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ITN Energy Systems

For the first time in its 20-year history, the FLEX Conference dedicated an entire session to the important and timely twin topics of environmental sustainability and power consumption of electronic devices. The event planning committee recognized the urgent need to increase the awareness of how technology and electronics devices can help reduce greenhouse gas emissions (GGE) overall and meet aggressive targets to curb the impacts of climate change. Dr. Christine Ho, CEO of Imprint Energy, delivered the keynote for the session, focusing on the need for powering billions of sensors that will be deployed annually, and their role in reducing fossil fuel emissions through becoming aware of issues, monitoring our resources over time, and intervening early and often to combat waste in multiple sectors and industry. Quoting extensively from the organization Exponential Roadmap Initiative (ERI), Ho noted that “the digital sector has the potential to directly reduce fossil fuel emissions 15% by 2030 and indirectly support a further reduction of 35% by influencing consumer and business decisions and systems transformation.” The initiative’s playbook for reaching net zero carbon emissions by 2050 and limiting global warming to 1.5° Celsius outlines how the digital sector can help remove 13 of the 27 gigatons (GT) of CO2 needed to reach this goal. Ho stated that the rapidly emerging Internet of Things (IoT), devices, software systems, and data insights are the backbone of this digital transformation. The IoT's vast network of sensors can transform multiple sectors, such as the logistics industry, which on an annual basis moves and ships more than 10 billion tons of products worldwide by ships, airplanes, long haul trucks, and train - contributing 17% of GGE and more than 4 gigatons of CO2 annually. Always-connected IoT sensors used by the logistics industry can reduce waste and damage in the supply chain, which is especially problematic for temperature-sensitive and damage prone pharmaceutical and food products, mitigating the need for producing high volumes of buffer inventory to replace damaged goods Noting that the attendees of 20 Years of FLEX Conferences were a big part of the current advancements of low-cost printed, active, shipping tags, Ho said that Imprint Energy’s flexible and thin, Zinc based batteries are ideal for IoT devices, since they boast a significantly smaller carbon footprint than Lithium-Ion (Li-ion) batteries. Imprint Energy is working with systems designers and integrators to design the battery as an integral part of the device package and use low-power strategies to extend device lifetimes. Imprint recommends co-locating battery printing alongside the device integration to further minimize shipping and logistics. When manufactured separately, Imprint’s small footprint, low-operating temperature process line (less than 80°C) provides significant carbon footprint advantages over other technologies. Ho challenged the attendees, saying “we all need to participate in protecting our earth. We need to eliminate waste and contribute to reducing half of our current greenhouse gas emissions by 2030, and we can do that by deploying a global digital skin with more than 100 billion IoT devices in 2030 and up to 1 trillion by 2050. We can minimize the device carbon footprint and maximize its longevity by considering the power capability, as well as design for re-use and re-cycling of the critical materials.” Following Dr. Ho’s presentation, FLEX kicked off a spirited panel discussion with experts from PowerRox, ITN Energy Systems, Birla Carbon, and Auburn University and chaired by Bob Praino and Eric Forsythe, from Chasm Advanced Materials and the Army Research Labs, respectively. The speakers summarized their on-demand presentations and looked at what is being done today to recycle Lithium-Ion batteries, how IoT devices are currently being powered, and drew comparisons between the early days of the Internet and development of the IoT. The speakers generally agreed that the power requirements of wireless cellular and Blue-tooth devices were still too high and run times too short. FLEX 2021 was a virtual event in the 2021 SEMI Technology Series. It was organized by SEMI FlexTech, SEMI NBMC, and NextFlex. Major sponsors included E Ink and Novacentrix. The event covered technical developments in flexible, printed and hybrid electronics, featuring more than 100 presentations and networking opportunities. Technical proceedings are available until March 26 at http://flex.semi.org. Heidi Hoffman is senior director in Corporate Marketing at SEMI.
