Dr. Melissa Grupen-Shemansky currently serves as Chief Technical Officer (CTO) at SEMI / FlexTech. She is responsible for the technical advisory councils and program oversight of consortium R&D projects that are in-part funded by the Department of Defense. These programs support development in flexible hybrid electronics (FHE) and nano-bio applications. Two consortia, the FlexTech FHE and the Nano-Bio Manufacturing Consortium (NBMC), collectively represent over $160M in federal and industrial investment over the span of 8 years furthering the advancement of FHE technologies and ecosystem development. In addition, Dr. Grupen-Shemansky serves as a technical advisor to SEMI’s Advance Packaging initiative and as a technical liaison to NextFlex, the Flexible Hybrid Electronics Manufacturing Innovation Institute. She serves on the Advisory board for BRIDG in Neo City, FL.Prior to joining SEMI, Dr. Grupen-Shemansky held various executive management roles in the semiconductor industry.
With over 25 years in the industry, she has both Fortune 100 company and start-up innovation experience in research and development, manufacturing, business development and technology strategy. Dr. Grupen-Shemansky began her career at Motorola in semiconductor research and development. Over the course of 10 years, she held various management positions in silicon and gallium arsenide device fabrication, packaging, interconnect and system integration. Following Motorola, she was the Director of Interconnect Technology and Design Engineering in Lucent, Bell Labs, microelectronics division. She later joined Spansion, the flash memory division of AMD, as Vice President of Packaging and Interconnect Technology. And before joining SEMI, Dr. Grupen-Shemansky was the Senior Vice President of Engineering for Advanced Nanotechnology Solutions, Inc., a startup in 3D ICs and cybersecurity.
Dr. Grupen-Shemansky holds both Bachelor’s and Master’s degrees in Chemical Engineering from Pennsylvania State University and a PhD in Chemical Engineering from Arizona State University. She has received various corporate and educational awards, has seven issued patents, numerous technical publications, and is a contributing author to Failure-Free Integrated Circuit Packages.