Santosh Kumar is currently working as Senior Director & Principal Analyst at Yole Développement. He is a technologist and strategist with multifaceted experience in materials, process, and business development including industrial market & technology strategic analysis in the field of semiconductor packaging and manufacturing. He is involved in the market, technology, and strategic analysis of microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging. He worked on multiple projects with several multi-national companies covering the entire microelectronics supply chain from fabless players, OEMs, IDMs, OSATs to equipment & material suppliers. He received a bachelor's and master’s degrees in engineering from the Indian Institute of Technology (IIT), Roorkee, and University of Seoul, respectively. He has published more than 40 papers in peer-reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.