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Humanity has survived almost unimaginable challenges over the past 5,000 years of documented human history. From war, famine and natural disasters to the first global pandemic in the last 100 years, more often than not, people have relied on one another to survive and thrive again. As the industry association representing the global microelectronics industry, SEMI has similarly made collaboration and community integral to the fabric of its organization. From helping members to succeed through the COVID-19 pandemic to facilitating member-driven industry standards around environmental health and safety, materials, and manufacturing capabilities, this approach shows members that standing together is better than standing alone.On the eve of the 50th annual SEMICON West (July 20-23, 2020) — the first virtual edition in SEMI’s history — I spoke with SEMI’s vice president of technology communities, Michael Ciesinski, about the role of SEMI in tackling big challenges through an active member community intent on solving problems through collaboration.SEMI: How long have you worked with SEMI and in what capacity?Ciesinski: In January 2016, I started my second tour at SEMI when FlexTech, the industry consortium I’d been leading, became SEMI’s first strategic partner. Nearly two years into that role, SEMI President CEO Ajit Manocha asked me to form Technology Communities to engage members with common interests. After FlexTech, we brought on the Fab Owners Alliance, then MEMS Sensors Industry Group (MSIG), and later the Electronic System Design Alliance (ESD Alliance).SEMI now has more than 20 communities in all, including Smart MedTech, Smart Data AI, Smart Manufacturing, Electronic Materials, and Integrated Packaging, Assembly and Test.SEMI: What is your role with Technology Communities — and how do members stand to benefit?Ciesinski: The leadership of Technology Communities ensures that SEMI’s benefits and services align to our members’ interests so we can provide member benefits that matter most. This spans forming communities where people hold common interests (e.g., advanced packaging) to facilitating standards that will promote intelligence in manufacturing (e.g., data standards for AI and machine learning) as well as providing R D funding.I’m especially proud that over the past three years, SEMI has brought more than $40 million in R D funding to our members, with most grants in the $500,000-$1 million range. We’ve been especially successful in securing funding in flexible hybrid electronics (FHE) through U.S. Army Research Laboratories (ARL), a model we first developed through FlexTech.Two recent recipients of FHE funding, GE Research and ITN Energy Systems, show how the grants are spawning partnership opportunities among commercial enterprises, R D organizations and universities. In developing lightweight, non-invasive wearables, including a human-performance sweat-monitoring patch that remotely analyzes sweat to detect hydration levels and other vital signs, GE Research is using key components such as sensors and lightweight batteries in its designs.ITN Energy Systems designed a flexible all-solid-state lithium battery that’s printed on light, flexible substrates to power small and incredibly thin applications.Universities are also benefiting by plugging into the SEMI ecosystem. In fact, 40-50 percent of funded projects are seeding commercialization by universities. This is another validation that SEMI’s collaborative, community approach to microelectronics is working.SEMI: Position, Timing and Navigation (PNT) is another hot area where SEMI has secured ARL funding. What makes this funding different and why is it important?Ciesinski: The PNT grant makes ARL funding available to the MEMS Sensors Industry Group (MSIG) members through SEMI for the first time. If you’ve ever lost GPS signal while coming out of a tunnel, you know how frustrating that is. For us, that’s an inconvenience, but for a healthcare worker in a remote location who’s waiting for a delivery of medication by drone, it could be life-critical. While that’s just one example of why we need PNT to operate when GPS isn’t available, I can imagine dozens of other important dual-use cases, including autonomous driving.SEMI: How else do Technology Communities benefit under SEMI?Ciesinski: Technology Communities need access to diverse resources to spur continuous innovation. Electronic Materials Group participants, for example, need to stay informed on regulations coming out of Asia, the U.S. and Europe that may affect their businesses. Where else other than SEMI can like-minded stakeholders congregate with people up and down the supply chain to determine whether industry-wide action is needed on regulation?SEMI: What is the importance of SEMI’s global footprint?Ciesinski: I’ve worked with many associations and managed major industry consortia. The clear advantage of SEMI is our global footprint. And that’s vital because microelectronics is a global industry involving a multitude of stakeholders that play essential roles in the supply chain.Let’s say you want to discuss EU