SEMICON Europa

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2026 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Pascal Fasel, Project Manager Engineering at Comet X-rayPascal Fasel’s career in semiconductors has developed steadily through hands-on experience and continuous learning. Starting with an apprenticeship in 2012, he built his foundation across design, process, and project roles, gaining a practical understanding of how technologies move from concept to production.Over time, he discovered a strong interest in solving real-world problems and delivering reliable engineering solutions. Today, as Project Manager Engineering at Comet X-ray, Fasel focuses on guiding projects through complexity while balancing speed, precision, and quality in a fast-evolving industry. SEMI: What inspired you to join the semiconductor industry? Fasel: I did not have a single defining moment. I joined through an apprenticeship in 2012 and discovered semiconductors gradually. As my responsibilities grew, I realized that I enjoy solving problems and turning ideas into reliable solutions. Over the past three years, I have mainly worked on semiconductor projects, which confirmed this interest. I am motivated by the fast pace, the need for precision and quality, and the impact of bringing new technology into production. It is this combination that keeps me engaged.SEMI: How did your early experiences and education shape your career path?Fasel: My apprenticeship taught me hands-on skills and the importance of quality and safety. Working across design, process, and project roles helped me understand how systems fit together and where problems arise. I am currently studying industrial engineering part-time while working. My studies and work reinforce each other, with theory supporting practice and projects testing what I learn. These experiences keep me focused on preparing technology for production.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Fasel: The accomplishment that matters most to me is my steady growth at Comet. Since joining in 2012, I have worked across design, process, and project roles. Staying for over a decade has been less about titles and more about trust, learning, and supporting colleagues when challenges arise. This is important to me because it reflects consistency and shared responsibility. It has allowed me to contribute to projects from idea to production in a reliable way.SEMI: As a young professional in the industry, what is your greatest challenge? Fasel: My greatest challenge is balancing speed with quality in a changing environment while ensuring smooth handovers to production. Specifications can change, results can be unexpected, and timelines can shift. To manage this, I focus on learning quickly without cutting corners. I make changes small and reversible, identify risks early, and seek feedback regularly. The goal is to learn efficiently and reduce surprises. SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Fasel: Stay curious and build a habit of learning every day. You will not master everything at once. Projects move quickly, so remain flexible and start with small steps. Gain experience early through internships or student projects. Apply what you learn in practice. Ask clear questions, listen carefully, and stay open to different perspectives. Share credit when things go well and take responsibility when they do not. Be patient. Steady progress is more effective than big jumps. Focus on quality and safety, even under pressure, and build trust through consistency.SEMI: How do you envision future work environments?Fasel: I believe workplaces will become more flexible and people-focused. Clear goals, open communication, and early feedback will be essential. Collaboration will be hybrid, with time in the office used when it adds value. Teams will focus more on outcomes rather than hours, working in small, manageable steps to reduce risk and stay aligned.SEMI: What impact has the 20 Under 30 Award had on your career? Fasel: I am grateful for the recognition. It has not changed my daily work, but it has created opportunities to connect with others, learn from peers, and share experiences. It also provides a platform to encourage students and early-career professionals to explore this industry. For me, it is a reminder to stay consistent and continue supporting others.Following 20 Under 30 JourneysPascal Fasel’s story reflects the value of persistence, practical experience, and continuous improvement. His work highlights how steady progress and collaboration contribute to delivering reliable semiconductor solutions.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. If this is of interest and you would like to explore further workforce related topics, we invite you to learn more about ChipQuest. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2026 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet David Coenen, Senior Researcher at imecFrom an early curiosity about how things work to leading advanced research in photonics and thermal management, David Coenen has built his career around understanding and improving complex technologies. His interest in engineering first led him to study aerospace engineering, where he was introduced to nanotechnology and semiconductor systems. What initially seemed abstract gradually became an area he wanted to explore in depth.This growing interest led him to pursue a PhD, where he developed a strong foundation in semiconductor research. Today, Coenen contributes to advancing technologies that support high-performance computing, data centers, and AI applications, working at the intersection of multiple disciplines to address some of the industry’s most demanding challenges. SEMI: What inspired you to join the semiconductor industry? Coenen: I’ve been fascinated by technology for a long time. Ever since I was little, I’ve been eager to learn how things work, from machines to cars and airplanes. This motivated me to study aerospace engineering. During my studies, nanotechnology and semiconductors kept appearing. At first, it felt almost like magic that a piece of silicon could run complex programs. Over time, I developed a deeper understanding and wanted to explore research further. In Belgium, imec is a well-known R D institute, and I decided to pursue a PhD there to give my career a strong foundation. I also believe the semiconductor industry will have a major impact on the future of society, and I want to contribute to that.SEMI: How did your early experiences and education shape your career path?Coenen: When I was around nine or ten years old, I visited imec during a school trip and learned about computer chips. That experience stayed with me. Later, during my engineering studies, I was mentored by teachers who were passionate about science and technology. Their guidance encouraged me to push my boundaries and try things outside of my comfort zone.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Coenen: I received the Best Paper Award for a conference paper submitted to iTherm and was later awarded the Harvey Rosten Award for Excellence for the same work. This is particularly meaningful to me because the initial draft received very negative feedback. I was told it was not innovative enough and advised not to submit it to my preferred conference. From this experience, I learned an important lesson: know your worth and do not assume someone is right simply because they have more experience.SEMI: As a young professional in the industry, what is your greatest challenge? Coenen: I work in photonics and chip thermal management, which is a rapidly evolving field. Keeping up with the latest technologies and developments can be challenging. These chips are used in data centers and large AI and machine learning systems, which are in high demand. Another challenge is finding master’s or Ph.D. students to join my work. My research sits at the intersection of electronics, photonics, thermodynamics, and machine learning, which makes it highly specialized. SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Coenen: Rome was not built in one day. Developing skills and building a deep understanding of complex technologies takes time. Enjoy your studies and choose something you are passionate about. When you are passionate, learning becomes enjoyable. Think about how you want to impact the world and make it a better place. That gives you strong motivation to work hard. SEMI: How do you envision future work environments?Coenen: From my experience, having flexibility in how I plan my day and organize my work helps reduce stress. Not having a rigid schedule allows me to take breaks and reset my mind. Combined with hybrid working, this makes work more enjoyable and sustainable.SEMI: What impact has the 20 Under 30 Award had on your career? Coenen: I was very honored to receive this award. There are many researchers equally deserving, which makes it even more meaningful. The award allowed me to connect with people inside and outside my organization whom I would not normally interact with. It also increased my visibility and associated my name with excellence.Following 20 Under 30 JourneysDavid Coenen’s story highlights the curiosity, resilience, and commitment to excellence that define the next generation of semiconductor researchers. His work contributes to advancing technologies that support the growing demands of data processing and AI systems.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. If this is of interest and you would like to explore further workforce related topics, we invite you to learn more about ChipQuest. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

