Mauro J. Kobrinsky received his PhD from the Massachusetts Institute of Technology in 2001. He has been with Intel’s Components Research for 20 years; his current position is Director of Interconnects Structures and Architectures. He has contributed to all areas of interconnects research, including metallization, dielectrics, reliability, interconnects modelling, I/O, Si Photonics, functional materials, 3D integration, and Die-Package interactions. He has over 115 patents issued/filed, and more than 35 papers and conference presentations. Dr. Kobrinsky has served as a member of the Technical Advisory Board for the Interconnects and Packaging Science area of the Global Research Consortium (GRC), and as a member of the ITRS Interconnect roadmap team.