UK

The global semiconductor industry is entering a new phase of growth to keep pace with the increasing demand for artificial intelligence (AI), high-performance computing (HPC), and system-level integration. At the same time, rapid technological advancement is intensifying the need for highly skilled talent. Industry projections indicate that by 2030, the global semiconductor sector will face a shortage of more than one million professionals, making talent a critical variable shaping competitiveness and supply chain resilience.In this context, governments and industry organizations worldwide are accelerating efforts to develop talent pipelines and strengthen cross-border collaboration. For a highly globalized industry like semiconductors, the movement of talent and exchange of knowledge are no longer confined to individual markets, but are essential to the development of a resilient and interconnected global ecosystem. Increasingly, competition is extending beyond technological breakthroughs to the ability to build and sustain a global talent pipeline.Supported by a cross-border collaboration framework, SEMI and the UK Electronics Skills Foundation (UKESF) have jointly organized a program to cultivate the next generation of semiconductor talent. Through structured exchange mechanisms and close collaboration with industry, academia and public sector partners, the program connects global talent with real-world industry environments and contributes to building a more sustainable foundation for long-term workforce development.From Lab to Fab: Understanding the Path from Research to ManufacturingA core objective of the project is to bridge the gap between academic research and industrial application. Through a 14-day immersive experience combining industry engagement and hybrid learning formats, participants engage directly with experts and gain a system-level understanding of how the semiconductor industry operates—from research and development to high-volume manufacturing.The program covers key segments of the semiconductor value chain, including advanced research, wafer fabrication, IC design, packaging and testing, and system applications. This integrated learning experience enables participants to move beyond isolated technical knowledge and develop a broader understanding of how innovation is translated into scalable industrial capabilities.As one participant shared: “Experiencing the award-winning R D solutions at ITRI and the massive scale of wafer manufacturing at UMC firsthand was unforgettable. It was incredibly inspiring to see how advanced research is translated into global manufacturing capabilities—from lab to fab.”Participant feedback highlights a clear shift in understanding. Through hands-on learning and industry engagement, participants moved beyond isolated technical knowledge to develop a more comprehensive, system-level perspective of the semiconductor industry—supporting more effective collaboration across the global ecosystem.A Practice-Oriented Approach: Redefining Semiconductor Talent DevelopmentAs technology evolves and industry demands shift, traditional discipline-based education models are no longer sufficient to fully meet the needs of semiconductor manufacturing and R D environments. Increasingly, the industry is seeking talent with cross-disciplinary capabilities and hands-on experience.The project adopts a “learning by doing” approach, combining laboratory sessions, expert-led workshops, and company visits to provide participants with practical exposure to semiconductor devices, materials, process technologies, and system design. Participants also gain exposure to real-world applications such as chip security, design verification, and advanced process technologies.From an industry perspective, this approach aligns more closely with evolving workforce needs. Compared with conventional academic training, individuals with cross-disciplinary experience and international exposure are better equipped to understand the interplay between R D and manufacturing, and to integrate more effectively into real-world operational environments.UK participants, dressed in cleanroom suits, gained firsthand exposure to Taiwan’s semiconductor manufacturing environment—observing wafer fabrication equipment up close and engaging in hands-on learning to experience the journey from lab to fab.From Talent Development to Ecosystem ConnectivityAt a time when the semiconductor industry is entering its next phase of growth, talent plays a central role not only in driving innovation, but also in enabling global collaboration. As supply chains become increasingly interconnected, building mechanisms for cross-border talent mobility and cooperation is critical to strengthening both resilience and innovation capacity.At the program’s closing event, “UK–Taiwan Semiconductor Industry and Talent Exchange,” Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, noted:“By 2030, the semiconductor industry is expected to require more than one million additional skilled professionals. Through international collaboration and industry–academia engagement, SEMI aims to enable more global talent to engage with Taiwan, gain a deeper understanding of its semiconductor ecosystem, and build long-term connections with the industry.”The project reflects a broader objective: not only to develop talent, but to build a sustainable, globally connected workforce network. By fostering a shared understanding and collaboration across borders, such initiatives help align capabilities and drive innovation across the global semiconductor ecosystem.Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI, emphasized the importance of nurturing globally connected semiconductor talent to help drive the industry’s future growth.Advancing Global Collaboration to Meet Long-Term Industry NeedsAs the industry continues to evolve, no single organization or region can address workforce challenges alone. Cross-border collaboration and structured talent development frameworks will be essential infrastructure for the future of the semiconductor industry.Looking ahead, SEMI will continue to expand international partnerships, connecting global industry, academia, and government stakeholders to deepen and scale talent development efforts—supporting the next generation of semiconductor professionals with both global perspective and practical expertise.For more information or partnership opportunities, please contact:Ily TsaiTel: +886-3-560-1777 [email protected] Ily Tsai is Project Manager, Workforce Development at SEMI Taiwan.