2025 was a fast-paced, exciting, and impactful year for the SEMI Standards team. We developed 14 new standards on crucial topics like supply chain traceability, defect mitigation, compound semiconductor materials, and so many more. In addition, we introduced the SEMI Global Standards Summit (GSS) in North America, where we created new standardization roadmaps and continued pertinent sustainability conversations from the inaugural GSS at SEMICON Japan 2024. We’re also excited to announce that we closed out 2025 with an impactful Q4. From December 17-19, we held our SEMI International Standards Meetings during SEMICON Japan. More than 15 Task Force meetings and 5 Technical Committee meetings were held, followed by an award ceremony. The brand-new Digital Twins in Manufacturing Task Force was also established to define and standardize a digital twin framework that supports consistent and scalable implementations. We published the new SEMI T27 standard in Q4, and we celebrated several outstanding volunteers for their contributions to the SEMI Standards Program at both SEMICON West and SEMICON Europa. As we reflect on Q4, it’s apparent how important collaboration is to the success of SEMI Standards. By working together, we lay the foundation for groundbreaking innovations in microelectronics manufacturing. The SEMI Standards team would like to extend a warm and sincere thank you to everyone who donated their time and expertise to define the future of our industry. These efforts would not be possible without your commitment and support.Still, it’s never too late to join the SEMI Standards Program. Learn more about membership and how you can help influence the next phase of semiconductor manufacturing. Q4 2025 HighlightsTakeaways from the International Standards Meeting at SEMICON JapanIn Q4, the SEMI Standards team held its International Standards Meeting at SEMICON Japan, where several task forces convened to set standards for compound semiconductor materials, information and control, traceability, and more. From December 17-19 at Tokyo Big Sight, the SEMI Standards team supported these technical committees in advancing several key standards revisions, including SEMI E181, Specification for Panel FOUP for Panel Level Packaging, and SEMI E182, Specification for Panel FOUP Loadport for Panel Level Packaging. In addition, a new Maintenance Robot Communication (MRC) Task Force was established with the objective of defining communication protocols and data exchange specifications between maintenance robots and equipment.The next SEMI International Standards Meeting will take place from May 11-14 in Albany, New York, during the SEMI Advanced Semiconductor Manufacturing Conference (ASMC). Digital Twins in Manufacturing Task Force Although the terms “digital twins” and “digital twin frameworks” are becoming more prevalent in the semiconductor industry, there’s still much debate on what they cover. To develop concrete, standardized definitions for each, the SEMI Standards team established the Digital Twins in Manufacturing Task Force in Q4. After the task force defines these crucial terms, it will then create definitions for internal digital twin components outlining baseline capabilities, discovery mechanisms, prediction quality metrics, unified model interfaces, and lifecycle management. Eventually, the task force will outline a framework for Digital Twins compatible with existing guidelines like SEMI Standard E133 or ISO 23247. The SEMI Digital Twins in Manufacturing Task Force is open to industry stakeholders. To participate, join the SEMI International Standards Program or learn more. Standards Awards at SEMICON West and SEMICON Europa SEMICON West honoreesQ4 was also a time to celebrate some of the talented individuals who make a difference in the SEMI Standards Program. At SEMICON West and SEMICON Europa, we honored 25 accomplished industry leaders across the following five award categories for their commitment and participation. Merit Award winners led projects to successful completion at the task force level. SEMICON Europa honorees: Judith Wittmann, Cristina Sanna, Peter Wagner, Friedrich Passek, Frank Riedel SEMICON West honorees: Dave Dunne of Applied Materials, Kirsten Smith of UCT/ChemTrace, Tommaso Orzali of ASML, Dr. Tyler Harrison of Teledyne MEMS, and Dr. Mary Ann Maher of SoftMEMSSEMICON Europa honorees: Christian Kranert of Fraunhofer IISB, Enrica Cela of Soitec, Hans-Christian Alt of the Munich University of Applied Sciences, and Ulrich Kretzer of Freiberger Compound Materials GmbHLeadership Award winners bolstered the SEMI Standards program through member recruitment, mentoring, and training efforts. SEMICON West honorees: Michael Potts of Arcadis, David Kandiyeli of KINETICS Equipment Solutions Group, and Per Nelson of Daikin AmericaSEMICON Europa honorees: Frank Riedel and Judith Wittmann of Siltronic, Cristina Sanna of GlobalWafers, and Jochen Ruth of Pall CorporationHonor Award winners have demonstrated long-term dedication to advancing SEMI Standards.SEMICON West honorees: Steve Martell of Nordson Test Inspection Americas, Lucian Girlea of Nikon Precision, and Dave Huntley of PDF SolutionsSEMICON Europa honorees: Peter Wagner of SEMI Standards, Fritz Passek of Siltronic, Arnd Weber of SiCrystal GmbH, and Frank Petzold of trustsec IT solutions GmbHCorporate Device Member Award winners are participants from the user community who act as corporate representatives for the SEMI Standards Program from the device manufacturer side. Stefan Radloff of Intel was honored with this award at SEMICON West. Technical Editor Appreciation Award winners are adept at translating complex technical information into clear and precise language. Dr. Alissa M. Fitzgerald of A.M. Fitzgerald Associates became the award recipient in 2025. Workshops at SEMICON WestOn October 8, the SEMI Voltage Sag Immunity Task Force hosted its Enhancing Voltage Sag Immunity workshop to address fab downtime caused by voltage sags. The workshop convened more than 20 industry professionals to review the limitations of SEMI Standard F47. They found that while 20% of downtime instances can be attributed to three-phase events, SEMI Standard F47 does not require testing for such occurrences. As a result, the Voltage Sag Immunity Task Force is developing a draft revision of SEMI Standard F47, scheduled for balloting in March 2026. If you missed this workshop, you can access the recording and presentation here. October 8 also saw the exciting return of the Analytical Workshop, hosted by the SEMI Liquid Chemicals Committee after a multi-year hiatus. This year’s workshop addressed near-term challenges and advancements identified by the International Roadmap for Devices and Systems (IRDS). It covered chemical quality and consistency, trace metallic impurities and improvements in ICPMS instrumentation, automated instrumentation for online measurements, detection for particle precursors and sub-10nm particles in liquids and on-wafer, and organic particle precursors identification using FTIR-ATR, SERS and AFM-IR. If you missed this workshop, you can access the recording and presentation here. The 2026 call for abstracts will be announced soon. Lastly, the SEMI Standards and SEMI University teams worked together to host Semiconductor Device Manufacturing in a Cleanroom, a workshop meant to introduce best practices for overcoming contamination problems in the cleanroom. By reviewing different sources of contamination, reviewing analytical techniques for quality control, and performing cleanliness testing, the course aims to help cleanroom facilities improve production reliability and yield.New and Revised Standards Released in Q4October 2025November 2025December 2025Get InvolvedSEMI Standards development activities take place throughout the year in all major manufacturing regions. To participate, join the SEMI International Standards Program.SEMI Standards are available through individual download purchases or online via SEMIViews. Watch this video to learn more about how SEMIViews offers a cost-effective and streamlined way to access 1,110+ SEMI Standards. Sign up for a 30-day SEMIViews trial.For more information, please visit the Standards website and events page. For any questions regarding SEMI Standards activities, please contact your local SEMI Standards staff.Paul Trio is Director of Standards at SEMI.

