Advanced Materials and Flexible Hybrid Electronics Take Center Stage at SEMI Strategic Materials and FLEX Europe Conferences
MUNICH, Germany – 10 October 2018 – Two segments key to semiconductor industry growth – advanced materials and flexible hybrid electronics – will take center stage at SEMICON Europa. Focused on the latest trends and new business opportunities, the SEMI Strategic Materials and 2018 FLEX Europe - Be Flexible conferences will highlight demand drivers for new materials in the microelectronics supply chain at SEMICON Europa 2018, co-located with electronica, in Munich, Germany, November 13-16, 2018. Registration for the two conferences is open. To register for SEMICON Europa, click here.
New all-time high device shipments are expected to power a record-breaking year for the semiconductor materials market, making the selection of the right substrate even more important, according to Yole Développement president and CEO Jean-Christophe Eloy. With technology requirements and costs key considerations, alternative non-silicon-based substrates like SiGe, GaAs, GaN, and SiC are rising in prominence.
Themed “Diversity in the Materials for High Technology,” the Strategic Materials Conference (SMC) takes place 13 November 2018. The event includes four technical sessions covering materials for emerging technologies, substrates, systems, heterogeneous integration, high-purity materials, contamination control and digitalization.
The 2018 FLEX Europe - Be Flexible conference, themed “Innovations Enabled by Flexible Electronics,” is 13-14 November 2018. Researchers, market analysts, material and product developers, and equipment suppliers will gather to provide insights into the latest Flexible Hybrid Electronics innovations. The event is organized by SEMI with FlexTech Alliance and Fraunhofer EMFT.
SEMI Materials and Flex Europe Keynotes
At the SEMI Strategic Materials Conference, Susan Weiher, GLOBALFOUNDRIES senior director TD, will highlight emerging applications demands on material development for higher quality, yield and reliability.
At 2018 FLEX Europe - Be Flexible, Philips Research Professor Ronald Dekker will present innovative approaches to integration as electronic devices find their way into the human body.
Also at 2018 FLEX Europe - Be Flexible, Christian Neumann, head of Digital Printed Electronics at Heraeus, will discuss new markets like smart textiles and in-mold electronics, and Mike Hack, VP of Business Development at Universal Display Corporation, will explore the promise of OLED technology in giving rise to new, exciting products over the next few years.
SEMICON Europa highlights also include:
- Advanced Packaging Conference: What’s new, what’s missing, what’s next
- Smart Automotive Forum SEMI Global Automotive Advisory Council (GAAC)
- 22nd Fab Management Forum: Attracting European wafer fab customers and talent
- SEMICON Europa Workforce Day and Students Career Café
- SEMICON Europa Executive Program: Addresses current trends for the European electronics industry and offers opportunities for company executives and experts to network.
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Serena Brischetto, SEMI Europe