SEOUL, Korea — August 20, 2024 — With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Organized by SEMI Korea, Advanced Packaging Summit 2024 will bring together leaders from companies such as Intel, Samsung, and SK hynix to explore topics including 2.5D packaging, chiplet packaging, co-packaged optics (CPO) and flip-chip ball grid array (FCBGA) substrate technologies. The Summit will feature a panel discussion that will examine how advanced packaging can help meet the performance demands of AI and HPC.
Agenda Topics and Presenters
- The Journey of the Semiconductor Industry and the Innovation of Advanced Packaging - Heejoung Joun, Samsung Electronics
- CPO (Co-Packaged Optics) - David Harame, AIM Photonics
- Advanced Packaging Technology for HBM and 2.5D SiP - Ho-Young Son, SK hynix
- Enabling the AI Era - Jinyoung Jeon, ASMPT
- The Role of Advanced Packaging Technology for AI - SungSoon Park, Intel
- FCBGA Substrate Technologies for AI/HPC - Mooseong Kim, LG Innotek
- Advanced Packages for Chiplets - TaeKyeong Hwang, Amkor Technology Korea
- Glass Substrates - Prof. Bongyoung Yoo, Hanyang University
Advanced Packaging Summit Sponsors
Registration is open until September 4, 2024. More information can be found on the event website.
About SEMI
SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contacts
Jaegwan Shim, SEMI Korea
Phone: 82+2.531.7804
Email: [email protected]
Samer Bahou, SEMI Headquarters
Phone: 1.408.943.7870
Email: [email protected]