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, even as the Moore’s Law roadmap for wafer-level scaling comes under strain.At the Advanced Packaging Conference during SEMICON Europa 2025 in Munich, global experts examined the growth trajectory of this critical sector and Europe’s potential to lead in next-generation packaging solutions.Market Momentum Fueled by AI and HPCRomain Fraux, Chief Research Officer at Yole Group, forecasted that global revenues for advanced packaging will grow from $46.1 billion in 2024 to $79.4 billion by 2030. “Everything is linked to AI and high-performance computing (HPC),” said Fraux, while also emphasizing the growing relevance of automotive applications in driving demand.Romain Fraux, Chief Research Officer, Yole GroupThis demand is accelerating innovation across the supply chain. One emerging area is panel-level packaging, which breaks away from traditional round wafers. As Andreas Wocko, Sales Manager at Lam Research, observed, “Since the 1970s, the semiconductor industry has built on wafers. Now we are not just scaling, we are reshaping, building in a square format for the first time” – an innovation which substantially increases area efficiency and reduces device cost. Andreas Wocko, Sales Manager Europe, Lam ResearchTechnology Transformation from Lab to FabEurope is already investing in the foundational technologies that will power tomorrow’s packaging systems. Rolf Aschenbrenner, Deputy Director of Fraunhofer IZM, the home of the European Union’s APECS advanced packaging pilot line, discussed ongoing research into functional interposers, routing density, and organic interposers. “Our goal is to show how a new design philosophy incorporating chiplets can be brought to the industrial systems level,” said Aschenbrenner.Rolf Aschenbrenner, Director Deputy, Fraunhofer IZMThese breakthroughs are essential, as pitch sizes shrink and new materials emerge. Dr. Jessica Stubbe, Global Application Manager at MKS Atotech, described how interconnect densities have doubled in the past two years, with the industry moving to pitch sizes of less than 10µm. Stubbe said this new technology “will be enabled by a move from traditional solder-based interconnects to copper-to-copper hybrid bonding to provide higher density I/Os and lower resistance.” Jessica Stubbe, Global Application Manager, MKS AtotechInnovation Meets Real-World IntegrationThis increased density carries thermal risks with it. As Ram Trichur, Global Head of Semiconductor Packaging at Henkel Corporation, said, “New architectures enabled by advanced packaging are putting power devices on the backside, interposer or substrate, and this addition of more power delivery components in the package creates more local hotspots.”The reduced feature sizes inside the latest packages make it more difficult than ever to apply thermal interface materials. “At Henkel, we are now making 1µm-level fillers which enable the effective filling of gaps as small as 7µm,” said Trichur.Ram Trichur, Global Head of Semiconductor Packaging Market Segment, Henkel CorporationOne of the applications which stands to gain the most from the development of advanced packaging technology is silicon photonics. Dr. Himani Kamineni, Director for Advanced Packaging at GlobalFoundries, described how co-packaged optics (CPO) brings photonics directly inside the package, reducing connection lengths from centimeters down to millimeters, and providing higher bandwidth and lower latency at lower power. “Advanced packaging and CPO are foundational elements for AI and data centers to enable scalability to the next generation of compute,” said Kamineni. “But it will need a lot of packaging innovation: silicon interposers, copper-to-copper interconnects, and fiber-attach units for precise alignment.” Himani Kamineni, Director, Advanced Packaging, GlobalFoundriesReliability and Test Under PressureIn the transition to new packaging technology, it is crucial that the industry does not lose sight of the reliability standards which have made semiconductors so valuable in sectors such as automotive and aerospace. Amar Mavinkurve, Director of Materials and Labs Package Innovation at NXP Semiconductors, warned the finer spacing and smaller feature sizes in the latest packages posed a problem for reliability and long-term performance. He said, “We are dealing now not just with one failure mechanism, but with multiple. So, the way that we are used to describing behavior in models will not necessarily hold in future. Even industry standards might not hold.”Discussing new technologies such as copper-to-copper interconnects, Mavinkurve pointed out that failure would not be due to a single event, but to processes such as electromigration, corrosion, and thermomechanical effects. To model reliability properly in future, he said, “we need to move from a physics of failure to a physics of degradation.” Amar Mavinkurve, Director Materials and Labs Package Innovation, CTO, NXP SemiconductorsFabio Pizza, Business Segment Manager at Advantest Europe focused on quality and failure. With geometry scaling toward 1nm, early identification of known-good dies is essential to optimize cost and test coverage. Pizza said that, while device manufacturers need to keep time-to-market and the cost of test under tight control, they are also trying to figure out how to increase test coverage. “In a modern GPU, even a 100 DPPM quality process leaves 20 million transistors untested,” he said. Fabio Pizza, Business Segment Manager, Advantest EuropeEurope’s Position in the Global EcosystemThe conference concluded with a panel discussion about the prospects for Europe in the global advanced packaging market. According to Yole’s Romain Fraux, there is a strong ecosystem in Europe: “Europe’s strengths include specialized packaging service providers in the photonics and power market segments, as well as many packaging equipment manufacturers,” said Fraux. This resonated with the instincts of NXP’s Amar Mavinkurve and Advantest’s Fabio Pizza. Mavinkurve said: “We should focus on what we are already good at doing. It will be challenging to compete with advanced packaging providers elsewhere for AI and HPC business.”Ram Trichur of Henkel, however, urged the industry in Europe, “Do not take your foot off the gas on advanced packaging. You cannot do the full stack here, but in a technology such as CPO, there is a lot of innovation in Europe, and there is scope to add the manufacturing of these devices on top of the research capabilities.”Chris Scanlan, Senior Vice President of Technology at Besi, raised the idea of shifting production toward Eastern Europe. But Trichur cautioned that talent and infrastructure remain limiting factors in that strategy. From left to right: Chris Scanlan, Senior Vice President Technology, Besi;Amar Mavinkurve, Director Materials and Labs Package Innovation, CTO, NXP Semiconductors; Fabio Pizza, Business Segment Manager, Advantest Europe; Rolf Aschenbrenner, Director Deputy, Fraunhofer IZM; Ram Trichur, Global Head of Semiconductor Packaging Market Segment, Henkel CorporationCollaboration is the Path ForwardSpeakers throughout the conference echoed a common message: advanced packaging is reshaping the semiconductor landscape, and global collaboration will be essential to success. “It is impossible for one country or one region to do the entire stack,” Trichur concluded. “Innovation must be matched with strategic partnerships to bring advanced packaging from research to real-world impact.”On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this conference a resounding success. SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

