Robert D. Clark, PhD joined Tokyo Electron (TEL) as a Sr. Process Engineer in 2006 at TEL Technology Center, America, LLC (TTCA) in Albany, NY. In 2010 he relocated to Silicon Valley and was elected Member of the Technical Staff, and in 2015 he was elected as Sr. Member of the Technical Staff. His research focuses on thin film process technologies for advanced and emerging devices, materials, and interconnect structures for use in semiconductor manufacturing. Dr. Clark has contributed to processes for advanced CMOS contacts and high k and metal gate structures used currently in advanced semiconductor device manufacturing.
Prior to joining Tokyo Electron, Dr. Clark was a Principal Research Chemist for Air Products and Chemicals, Inc. (APCI) at the Schumacher site in Carlsbad, CA. During his 6 years at APCI, Dr. Clark was the lead technologist for the development of high k and metal gate precursors where he helped to develop the first precursor used for ALD high k dielectrics in CMOS manufacturing.
Dr. Clark completed his Ph.D. in Chemistry at the University of California, Irvine in 2000 and B.S. and M.S. degrees in Chemistry at Virginia Polytechnic Institute and State University (Virginia Tech), Blacksburg, VA, USA in 1993 and 1995 respectively.
Dr. Clark is currently an executive member of the SRC Decadal Plan committee, and served previously as a member and as the chair of the science advisory committee for SRC device sciences. He has also served as an industry liaison to numerous SRC research projects and in 2017 received the SRC Mahboob Khan outstanding industrial liaison award. He currently contributes to IRDS through the wafer and environmental contamination control committee, and is a member of multiple conference committees including the AVS ALD, AVS ASD, and VLSI-TSA conference committees. At TEL he has been a U.S. employee of the year, and in 2018 received the most impactful patent award for the U.S. as well. He currently holds more than 45 issued U.S. patents and has authored or co-authored well over 100 journal and conference publications including numerous invited talks and articles.