qualifying and management and scheduling in fabs – MINES Saint-Étienne. Adding AI tools to robot work in a smart factory – KAIST Institutes By continuously highlighting the activities of these and other institutions through presentations, interviews, articles and blog posts, we will draw more attention to what is on the horizon for smart manufacturing in 2021. The SEMI Smart Manufacturing Americas Chapter also plans to elevate activities important to the Outsourced Semiconductor Assembly and Test (OSAT), Surface-Mount Technology (SMT) and Printed Circuit Board Assembly (PCBA) segments of the industry including programs on inspection, traceability and the SEMI SMT-ELS Standard for SMT automation. Thurston Taylor, marketing expert at Tokyo Electron and Vice Chair of the Americas Chapter, notes that “With increasingly more demanding requirements for bump, assembly and test, smart manufacturing and applied data science are necessary to achieve back-end goals now and in the future.” Also, many companies are implementing smart manufacturing applications and assessing various strategies to increase their smart manufacturing capabilities. Members of the Americas Chapter plan to review and develop self-assessment documents and maturity models that apply to front-end wafer fabs all the way through packaging and assembly facilities. “Moving forward it is imperative for all of us to up the intensity on specific ROI vectors such as quality, cost, productivity, sustainability and safety leveraging our smart manufacturing SEMI framework of Sensing, Connecting and Predicting,” said noted Bobby Mitra, worldwide director of Smart Manufacturing at Texas Instruments and Americas Chapter Chair. “By offering special flagship events, invited talks, ROI case-studies and ROI criteria in maturity models, we’ll bring high value to the smart manufacturing industry.” Chapter members also will begin mapping the skills needed to implement and support increasingly digital manufacturing capabilities, including any new skill sets, to help companies develop their hiring, training and management strategies. The mapping effort aims to support companies in building a strong pipeline of employees who can efficiently manage and operate smart manufacturing facilities. For its part, the Americas Chapter’s Go Green Subcommittee will focus on applying smart manufacturing technology to reducing the electronic industry’s carbon footprint by accurately tracking energy waste improving overall fab efficiency. Stay tuned for details on activities planned for our chapters in Europe, China, Japan, Korea, Southeast Asia and Taiwan. To learn more about each chapter and how to get involved, please visit the SEMI Smart Manufacturing Hub and sign up for our newsletter. Ayo Kajopaiye is senior project coordinator, Collaborative Technology Platforms, at SEMI.
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Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.
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In the first part of this double feature, we looked at the automotive industry’s transition toward a mobility ecosystem and the shifting business model perspective from selling vehicles to miles. At the core of these changing dynamics are four trends represented by the acronym ACES: Autonomous, Connected, Electric, and Shared mobility. Each of these trends is largely enabled by microelectronics through computer processors, sensor units, and communication architectures. Part 2 of this series explores the business opportunities at the transition from automotive to mobility, and the specific role SEMI can play as a natural bridge between the two ecosystems.Electronics and Software as Drivers for Automotive InnovationThe ACES trends represent an acceleration of the shift in automotive from the industry’s traditionally strong focus on mechanics and hardware toward electronics and software. This transition to electronics and software as drivers for automotive innovation already started in the 1970s with electronic fuel injection, anti-lock brakes, trip computers, and many other attributes that are now considered standard features. As a result, there are now hardly any automotive systems that are not computer-controlled. A vehicle without power windows and locks, electronic climate control, or MEMS-reliant airbags are basically unimaginable in many markets.As shown in the graphic[1] depicting the electronics share of total vehicle cost, the numbers paint a clear picture of the continued growth of electronics over time, with a 44% share today expected to grow to 50% by 2030. McKinsey Company estimates the