The CxO Summit at SEMICON Europa 2025 spotlighted Europe’s ongoing efforts to build a resilient and globally competitive semiconductor industry, while calling for greater ambition, speed, and unity in execution. Following global disruptions with the automotive supply chain crisis, the European Union launched a continent-wide strategy through the EU Chips Act. While the Act has already spurred significant developments, including construction of the new ESMC fab in Dresden, Europe remains far from its goal of achieving a 20% share of global semiconductor production by 2030. The CxO Summit, part of the SEMICON Europa event in Munich, provided an opportunity for industry leaders to share ideas about how to catalyze the next phase of the European industry’s growth.Ajit Manocha, President and CEO of SEMI opened the summit by describing today’s industry landscape with one word: “unprecedented.” Manocha said, “The global growth of the industry is unprecedented, with 107 new fabs set to come online by 2028, but the uncertainties are unprecedented, from geopolitics to the talent shortage to environmental concerns. So we need unprecedented solutions.” Ajit Manocha, President and CEO, SEMILaith Altimime, President of SEMI Europe echoed the mood of uncertainty, describing Europe as caught “in a perfect storm.” Altimime said, “As we face a combination of internal challenges and intensifying external competition, collaboration is not optional — it is mission critical.” Laith Altimime, President, SEMI EuropePierre Chastenet, Head of the Unit for Microelectronics and Photonics, European Commission, highlighted the tangible progress made under the EU Chips Act. “We now have a proper toolbox to handle a future crisis in the supply chain. The Chips for Europe initiative has led to the creation of five pilot lines for advanced technologies such as FD-SOI and wide bandgap semiconductors.” Chastenet added, “Europe must now capitalize on its strengths, from materials and equipment to design tools and cutting-edge research emerging from our RTOs.”Pierre Chastanet, Head of the Unit for Microelectronics and Photonics, European CommissionEchoing the call for action, Oliver Schenk, Member of the European Parliament, urged stronger regional unity. “Europe must act together, act faster, and act with much bigger ambition,” Schenk said, reinforcing the need for cross-border commitment to strengthen the continent’s semiconductor position.Oliver Schenk, Member of the European Parliament, European ParliamentHighlighting Europe’s most critical technology gap, Luc Van den hove, President and CEO of imec, unveiled plans for a new advanced fab backed by €2.5 billion in investment from the EU, the Flemish government, and ASML. Van den hove urged Europe to commit wholeheartedly to advanced technologies: “We must be more ambitious, and focus on disruptive breakthroughs rather than incremental change if we want to ensure a prosperous future.”Luc Van den hove, President CEO, imecAt the CxO Summit, CEA-Leti and ASML signed a memorandum of understanding (MoU) to deepen their collaboration and accelerate innovation in mainstream semiconductor technologies. Building on promising results in hybrid bonding, the partnership will now target 'More-than-Moore' innovations, including heterogeneous integration and novel substrates like SiC and GaN. “We aim to combine ASML’s world-class lithography expertise with CEA-Leti’s system-level innovation,” said Sébastien Dauvé, CEO of CEA-Leti. The collaboration is set to strengthen Europe’s ecosystem by shortening the path from early research to industrial impact.Left: Anne Hidma, Senior Vice President EUR US, ASML; Right: Sébastien Dauvé, CEO, CEA-LetiTurning to Europe’s industrial base, Christian Senger, CEO of Volkswagen Autonomous Mobility, emphasized the need to shift from risk-aversion to opportunity. While the region’s automotive sector faces intense global competition, particularly from China, Senger highlighted that Europe has the potential to lead in new mobility markets. “The market for autonomous roboshuttles for people transport in large cities is forecast to be worth €400 billion in the US and Europe alone,” he said. With American firms like Waymo and Uber leading the robotaxi space, Senger stressed that Europe must “act swiftly to create an environment that supports an autonomous mobility industry here.”Christian Senger, Member of the Board for Fully Autonomous Mobility and Transport CEO of ADMT GmbH, VolkswagenEurope’s Potential to Create Advanced TechnologyOne of these RTOs, CEA-Leti, is responsible for the FAMES pilot line for FD-SOI technology. Sébastien Dauvé, CEO of CEA-Leti, agreed with Pierre Chastenet that the pilot lines show great promise. He said, “FD-SOI is a big trend in semiconductors, because it enables very low power consumption in embedded devices. We think that adoption of the technology will grow in the coming years, and that is good, because most of the technology is produced in Europe.”Sébastien Dauvé, CEO, CEA-LetiEurope is also widely recognized to be the leading global voice on sustainability – a huge issue of concern to the semiconductor industry. Henri Berthe, President of the Semiconductor and Battery Segment at Scheider Electric, told the summit that 500 million tonnes of CO2 emissions per year are attributable to the semiconductor industry – “more than the whole of Mexico emits!” he said. “We need to make fabs more efficient, and that is why Schneider Electric has launched a new playbook with Applied Materials for sustainable energy abundance for the industry.”Henri Berthe, President of the Semiconductor Segment, Schneider ElectricAnother aspect of Europe’s playbook is support for new fabs. The flagship is ESMC, the joint venture between TSMC, NXP Semiconductors, Bosch, and Infineon. Christian Koitzsch, president and managing director of ESMC, reported to the summit that the project to build in Dresden a 12nm FinFET foundry and a 28nm CMOS line, requiring a total investment of €10bn, is on schedule. “We are now developing local supply chains, hosting a series of ESMC Supplier Days which are open not only to German but generally to European suppliers,” said Koitzsch.Christian Koitzsch, President and Managing Director, European Semiconductor Manufacturing Company (ESMC)As Manfred Horstmann, General Manager and Senior Vice President of Global Foundries, pointed out, the building of the ESMC fab means that Dresden is established as the center of a cluster of semiconductor industry companies. “Global Foundries has its Fab 1 and a mask center in Dresden. In fact, one-third of the chips produced throughout the whole of Europe now comes from Dresden.”Manfred Horstmann, General Manager and Senior Vice President, GlobalFoundriesAn example of ambition was given by Terence Gan, Executive Director of the Institute of Microelectronics of Singapore. Gan told the summit how Singapore has used pilot lines to stimulate research and development in new technologies. He said: “We started research into advanced packaging as long ago as 2011. Most people thought we were mad! But today, there is strong demand for our advanced packaging capabilities because of the rise of AI and its need for high-performance computing.”Terence Gan, Executive Director, Institute of MicroelectronicsBreaking Barriers to ProgressDespite momentum, bureaucratic inefficiencies continue to hamper progress. Narjiss Haddaoui, Managing Director of European Economics called for faster decision-making: “In global competition, speed is a decisive factor. To act fast enough, the EU must change its ‘software’ - the processes by which it considers and makes decisions.” Narjiss Haddaoui, Managing Director, European economicsThe stifling character of European bureaucracy is reflected in the region’s approach to building fabs. Herbert Blaschitz, Executive Vice President of Advanced Technology Facilities at Exyte, compared fab construction timelines: 20 months in Taiwan, 34 in Europe, and 38 in the U.S., attributing delays in Europe to paperwork bottlenecks.Herbert