Wolfgang is a Principal Engineer at Marvell's newly acquired ASIC Business Unit. He works on advanced package solutions and chip interface definition for all ASIC products that require integration of multiple active components.
Before he started at Marvell Semiconductor, Wolfgang worked as a Packaging Engineer at IBM, and as a Customer Product Solutions Architect at GLOBALFOUNDRIES and at Avera Semi.
Wolfgang has authored more than 30 industry papers and publications, and holds more than 120 patents.