automotive software and electrical/electronic (E/E) components markets combined will grow at a 7% CAGR from USD 238 billion in 2020 to US$469 billion by 2030[2].The assumption of continued and sustained growth presents a promising outlook for semiconductor and sensor content in vehicles over the next decade, which is particularly strong in the electrification space. Hybrid electric vehicles (HEVs) already contain $900 worth of semiconductor content, and battery-based electric vehicles (EVs) contain $1,000 worth of semiconductors – much higher than the average of approximately $450 of content in conventional vehicles[2]. Other business opportunities in the mid-term (3-5 years) include software, battery technology, infrastructure (charging stations, other hardware components, etc.), as well as vehicle-to-vehicle (V2V) and vehicle-to-environment (V2X) communication. These technologies also demonstrate how the industry’s business focus is expanding beyond the confinement of an individual vehicle to increasingly contemplating the evolving ecosystem around it, resulting in real mobility solutions. Image credit: Continental AG This creates significant opportunities for a large number of SEMI members in the semiconductors and sensors business by connecting them with new customers and partners in the automotive and mobility supply chains, primarily vehicle manufacturers and Tier 1 suppliers, and together realizing new business in new automotive applications such as: Autonomy, including ADAS (GPUs, LiDAR, radar, camera, accelerometers...) Connectivity (link to outside infrastructure and in-cabin devices, roadside units...) Electrification (power electronics, battery monitoring, H2 detection in fuel-cell...) Sharing (customizable vehicle interior, trackable mobility devices such as scooters...) In-cabin experience (media systems, displays, VR/AR, occupant detection...) Vehicle architecture (flex-ray, automotive ethernet, diagnostics, smart parts...) Safety and security (HW/SW firewall, parts authentication, upgradability...) In these partnerships, the vehicle manufacturers and component suppliers clearly benefit from leveraging semiconductor capabilities including: Device and system reliability/robustness/quality (“Zero Defect”), which creates opportunities for new SEMI Standards (e.g. wafer-to-device/system traceability) New design architectures for added functionality, safety and security New packaging solutions (automotive OEMs are already participating in the Heterogeneous Integration Roadmap, seeking to collaborate with device manufactures and Original Semiconductor Assembly Test (OSAT) companies to reduce costs and differentiate on automotive-grade solutions Sensors and imaging (cameras) SEMI Smart Mobility Initiative – Connecting Mobility and ElectronicsSEMI launched its Smart Mobility Initiative in 2018 based on the mandate of providing “SEMI members with access to new business opportunities and collaborative platforms in the automotive electronics supply chain.” The initiative is currently focused on synchronizing the automotive and microelectronics supply chains for automotive electronics innovation – in particular semiconductor devices, sensors, and related products manufactured for this space and sold to vehicle OEMs and Tier 1s. To facilitate closer dialogue among stakeholders from this combined ecosystem, SEMI formed the Global Automotive Advisory Council (GAAC) which now has five regional chapters and represents dozens of companies. Collectively, GAAC members discuss and act on a wide range of topics, from Silicon Carbide (SiC) standardization to new design architectures and closing the OEM requirement gap.While continuing to build on the strong automotive foundation, SEMI’s Smart Mobility Initiative is now expanding its reach and scope of activities to broader mobility themes, such as infrastructure and battery technology and Smart City, to infuse SEMI member communities and the GAAC with new stakeholders and new ideas. These are exciting times!Please contact Bettina Weiss, Chief of Staff at SEMI, at [email protected] for further information about SEMI’s Smart Mobility Initiative, the Global Automotive Advisory Council, and how SEMI can help your organization navigate electronics in the automotive industry to drive innovation in the mobility space.[1] see graphic, created with data from NXP / Freescale[2] Source: McKinsey Company, 2019Microelectronics Power the Future of Mobility – Part 1: Autonomous, Connected, Electric and SharedBettina Weiss is Chief of Staff and Global Smart Mobility Lead at SEMI. Sven Beiker is Smart Mobility Consultant at SEMI.