Blaschitz, Executive VP of Advanced Technology Facilities, ExyteFabio Gualandris, President for Quality, Manufacturing and Technology at STMicroelectronics raised another concern — 100% of raw materials used in European fabs come from outside the region. Christophe Frey, Vice-President for EU Engagements at Arm France, added that geopolitical tensions are clouding the path forward: “We are a bit lost in the smoke from the big fire in the world’s semiconductor industry.” Fabio Gualandris, President Quality, Manufacturing Technology, STMicroelectronics Christophe Frey, Vice-President of EU Engagements, Arm FrancePlaybooks For Future SuccessSo amid the uncertainty and global tension, what lessons can the industry learn from successful regional examples? Tuomas Korpela, Business Development Senior Manager at Nokia, credited Finland’s strategic procurement and policy tools with enabling a vibrant semiconductor ecosystem: “Finland creates demand for advanced chips using industrial policy tools, alongside strategic procurement in sectors such as defense and aerospace, and connectivity.” Tuomas Korpela, Business Development Senior Manager - Corporate Development Organization, NokiaAt a regional level, Joerg Schulze, Director of the Bavarian Chips Alliance, said that his organization was supported by the Bavarian State Ministry of Economic Affairs, as well as by companies and universities. “We help semiconductor companies to establish themselves and grow here through help with site searches, networking and contacts, funding and support, and talent acquisition,” said Schulze.Joerg Schulze, Spokesperson for the Bavarian Chips Alliance, Director of the Fraunhofer IISB, Bayern Innovativ GmbHCompanies in the European semiconductor supply chain also provided the summit with their insights into the roots of global success. André Grede, Chief Technology Officer of Comet, described how his company’s strategy is not to wait for customers to tell it what they need, but to be “ahead of the curve.” Grede said: “Is staying in sync with the customer enough? Not for us - we are deeply embedded with our customers, and constantly looking to broaden our relevance to them.”André Grede, CTO, CometChristophe Maleville, Chief Technology Officer of Soitec, provided a real-world example of how this is done. He said: “Our engineered substrates using RF-SOI technology reduce the drain on a mobile phone’s battery power, and cut our customers’ board footprint thanks to RF front end integration. As a result, our products are now in 100% of 5G smartphones.”Christophe Maleville, CTO, SoitecAnne Hidma, Senior Vice-President for Europe and the US at ASML, shared the company’s success formula: “The reasons for ASML’s success include customer focus – decide which markets you are going to be in, and which you are not. We are also all-in on innovation. We nurture an ecosystem, which for us includes imec and CEA-Leti, as well as partnerships with academia. And lastly, we have a strong supply base, which is a core strength of Europe.” In a time marked by both uncertainty and opportunity, the example of ASML shows how the European semiconductor supply chain can survive and thrive.Anne Hidma, Senior Vice President EUR US, ASMLEurope’s Path ForwardThe CxO Summit made one thing clear: Europe has world-class innovation, policy momentum, and industrial commitment. What’s needed now is faster execution, deeper collaboration, and the courage to invest in the technologies of tomorrow. As the industry heads toward the $1 trillion milestone, the decisions made today will shape Europe’s place in the semiconductor world for decades to come.On behalf of SEMI, the SEMI Europe team would like to express appreciation to the industry leaders for sharing their visions and readiness to collaborate during the CxO Summit.SEMI ContactLaith Altimime, President SEMI [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Anne-Mary Yeboah, Technology Manager at SoitecWith a background in materials science and a strong interest in technology, Anne-Mary Yeboah has built a career that connects the worlds of engineering and management. After earning her degree in engineering, she deepened her understanding of business through a Specialized Master’s in Management—an experience that broadened her perspective and prepared her for the challenges of a global, fast-moving industry.Today, as Technology Manager at Soitec, Yeboah leads projects that contribute to the next generation of semiconductor innovations. Her journey reflects a balance of technical curiosity, leadership growth, and a belief in the power of inclusion. In this interview, she shares her thoughts on career development, the importance of diversity, and how young professionals can find their voice in a rapidly evolving industry.SEMI: What inspired you to join the semiconductor industry? Yeboah: I’ve always been fascinated by technology, and semiconductors are at the core of innovation today. They are everywhere, from smartphones to electric vehicles, and being part of this field means contributing directly to the technologies shaping our lives and future.SEMI: How did your early experiences and education shape your career path?Yeboah: My engineering studies led me to specialize in materials science, which naturally included semiconductors. Later, I decided to expand my knowledge by pursuing a Specialized Master’s in Management. This combination of technical and business perspectives shaped my career path and ultimately brought me to Soitec, where I now connect both worlds as a Technology Manager.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Yeboah: I’m especially proud of starting my career directly as a Technology Manager. This role has allowed me to contribute to complex, strategic projects and collaborate with teams across functions. Working on products that will drive future innovations is deeply fulfilling and gives meaning to my work every day.SEMI: As a young professional in the industry, what is your greatest challenge? Yeboah: One of the biggest challenges has been finding my voice in a highly experienced environment. It can be intimidating at first, but I’ve learned to turn it into an opportunity to ask questions, learn quickly, and build confidence in my contributions. It has pushed me to develop a broad skill set and become an effective collaborator across teams.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Yeboah: Dare to step forward and don’t create your own limits. Ask questions, even when you’re surrounded by experts, curiosity is a strength. Also, be patient. Building credibility and seeing your impact takes time, but each experience helps you grow and move closer to your goals.SEMI: How do you envision future work environments?Yeboah: I see the workplaces of the future as more innovative, inclusive, and collaborative. Diversity should be central, everyone should feel that their voice and perspective matter. At Soitec, initiatives like Women@Soitec are great examples of how gender equality and inclusion can empower people to thrive. I also believe technology and flexibility will continue to reshape how we work, helping us achieve both high performance and balance.SEMI: What impact has the 20 Under 30 Award had on your career? Yeboah: Receiving the 20 Under 30 Award has been a true honor and a wonderful source of motivation. It gave me a moment to reflect on how far I’ve come and to feel proud of my journey. The recognition has boosted my confidence, increased my visibility, and encouraged me to continue pushing forward in my career.Following 20 Under 30 JourneysAnne-Mary Yeboah’s story highlights the determination and adaptability driving today’s new generation of semiconductor professionals. Her ability to bridge science and management reflects the diverse skill sets shaping the industry’s future.