call for abstracts

Solving challenges in semiconductor manufacturing requires an ongoing collaborative effort by customers, device makers, equipment and materials suppliers, and academia. ASMC 2021 will continue efforts to help the industry overcome these hurdles. To that end, we are now soliciting abstracts from industry experts across all areas of semiconductor manufacturing for presentations at the event, May 3-6, 2021 at the Saratoga Hilton/Saratoga Springs City Center in Saratoga Springs, New York.The conference provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies. ASMC 2021 will be co-chaired by Ishtiaq Ahsan, Ph.D. of IBM Research and Alexa Greer of KLA.We’re looking for presentations in topic areas including the following: Advanced Metrology Advanced Equipment Processes and Materials Contamination Free Manufacturing Big Data Management and Mining Defect Inspection and Reduction Equipment Optimization Factory Automation Industrial Engineering Smart Manufacturing Yield Methodologies Click here to submit an abstract for a technical presentation. Provide an extended abstract of no more than two pages (max. of 1000 words, MS Word or PDF) with supporting data, charts, figures embedded in the last page. See author kit for details. Summarize the topic and theme in as much detail as allowed by the word count limitation. Include title, author(s), company affiliation(s), contact information, topic and five key words describing the work. The final technical manuscript must show a complete set of data to support initial abstract. Here are key deadlines and dates for industry experts to keep in mind: Abstracts Due: October 30, 2020 Author Notification: December 15, 2020 Manuscripts Due: February 9, 2021 Final Manuscripts Due: April 6, 2021 Presentations Due: April 20, 2021 Conference Dates: May 3-6, 2021 ASMC 2021 could be held as a virtual event depending on progress in containing COVID-19. Whether the event is on-site or virtual, all abstracts accepted for presentation will be published by IEEE. Speakers should be prepared to present live or online.Speakers also may be invited to publish their papers in a special section of ASMC 2021, which will be featured in IEEE Transactions on Semiconductor Manufacturing. All technical presentations will be considered for the ASMC Best Paper Award sponsored by Entegris. Students presenting an oral paper or poster will be considered for the ASMC Best Student Paper Award sponsored by GLOBALFOUNDRIES.For a complete overview of topics and other information, please visit the ASMC 2021 Call for Papers web page.Margaret Kindling is senior manager of Programs for SEMI Americas.

Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to come? If so, we want to hear from you.You’re invited to deliver a technical presentation at virtual FLEX 2021, February 22-26, 2021. The call for abstracts is now open! Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R D labs, and government agencies from around the world have participated in FLEX conferences.Technical presentations should focus on the conference theme, 20 Years of Driving Innovation to Make the World Safer, covering flexible hybrid or printed electronics products, equipment, processes, materials, and the applications they enable. FLEX 2021 also takes aim at the future of the planet, so presentations on global sustainability in areas such as impacts, strategies, tactics, successes and progress area also a great fit. To submit your abstract, please complete the online form: Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products. Preference is given to original research and advancements in process and materials as they relate to end users. We also invite students from research universities to submit posters describing their work and results for the popular FLEX Poster Competition. As in the past, a panel of industry and academic experts will evaluate the posters and recognize the top three students and their work. Here are key deadlines and dates for industry experts and students to keep in mind: September 30, 2020 – Submit your abstract. October 31, 2020 – We’ll notify you whether your presentation has been accepted by this date. November 15, 2020 – Sign a Speaker Agreement and provide a bio and headshot. February 1, 2021 – Send us an electronic copy of your presentation. We’re looking for presentations in these topic areas: Flexible Hybrid Electronics Systems Materials Processing Sustainability and Power MEMS and Sensors Applications Presentations should include the following: Why the technology presented matters and to whom Practical recommendations for addressing commercialization issues or applications. This includes providing innovative technological or market solutions driven by a use case, the integration challenges you faced, and the system-level architecture decisions you made. Descriptions of how you overcame each challenge Ideas for what as an industry we should be working on and what are you working on to demonstrate sustainability For a full rundown on topics and other information, please visit the FLEX 2021 Call for Papers web page.Michelle Fabiano is a program and event manager for SEMI Americas.