BIOGRAPHY
As corporate vice president of Front End Operations at Micron Technology and Head of Micron Taiwan, Donghui is responsible for managing the company’s wafer fabrication facilities in Taiwan, as well as aligning Micron Taiwan’s goals and strategic direction with the company’s overall objectives and mission.
Donghui has more than 20 years of semiconductor industry experience spanning technology development and transfer, manufacturing ramp, and fab construction.
Prior to joining Micron in February 2022, Donghui worked at Intel Corporation for 22 years. He was vice president of Manufacturing, Supply Chain and Operations, and co-general manager of the High-Volume Manufacturing Program Office, responsible for leading programs for new manufacturing space enablement and driving global strategic expansion initiatives. Donghui also played a critical leadership role in growing Intel’s memory business, deploying 3D NAND and Optane technologies jointly developed with Micron to Intel, and leading Intel’s 3D NAND process development teams independently developing two new generations of floating gate 3D NAND process technologies.
Donghui holds a B.S. degree from Tsinghua University in Beijing, China, and Ph.D. from Ohio State University in Columbus, Ohio, U.S., both in materials science and engineering. He also received joint EMBA degrees in the United States, from the University of California, Berkeley, and Columbia University, New York.