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Eloise Bond, Senior Etch Process Engineer at KLA Corporation (SPTS Division)Eloise Bond studied Physics at Swansea University before joining KLA in 2019 as an Etch Process Engineer. Since then, she has worked on cutting-edge semiconductor applications while actively promoting STEM through local outreach programs like Generation Tech.A proud recipient of the SEMI Europe 20 Under 30 Award, Bond shares how the recognition boosted her confidence and expanded her network, enabling her to take on new challenges. In her interview, she reflects on overcoming imposter syndrome, the value of flexible work, and the unexpected opportunities that shaped her career. Outside of work, Bond enjoys camping and bouldering.SEMI: What inspired you to join the semiconductor industry? Bond: I’ve always had a passion for science, so pursuing a career in a related field was natural. However, I wasn’t aware of the semiconductor industry until I began studying Physics at Swansea University, which has strong research ties with local semiconductor companies like KLA. Now that I am in the industry, I enjoy the hands-on aspects of my job. I find working with different materials and equipment is more engaging to me than an office-based job. SEMI: How did your early experiences and education shape your career path?Bond: STEM activities during my childhood and visits to museums with my parents sparked my interest in science and the physical world. That curiosity lead me to study physics at Swansea University, which ultimately paved the way to my current role at KLA. As I mentioned earlier, a career in semiconductors wasn’t really a conscious choice until relatively late in my education; I simply followed my passion for science. Today, I’m involved in many of the STEM outreach programs at KLA, helping to promote the semiconductor industry to young children so they can discover the same opportunities that I was fortunate to have had exposure to earlier in my life.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Bond: One accomplishment I’m particularly proud of is building strong customer relationships with a volume production fab in Korea. It was my first experience with direct customer interactions, which felt quite daunting at the time. I was invited to support a tool installation on-site, which allowed me to travel the furthest from the UK I had ever gone. Seeing firsthand how our tools fit into the wider industry gave me valuable context for my day-to-day responsibilities and made my work feel even more impactful. SEMI: As a young professional in the industry, what is your greatest challenge? Bond: Imposter syndrome has been a significant challenge for me. I often find myself in meetings with more senior colleagues and fear I am not performing well enough. However, over time, I have learned that my input is valid and that having multiple perspectives often leads to better outcomes.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Bond: To make a difference, you first need to be part of the industry, just getting involved puts you in the room where conversations and decisions happen that you might not otherwise be exposed to.If an opportunity comes your way, take it. I entered this industry due to an opportunity presented to me at the end of my university career. KLA was my first real interview, and I honestly thought my chances were slim. I approached it as a ‘trial run’ and five years later, I’m still here. SEMI: How do you envision future work environments?Bond: I envision a new generation of management that places greater value on work-life balance. In many industries, senior management seem to have a relatively poor work-life balance, such as constantly doing business in the same way they’ve done for the past 40+ years – with constant business travel, working on holidays and long hours in the office. There is still an expectation for younger, ambitious employees to emulate this corporate culture, which creates barriers for those with caregiving responsibilities or other important commitments outside work. I believe a younger, more vocal generation of managers will drive positive changes in how we work. We will see more adoption of fully flexible working and 4-day weeks – happy employees lead to better work outcomes. I also think the technological advances which enabled the rapid switch to “working from home” during the COVID pandemic have permanently reshaped what is possible in terms of flexibly and efficiently.SEMI: What impact has the 20 Under 30 Award had on your career? Bond: This award has given me greater confidence to step outside of my comfort zone. It has also allowed me to increase my network to include colleagues I would have no reason to speak to previously. As a result, I have gained broader knowledge of how KLA operates as a whole and have been able to initiate small cross departmental projects I would not have been possible to before. Following 20 Under 30 JourneysEloise Bond’s journey highlights the passion, resilience, and forward-thinking mindset that characterize today’s emerging leaders in semiconductors. Her dedication to both technical excellence and community engagement showcases how rising stars are not only advancing the industry but also inspiring the next generation.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2025 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Mariusz Grabowski: Lead Design Engineer at Cadence Design SystemsMariusz Grabowski, a 2023 20 Under 30 award recipient at the age of 24. He is now a Lead Design Engineer at Cadence Design Systems, Inc., where he’s been making strides in digital systems design for nearly three years. Prior to this role, he gained valuable experience as an FPGA Design and Verification Engineer at Aldec Inc. Grabowski holds a master’s degree with distinction in automation and robotics from AGH University of Science and Technology in Krakow, Poland. During his academic career, he was an active member of both the Avader and Integra Scientific Groups. He also achieved recognition at events like DASIP 2023 and in the International FPGA Hackathon, where he and his team earned 2nd and 3rd place. He is currently also pursuing a postgraduate degree in Project Management at SGH Warsaw School of Economics. SEMI: What inspired you to join the semiconductor industry? Grabowski: I have always been fascinated by the fundamental workings of advanced systems and that curiosity led me to pursue a career in the semiconductor industry. As a digital design engineer, it is exciting for me to contribute to the creation of such large and sophisticated architectures from basic building blocks. Now, I’m proud to be a part of Cadence Design Systems, where I can work on the cutting-edge designs with some of the most talented and hard-working engineers. Grabowski and his team at the awards ceremony at FPGA Hackathon 2023SEMI: How did your early experiences and education shape your career path?Grabowski: During my studies, I had the opportunity to work on hands-on projects with an FPGA platform, which led me to my first job as an FPGA design and verification engineer. That experience gave me a broader perspective on the industry’s scale and reinforced my passion for tackling challenges, learning and growing in this field.Grabowski presenting his paper at the DASIP 2023 ConferenceSEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Grabowski: For me, it is successfully balancing full-time studies with work. It was a challenging experience, but it provided invaluable opportunities to grow my skills and gain hands-on experience. During that time, I completed numerous projects, participated in scientific conferences and industry events like DASIP 2023, and even earned 2nd and 3rd place in the International FPGA Hackathon. These achievements reinforced my passion for the field and my ability to