We are now in the recovery phase of the current business cycle with SEMI equipment already in a growth mode. However significant economic and geopolitical concerns persist.

Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.SEMI stands strong for free trade and open markets, and roundly supports efforts to increase market access and tap into more foreign economies, especially economies like Japan and the EU, both of which are central to the semiconductor industry. The semiconductor industry, which enables the $2 trillion electronics market, is built on global commerce. SEMI members rely on a vast network of supply chains that span the globe, bringing together components and tools made all around the world and assembled into a single sub-system that is then integrated into a larger tool used in the chipmaking process.These free trade agreements will reduce tariffs, which will result in cost savings and productivity gains, and allow SEMI members to expand and grow. But the benefits of modern free trade agreements extend well beyond tariff reduction. Indeed, these trade deals will establish and enhance global trade rules that enable companies to innovate and compete fairly on a level playing field. Trade agreements strengthen certainty and further business continuity.While the exact nature and negotiation timelines for the talks remain unclear, SEMI will engage the administration, urging it to maintain high standards in these agreements, such as: Maintain strong respect for intellectual property and trade secrets through robust safeguards and significant penalties for violators Remove tariffs and non-tariff barriers on semiconductor products as well as products that depend on semiconductors Simplify and harmonize the customs and trade facilitation processes Combat any attempts of forced technology transfer Prevent use of data localization measures and enable the free flow of cross-border data flows End discriminatory and/or burdensome regulatory practices Ensure standards in all forms are market-oriented Create rules for state-owned enterprises to ensure fair and non-discriminatory treatment of all companies According to Trade Promotion Authority (TPA), the U.S. law that guides trade votes in Congress, negotiations with each country can only begin 90 days after last week’s notification. During that period, there will be intensive consultation with Congress and stakeholders. This means, at the earliest, talks can start on January 14, 2019. (Bear in mind that discussions with the UK can only begin in earnest once the UK has formally left the European Union on March 29, 2019.)The Trump administration’s announcement comes after the U.S. imposed or threatened tariffs on imports on all trading partners, including the EU and China. All told, the U.S. has imposed tariffs on more than $300 billion worth of goods. SEMI has weighed in on the detrimental nature of tariffs, arguing that tariffs on China will ultimately do nothing to address the concerns with China’s trade practices. This sledgehammer approach will introduce significant uncertainty, impose greater costs, and potentially lead to a trade war, ultimately undercutting the ability of semiconductor companies to sell overseas, stifling innovation and curbing U.S. technological leadership.Elsewhere, the Comprehensive and Progressive Agreement for Trans-Pacific Partnership, the multilateral trade deal that links 11 Asia-Pacific economies, is well on its way to taking force. Canada will be taking its final steps to ratify the deal, joining Mexico, Japan and Singapore. The deal, formerly known as the Trans-Pacific Partnership, should take effect by the first half of 2019.SEMI will continue tracking ongoing trade developments. Any SEMI members with questions should contact Jay Chittooran, Public Policy Manager at SEMI, at [email protected].