BIOGRAPHY
As Director of the EUV Lithography and Novel Materials Research Group at Intel Corporation, Florian Gstrein has been at the forefront of semiconductor process technology research for nearly two decades. His expertise encompasses a wide range of fields, including metallization, dielectrics, interconnect reliability, patterning and lithography. In his current role, Florian is responsible for all aspects of next-generation lithography research at Intel, with a particular focus on developing photoresist and underlayer materials for high-NA EUV lithography and innovative patterning solutions based on directed self-assembly and selective deposition. His work has been recognized with two Intel achievement awards, one for the invention of a novel interconnect material and a second award for a novel EUV lithography integration scheme.
Florian holds a Master of Science degree in Materials Science from the University of Leoben, Austria and the Max Planck Institute for Metals Research, Stuttgart, Germany and a Ph.D. in Inorganic Chemistry from the California Institute of Technology (Caltech). With over 120 issued and filed patents, more than 20 peer-reviewed articles, and numerous keynote presentations at international conferences, he is deeply committed to advancing the field of semiconductor technology and driving innovation in this industry.