thrive under pressure. SEMI: As a young professional in the industry, what is your greatest challenge? Grabowski: One of the biggest challenges is navigating the complexity of large-scale projects, where seamless coordination between multiple teams across the globe is crucial. As someone still early in my career, gaining the experience to manage the cross-functional aspects of a project while ensuring my own contributions are technically sound has been both demanding and rewarding.Grabowski at the Discussion Panel on Industry Career Perspectives at DATE 2024 ConferenceSEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Grabowski: The sheer amount of information and complexity in the industry can feel overwhelming. It is essential to embrace curiosity and continuous learning, but it is also crucial to recognize that you can’t do everything alone. My advice is to find your area of expertise and collaborate with others; teamwork is key to bringing impactful projects to life. Cadence’s Design Team in Warsaw, Poland Manager Jacek Rosiak—3rd from the leftSEMI: How do you envision future work environments? Grabowski: I envision future work environments as places where technology fosters creativity and collaboration, diversity is celebrated, and flexibility and work-life balance are prioritized. These environments will empower employees to perform at their best while feeling supported and valued. I am proud to be a part of Cadence Design Systems, where I feel that these values are strongly cultivated. SEMI: What impact has the 20 Under 30 Award had on your career? Grabowski: Receiving the 20 Under 30 Award was an incredible validation of the hard work I’ve put into my role. It gave me a confidence boost, affirming that I am on the right path and capable of making meaningful contributions to my company and the broader semiconductor industry. It also brought significant recognition, which opens up numerous opportunities.Following 20 Under 30 JourneysMariusz Grabowski’s journey in the semiconductor industry highlights the power of dedication, curiosity, and continuous learning. From his early experiences with FPGA platforms to his significant accomplishments in both academia and industry, Grabowski is a true example of how passion and hard work can drive meaningful contributions. As a young professional, his insights offer valuable inspiration for the next generation of engineers eager to make their mark in this ever-evolving field. With a bright future ahead, Grabowski is sure to continue influencing the world of technology, one innovative project at a time.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Introducing Raphael Hardegger: Product Manager Advanced Products at VATRaphael Hardegger is a Product Manager at VAT, where he leads the development of innovative atomic layer deposition (ALD) valve technology. Starting his career in 2009 as a design engineer apprentice at VAT, Raphael has since gained diverse experience, including entrepreneurial ventures and a role in MedTech. Today, he focuses on shaping product strategy, aligning solutions with customer needs, and driving impactful advancements in the semiconductor industry.SEMI: What inspired you to join the semiconductor industry? Hardegger: I joined the semiconductor industry, and VAT in particular, at the young age of 15. Back then, I started as a design engineer in VAT’s apprenticeship program. Growing up in the beautiful VAT region, my entry into the industry was somewhat by chance – but I’m incredibly glad it happened! After gaining foundational knowledge at VAT, I pursued studies in mechanical engineering, worked in various other roles and companies, and then completed a master’s in business innovation. About 3.5 years ago, the semiconductor industry pulled me back in, and I haven’t looked back since. What keeps me excited about VAT and the industry as a whole is its sheer complexity. Every day, we have the opportunity to innovate with small components that have a significant impact on a huge industry. It’s such a multifaceted field that I’m confident I’ll continue learning something new every day for the rest of my career.SEMI: How did your early experiences and education shape your career path?Hardegger: In Switzerland, the apprenticeship model uses a results-oriented work style from an early age. The lessons I learned during my four years as an apprentice at VAT continue to influence my daily work life. The mechanical foundation I built during that time remains a tremendous asset in my career. When combined with my studies in systems engineering and business innovation, this foundation has allowed me to make a meaningful impact both at VAT and within the broader industry.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you? Raphael Hardegger in the VAT office of San Jose, California, USA, holding the new product he worked on.Hardegger: When I rejoined VAT as a product manager, I was given the opportunity to manage a new product that wasn’t even on the market yet. This product was a key part of VAT’s strategy to outpace market growth by expanding into new product segments beyond our core offerings. I had the privilege of collaborating with some of VAT’s most talented engineers, who developed an incredible product. Together, we learned a great deal through our initial interactions with customers, refining the product to meet stringent requirements. This year, we successfully qualified the product for use in the industry’s most challenging semiconductor processes. It’s a testament to how dedication, customer-focused engineering and exceptional teamwork can make a significant impact. What makes me proud is not just working on innovative concepts, but creating products that truly excite our customers and contribute to meaningful growth for VAT.SEMI: As a young professional in the industry, what is your greatest challenge? Hardegger: I turned 30 this year, so I suspect I was one of the oldest 20 under 30 winners last year. One challenge I’ve faced — not only in this industry, but across others — is impatience. As a young professional with high aspirations, it’s easy to feel that things aren’t moving fast enough. We often expect early promotions, annual salary increases, and quick recognition for our efforts. What changed my perception on this was a conversation with a senior manager at VAT shortly after I joined. I asked him what steps I should take to move closer to my next career goal, such as earning a management position. His response was simple and direct: Focus on making an impact in your current role. Build a strong track record and demonstrate your skills. Everything else will follow. I took his advice, and I'm glad I did. No, I didn't get promoted immediately, but I learned the value of patience, doing my best every day, and finding satisfaction in the process.Career progression isn’t just about motivation and talent — it’s also about timing and aligning with the business needs. Being impatient or pushing for premature career moves can often backfire, leaving you in a worse position than before. By focusing on making a genuine impact and building a solid track record, you create a strong foundation for a fulfilling and sustainable career.SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Hardegger: You're in a great place — right where you need to be. Be curious and explore as much of the semiconductor industry as you can. During my training as a design engineer, I wasn't deeply involved in understanding the customer applications our valves were serving. My focus was primarily on developing vacuum valves based on product management requirements and manufacturing needs. Since I returned, I've learned the importance of understanding what our customers truly need and translating those needs into product requirements.This shift has not only helped me and the team create better