BIOGRAPHY
Mike joined Amkor in 2005 and has led package developments for EMI shielding, thermally enhanced packages, sensors and high density MCM packages including 2.5D TSV and high-density fan-out (HDFO). He has worked in electronics and IC package design and manufacturing for 25 years, managing projects ranging from polyester flexible circuits to eutectic flip chip, IC package design and signal integrity. Mike has more than 40 patents in the field and holds master’s degrees in mechanical and chemical engineering.