regulations on hazardous chemicals. Rather than decipher these complexities alone, you can pick up the phone to speak with someone on SEMI’s European team to learn what’s critical.What if you’d like more information on the 20-plus new fabs that are going up in China? You can explore that question with our SEMI China or SEMI Industry Research and Statistics teams.SEMI: How has SEMI evolved over the years?Ciesinski: SEMI has a long history of providing what the industry cares about. We started in trade shows and pivoted to industry standards. We began with small silicon wafers and wafer carriers, and now within the span of 50 years we’re working on data-format standards that will support the application of AI and machine learning (ML) in the semiconductor industry.While highly varied today, data-format standards will help component manufacturers refine processes to create more efficient solutions. This ARL-funded program, which pairs SEMI members with the grant recipient, Cornell University, may offer dramatic gains in the productivity of semiconductor manufacturing.SEMI: How does SEMI’s approach to COVID-19 reflect core values of collaboration and community?Ciesinski: Together with Ajit Manocha, CMO Terry Tsao and other team members at SEMI, we pulled together a task force to help SEMI members navigate the pandemic.We tapped two existing groups, Environment, Health and Safety (EHS) and Information Technology Leadership (ITL) from the start, documenting their strategic and tactical approaches to help all members through the COVID-19 resource section of our website. The EHS section provides tips on facilities and meetings, employee policies, business travel and communications, while the ITL section lists insights on computing hardware for staff, licensing, networks, security and employee policies.Our EHS leadership team, which includes Entegris, Axcelis, Versum, and Intel, immediately started sharing best practices for sanitizing facilities. As a result of team meetings, SEMI EHS shared best practices on keeping the workforce remote and guidelines for returning people to work safely. From securing PPE and safeguarding employees and visitors by performing thermal scanning to outlining communications around potential employee exposures, EHS has provided meaningful resources for the benefit of all members.SEMI also took immediate steps in the area of advocacy. Our advocacy team in Washington, D.C., together with regional SEMI presidents around the world, have ensured that semiconductor facilities were and still are considered essential businesses in the U.S., Europe and Asia. That’s because microelectronics are foundational to fighting the pandemic.Microfluidics are critical to the Reverse Transcription (RT) Polymerase Chain Reaction (PCR) tests most commonly used for COVID-19. Sensors are embedded in the pulse oximeters that allow patients and healthcare professionals to monitor a vital rubric: oxygen saturation level. If oxygen saturation level drops into the low 90 percentiles or below, it may be time to go to the hospital for treatment.Microcontroller units are essential components in a wide range of hospital equipment, including the ventilators that may make the difference between life and death in the most seriously ill patients.SEMI: How can the ingenuity realized through microelectronics continue to help us tackle other big problems? Ciesinski: We have MEMS and sensors to thank for distributed intelligence, giving us the ability to put sensors anywhere, locally based in the field or in the packaging house.Food production is a prime example. Leveraging miniaturized wirelessly connected sensors, we can trace food through the entire production lifecycle, from the seed in the ground to the food in the warehouse and, ultimately, to the product that lands on the table.From larger enterprise such as IBM Food Trust to small startups, we’re using MEMS and sensors to improve crop yields so we can feed a human population that’s growing each year.There’s a sustainability piece as well. We’re using MEMS and sensors to reduce the amount of fertilizer or other nutrients or chemicals in the soil. That’s good for the environment and for the agricultural workers who labor in the fields.MEMS and sensors can also condense the time it takes to perform a specific task, conserving human resources.SEMI: Where do you think SEMI will go in the next decade?Ciesinski: Ten years from now, I believe we will still have our global footprint in place. I expect it will expand, particularly in Asia.We may also expand into new areas such as Latin America and Central America, which would provide at least two major benefits: People working in microelectronics would, I hope, have access to better quality of life. And diversifying the supply chain would allow nations and regions to have more control over the products they need, from PPE to medications, which may help us to better manage through the next pandemic.I am also hopeful that SEMI will be on the leading edge of helping our members communicate in much different fashion from what we have today. We’re already expanding beyond the paradigm of in-person meetings for