products, but also made the work much more enjoyable! While I'd still like to deepen my understanding of customers' processes, it's already fascinating to learn more about their goals and see how our products can make a real difference. If I could go back to my apprenticeship or just starting this industry, my advice to myself — and to anyone starting out — would be to stay as curious as possible. Take every opportunity to learn what customers are trying to achieve with the products you help create. That curiosity will guide you to make a meaningful impact.SEMI: How do you envision future work environments? Hardegger: To me, having a clear customer focus in every aspect of a company's efforts is essential. At the end of the day, someone needs to want to buy our products for us to remain profitable and continue to grow. That’s why maintaining a customer-centric approach in all aspects of product development and management is critical. At the same time, the people who work in such companies need to be happy and fulfilled to create great products. I appreciate the recent trends we’re seeing to improve the corporate culture, such as embracing hybrid working models. These approaches provide a healthy balance between in-office collaboration and focused work from home, helping employees maintain productivity and well-being.SEMI: What impact has the 20 Under 30 Award had on your career? Hardegger: While I deeply appreciate the recognition that comes with such awards, I believe my career should ultimately be defined by the impact I make in my field. That said, I do hope the award inspires other young professionals to explore this exciting industry and build meaningful careers here! Following 20 Under 30 JourneysRaphael Hardegger’s journey in the semiconductor industry is a testament to the power of curiosity, dedication, and a customer-centric approach. From his early days as a design engineer apprentice to his current leadership in product innovation, Raphael continues to drive meaningful change at VAT Group. His story inspires young professionals to embrace continuous learning, focus on making a real impact, and contribute to the growth and success of the semiconductor industry.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

The sensor revolution is shaping the future of connectivity, with innovation in MEMS and imaging technologies paving the way for a smarter and more integrated world.As the world becomes increasingly interconnected, MEMS and imaging sensor technologies are driving transformative changes across industries, shaping the future of connectivity, intelligence, and sustainability. Powered by advances in miniaturization, AI integration, and sustainable design, MEMS and imaging technologies are enabling groundbreaking applications—from autonomous vehicles to wearable health devices—while addressing urgent global challenges like climate change and energy efficiency. At the MEMS Imaging Sensors Summit 2024, Laith Altimime, President of SEMI Europe, emphasized the pivotal role of MEMS and imaging technologies. Setting the stage for discussions on technological breakthroughs and market trends, Altimime remarked, “Sensors are at the heart of the next wave of innovation, enabling unprecedented levels of intelligence that are transforming industries and fostering a smarter, more sustainable, and seamlessly connected future.”Laith Altimime, President, SEMI EuropeStefan Finkbeiner, CEO of Bosch Sensortec, underscored in his opening keynote how advanced sensor technologies are enabling life-changing use cases. “Sensors are all around us, though we don’t always notice them,” emphasizing sensors’ ubiquitous role in smartphones, wearables, and hearables. Finkbeiner highlighted miniaturization as a key challenge, noting that even as sensors continue to shrink, they are increasingly integrated with edge AI to enable efficient, local decision-making.Stefan Finkbeiner, CEO, Bosch SensortecSimone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager at STMicroelectronics, highlighted the pivotal role of sensors as a bridge between the physical and digital world, noting “the most sophisticated machine is the human – so it is best to emulate human capabilities to enable the next generation of devices to accurately measure the parameters of your body.” Ferri stressed the importance of sustainability, advocating for smart, transformative, and precise sensors that provide meaningful data with optimal efficiency. By aligning technological innovation with environmental responsibility, Simone Ferri demonstrated how sensorization can enhance lives while enabling a net-zero transition across industries.Simone Ferri, APMS Group Vice-President and MEMS Sub-Group General Manager, STMicroelectronicsMEMS Growth Fueled by Piezo Materials and ElectrificationJean-Christophe Eloy, CEO and President of Yole Group, grounded the discussion in market data, forecasting a 5% CAGR for the MEMS market, which is set to exceed $20 billion by 2029. He highlighted key trends such as the increasing sophistication of automotive sensors—more cameras, higher resolution—and the impact of electrification. On the technology front, Eloy noted a “strong shift towards piezoelectric (piezo) MEMS,” driven by advancement in new materials like Lead Zirconate Titanate (PZT), Aluminum Nitride (AIN), and Scandium-doped Aluminum Nitride (ScAIN).Jean-Christophe Eloy, CEO and President, Yole GroupAlissa Fitzgerald, CEO of A.M. Fitzgerald Associates explored the expanding roles of MEMS technology in new domains, such as fiber optics for data centers. “Photonics is in the news,” she remarked, highlighting its potential to deliver 40% power savings compared to copper technologies. “MEMS manufacturing is set to evolve by 2030 and beyond,” said Fitzgerald, emphasizing the continued innovation in traditional wafer-based processes through the adoption of advanced thin-film materials like piezoelectrics and GaN. Furthermore, Fitzgerald discussed emerging manufacturing techniques such as 3D-printed MEMS and biodegradable materials to enable low-cost, sustainable sensors.Alissa Fitzgerald, CEO of A.M. Fitzgerald AssociatesAdding to the conversation on manufacturing, Jessica Gomez, CEO of Rogue Valley Microdevices, shared her perspective on how 300mm-capable MEMS foundries could “change the game,” improving production efficiency and lowering costs. Gomez also outlined the unique challenges of MEMS manufacturing, including the need for custom processes and the high-mix, low-volume nature of production.Advancing Smart Mobility Through Interoperable NetworksSmart mobility gained significant traction as Patrice Ancel, In-Vehicle Technologies Leader at BMW, tackled the intricacies of in-vehicle networking. Ancel shed light on the complexities of today’s vehicles, which contain 20,000 components and over 100 electronic control units (ECUs) from multiple suppliers. His message was clear: “Interoperability is key for us; without interoperability, none of this will happen.” Ancel’s call for collaboration resonated throughout the summit, highlighting the critical role of teamwork in driving innovation and progress within the automotive industry.Patrice Ancel, In-Vehicle Technologies Leader, BMWA Vision for the Future: Sustainability, Collaboration, and InnovationThe MEMS Imaging Sensors Summit demonstrated how collaboration, sustainability, and innovation are driving the sensor industry forward. From addressing market trends to tackling manufacturing challenges, the discussions revealed a shared commitment to creating a smarter, more connected world.On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this summit a resounding success. SEMI ContactAna Bernardo, Manager of Technology ProgramsEmail: [email protected] Mobile: +49 175 4129 764Sitong He, Communications Manager Email: [email protected]: +49 151 5546 2638