SEMI S2 Revision Related to Pressure Systems
By Kevin Nguyen, SEMI
Many countries (e.g., Korea, Japan, China) are enforcing safety requirements for semiconductor equipment containing high pressure system.
The current version of SEMI S2-0818, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment, does not address safety measures for high pressure system.
The SEMI S2 Pressure Guidelines Task Force (TF), formed at the NA Fall Standards Meetings held on November 7, 2019, is developing Document 6651, Line Item Revision to SEMI S2, Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment.
This revision proposes addition of mechanical design of a high pressure system that has a design pressure more than 50 kPa above the atmospheric pressure.
Additional associated guidelines are also included with the following:
- Design guidelines,
- Tracking of approved parts,
- Materials requirements,
- Pressure leak testing requirements, and
- Jurisdictions (e.g., countries) requirements.
Led by Bert Planting (ASML), and all the major equipment suppliers, including Lam Research, Nikon, ASM, Applied Materials, KLA and Tokyo Electron, have been participating in this effort.
Document 6651 was issued in Cycle 8-2020 for ballot adjudication at the next EH&S NA TC Chapter meeting via Web conference on December 17, 2020.
Once this document is approved and published in SEMI S2, equipment suppliers and third-party evaluators will be able to provide the above documentation on SEMI S2 reports and show compliance. End users will then be able to provide these compliance reports to their government for acceptance. Hence, additional inspections and approvals for pressure systems may not be necessary.
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For more information please visit our main Web site and current events page. If you have any questions regarding SEMI EHS Standards activities, please contact your local SEMI Standards staff.
Standards Watch
SEMI
www.semi.org
December 3, 2020