standards meetings and conferences. As we move forward, I think we’ll see a hybrid solution to doing business, combining in-person meetings with virtual conferences and digital content that’s available 24/7.Whatever changes we see in SEMI, I’m confident that we will continue to see a global footprint in an industry association that prioritizes connections among members.Engage in the SEMI experience at upcoming SEMICON WestRegister today to hear from keynote speakers such as environmental advocate and former U.S. Vice President Al Gore, futurist and author Steve Brown, and IBM Research senior vice president and director Dr. John E. Kelly III, and Lea Gabrielle, special envoy of the Global Engagement Center for the U.S. State Department, at SEMICON West , July 20-23, 2020. Content will be live streamed and available on-demand. Michael Ciesinski is vice president of Technology Communities for SEMI, the global microelectronics industry association, appointed in August 2018. At SEMI, he directs activity for more than 20 industry groups, oversees the association’s R D funding program, and develops new technology initiatives to serve SEMI’s 2,400 members. Prior to re-joining SEMI, Ciesinski was president/CEO of FlexTech Alliance, an industry consortium focused on new methods of creating electronics. From 1995-2008, Ciesinski served in a similar role at the U.S. Display Consortium (USDC), a private/public partnership chartered with building the infrastructure for electronic display and flexible electronics manufacturing. Both FlexTech and USDC annually sponsor multimillion dollar technology development programs and provide industry technical, financial and market services. Ciesinski is a graduate of the University of Albany, NY, and a former member of the Dean’s Advisory Committee at California Polytechnic State University.Maria Vetrano is a PR consultant at SEMI.
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Since 2015, FlexTech has funded three projects with ITN Energy Systems, based in Littleton, Colorado. The projects all draw on a unique concept of using thin, flexible ceramic sheets as both a substrate for functional devices and as an integral part of the hermetic packaging to support paper-thin FHE products. Each program was increasingly sophisticated, enabling a larger variety of functions to be integrated into a common package. Independent functions such as energy storage, energy harvesting, or printed microelectronic circuits are deposited on their own ceramic substrate and the layers vertically stacked and interconnected into a monolithic structure that combines several functions in the smallest possible package volume.The ITN projects provide excellent examples of the power of collaborative research and development to help de-risk investments in next-generation electronics. All the projects were conducted with technical contributions from small and large businesses as well as university partners. The programs were funded by the U.S. Army Research Laboratories (ARL), directed by industry leaders and managed by SEMI FlexTech with the focus on utilizing the advantages of flexible hybrid and printed electronics (FHE) to create lighter-weight, lower-power, more conformable electronics than available commercially today. Markets ready to take advantage of FHE developments include healthcare, aerospace, mobility, consumer electronics, industrial electronics.ITN was founded in 1995 to focus on researching and developing technologies related to aerospace, energy and the environment for defense and commercial marketplaces. Its business model employs collaborative R D projects to explore, develop and validate promising next-generation clean energy technologies with an emphasis on tackling the manufacturing challenges that enable low-cost, high-volume production of thin-film devices on flexible substrates. Those technologies that meet the technical and business requirements of the market are commercialized via focused, spin-out companies with five such spin-outs formed so far. The work on ultra-thin batteries needed by the SEMI FlexTech community readily slid into their portfolio of projects.Project 1 – New Solid-State Lithium BatteryThe first project kicked off in 2016, with ENrG, and successfully supported the development and validation of novel Solid-State Lithium Battery (SSLB) products with total packaged thickness ranging from 50-250 microns. The SSLB proved to have substantial advantages in form factor and performance when compared with both commercial-off-the-shelf batteries and emerging technologies. For example, the SSLB provided more than double the operating time in a substantially smaller package in powering an audio device supplied by SEMI FlexTech partner companies.By avoiding the use of liquid electrolytes, the ITN SSLB also eliminates flammability issues while still allowing the benefits of lithium-based battery chemistry. The SSLB boasted many attributes attractive to the FlexTech community, including: Ultra-thin form factor, i.e. 250 microns thick, mAh class packaged batteries High volumetric energy density, i.e. baseline products with ~500 Wh/l and a roadmap to 1,000Wh/l