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In the two months since the COVID-19 outbreak in January, the Chinese economy has shifted from shock to ongoing recovery under the guidance of the Chinese government. China has worked tirelessly to restore production at its chip manufacturing facilities, a core strategic industry in the region, and the effort is paying off. Operations at several fabs and OSATs – the domestic semiconductor industry’s chief growth engines – have begun to stabilize.As of mid-March, SMIC had restored its manufacturing lines to over 90% of production capacity and expects to be operating at full bore in the next few weeks, while the company’s R D line has returned to full operation. Huahong Grace reestablished normal supplies of various equipment parts and production raw materials. At Huahong Fab2, 12 new pieces of equipment went online to help increase production capacity, and production at Huahong Fab1 and Huahong Fab3 is now stable. JCET said the company's overall return rate has exceeded 90%. Meanwhile, IDM maker Silan Microelectronics' 6-inch and 8-inch lines maintained 90% production.Production lines at Huahong Group, SMIC, CanSemi, GTA Semiconductor, Samsung (Xi'an) and other mainland China chip manufacturers have been generally operating at normal capacity since the Spring Festival. Lines at YMTC, Tianma, CSOT, and BOE, all in the Coronavirus epicenter of Wuhan, have also returned to normal operations. China’s chip industry is finding its footing, and an impressive host of semiconductor companies are gearing up to participate at SEMICON China 2020, rescheduled to June 27-29. The list includes the major domestic wafer foundries such as Huahong, the major packaging and testing companies such as JCET, TFME, Huatian, and large domestic and foreign equipment companies, among them TEL, ASMPT, DISCO, ULVAC, VAT, ASML, KLA, NAURA, AMEC, Anji, CETC, Sinyang, SMEE, CAS, CANON and SPIROX.DigiTimes, a daily newspaper covering the semiconductor, electronics, computer and communications industries in Asia, interviewed SEMI China President Lung Chu in mid-March about what’s ahead for China’s semiconductor industry. Following is an English translation of the interview. DigiTimes InterviewAs China continues to ramp back up to normal activity, SEMI China is making every effort to hold SEMICON China 2020, a leading international semiconductor industry platform for promoting growth and innovation in China's semiconductor industry supply chain. SEMI China president Chu emphasized that the strong support of SEMICON China 2020 exhibitors and the Chinese government made rescheduling the event to June possible.Chu, a semiconductor industry veteran who has experienced numerous economic and industry upheavals over his career including the SARS shock in 2003, said current global economic uncertainty stems from two black swans – the global COVID-19 pandemic and how long it will take to contain it, and the sharp drop in oil prices triggered by the recent geopolitical dispute between Russia and Saudi Arabia. In China, the government responded with strict containment actions and promoted public awareness of self-isolation, resulting in effective domestic containment as of mid-March. As a major oil consumer, China sees the lower prices as relatively favorable to its economy. Those dynamics should allow China to recover sooner than many other regions, and it could emerge even stronger once the pandemic is contained, despite the current slump in global semiconductor demand, Chu said. Once the epidemic has passed, China is in a position of "turning crisis into opportunity," and the semiconductor industry will recover from the trough, he said. Companies in semiconductor supply-chain sectors face various challenges in restoring normal operations. IC design companies experienced relatively low impact since employees can work from home and most companies are located in major cities in China, where epidemic prevention control is strict. For most chip manufacturers, production has not stopped but is hampered by manpower shortages from restrictions on employees returning to work. IC packaging and testing companies are suffering bigger impacts because of the more labor-intensive nature of their operations. However, all companies in the supply chain will be affected by the decline in demand for electronic products and ICs in 2020. As the COVID-19 threat recedes in China, the region remains unwavering in its commitment to semiconductors as a strategic industry with its continuing efforts to evolve sustainable and reliable localized supply chains, Chu said. Investments in “new Infrastructure” for 5G, the Internet of Things (IoT), data centers, as well as public health services should help drive semiconductor demand for smart applications and devices associated with the new infrastructures as are all powered by ICs, benefiting companies in the global supply chain. The COVID-19 outbreak triggered a slowdown in new factory construction after the Chinese government implemented restrictions on the flow of people resulting in a worker shortage. SEMI has revised downward its forecast of wafer equipment spending in China to just a 3% increase this year.Market analysts revised downward forecasts for 2020 annual global semiconductor revenue growth from 7-10% to 0-5%, while some expect negative growth. The recent COVID-19 outbreaks in Europe, the United States and other regions have created more uncertainty. Declining end-user demand for electronics will drive down spending on upstream equipment for both memory and logic IC device makers. For Chu and his SEMI China staff, the postponement of SEMICON China 2020 has been a “major challenge,” he said. “It is a huge project to communicate and coordinate with the government and to reconfirm with exhibitors and industry leaders.”As a leading industry platform, SEMICON China attracts a large number of global customers and suppliers each year. The major China domestic suppliers, leading foundries and OSATs have confirmed their attendance in SEMICON China 2020. Most key foreign suppliers are planning to staff the event with local teams in case some executives are unable to enter China by June due to travel restrictions if the COVID-19 virus has not been brought under control in the United States, Europe and other regions. To assure the success of the concurrent Forums, SEMI has prepared multiple contingency plans, including live broadcast, video and slide presentations. SEMI will also hold the grand opening session at a larger venue than last year’s event to accommodate more attendees with more sitting distance apart. SEMI will follow government guidelines to implement appropriate public health and safety measures during SEMICON China. "Ensuring the welfare of all exhibitors and guests and providing a safe exhibition environment is SEMI’s top priority," Chu said.Cherry Sun is a marketing manager at SEMI China.
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