The ability to support high current pulsing, i.e. current pulses at 4-10C rates, in support of demanding FHE duty cycles High temperature compatibility with solder reflow and other FHE integration schemes Rechargeability with high capacity retention at 1,000 cycles This new SSLB has formed the foundation of subsequent projects and commercialization efforts.Project 2 – Adding Energy Harvesting Based Recharging Capability The second SEMI FlexTech-funded project proposed a novel self-recharging battery with the addition of Lucintech’s cadmium telluride (CdTe) photovoltaics (PV), which was also deposited on thin yttria stabilized zirconia (YSZ) substrates. Because the CdTe supports a superstrate configuration, the SSLB can function as the back sheet for the PV package, thereby dramatically decreasing overall package thickness. The resulting flexible integrated power pack provided up to 0.25 Wh of energy storage and ~0.2 W of PV generating capacity in a total package less than 250 microns.As part of that effort, the ITN Team identified an effective power-management circuit that was ultimately compatible with die thinning and form factors very attractive to FHE. Consequently, the PV and SSLB were interconnected into a common power bus that enabled FHE to be operated with either the PV, SSLB or some combination of the two.ITN is seeing great interest in this product and both developing a version with substantially higher capacities than the project entertained for a UAV platform while ramping to low volume with support from NextFlex, a member of the Manufacturing USA network, and formed in 2015 through a cooperative agreement between the U.S. Department of Defense (DoD) and FlexTech Alliance.Monolithic integration of function layers atop of SSLB for high performance microelectronics device Project 3 – Integration with Processing and Sensor SystemsThe third FlexTech-funded project builds further on that foundation. In this project, the ITN Team is maturing the technologies to create a battery with an integrated processing and sensor system, nicknamed BiPASS. In addition to SSLB layers, the BiPASS package integrates printed circuits on YSZ employing high-performance, silicon- based bare die micro-electronics and/or thin film sensors into the common packaging. Mock-up of the charge control circuit on SSLB The initial demonstration integrates a commercial lithium battery charge control circuit within the SSLB packaging to create a monolithically integrated power module. There have also been promising developments of the University of Rhode Island’s metal oxide (MOx)-based thin film gas sensors that have dramatically increased sensitivity when deposited on thin YSZ. The resultant sensor achieves ppb detection of trace explosives gases that can be powered by SSLB. Along the way, ITN’s partners Molex and SunRay Scientific matured several aspects of FHE circuit printing and integration on both PET and YSZ, including new materials and processes for conductive traces, and bare die attachment with fine features. The project is in its final stages and the ITN Team now has a promising roadmap to integrate power, microelectronics, and thin film sensors/sensor systems into a single paper-thin package.Commercial Scale-Up StrategySince the initial demonstrations were completed, ITN has been actively maturing a commercial scale-up strategy based on significant market-pull and interest from several companies. A new venture to commercialize this next generation SSLB is in process. As part of those discussions, ITN is in active discussions with potential strategic partners to support the transition to high-volume production to access additional markets, many of which are cost-sensitive and need a higher degree of production maturity.In the meantime, ITN’s limited volume SSLB production line is already supporting medical device customers. In addition, a baseline SSLB (~2.5 mAh capacity) has been developed and tested in several new applications, including wearables, sensors and smart labels.“Based on the acceptance of these project in the market, I believe all three projects have provided significant value to the SEMI FlexTech community,” noted Brian Berland, Chief Technology Officer at ITN. “In addition, the connections and visibility we have gained within the industry by partnering with SEMI FlexTech have been invaluable. We are excited to continue this journey with new and additional projects. In the meantime, we are hopeful that our ongoing discussions with investment partners will support our commercializing of these components.”For more information visit www.flextech.org. SEMI FlexTech is currently (from 6/10/2020 – 7/17/2020) accepting white papers for new technology development projects. Read more at www.flextech.org.About the AuthorDr. Gity Samadi is the SEMI FlexTech Program Manager. Gity is responsible for the flexible hybrid electronics R D consortium activities including project awards and management, Technical Advisory Council management, and webinar/industry event planning for the building and fostering of this dynamic innovative community.
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