MILPITAS, Calif. ─July 26 , 2024 ─ SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today applauded the United States Department of Commerce ’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Amkor Technology construction of a facility in Peoria, Arizona for the advanced packaging of semiconductors. The proposed direct funding of up to $400 million would bolster Amkor’s investment of approximately $2 billion and 2,000 jobs in the Arizona greenfield project, which will support end-to-end production of leading-edge chips for applications in high-performance computing, artificial intelligence, communications, automotive and other markets.
“SEMI has advocated for incentives to support the entire advanced chipmaking ecosystem, and we applaud the U.S. Department of Commerce for this latest investment to strengthen the vital packaging phase,” said Joe Stockunas, President of SEMI Americas. “This proposed CHIPS Act funding for SEMI member Amkor would support the fast-growing semiconductor ecosystem in Arizona with domestic advanced packaging and test capabilities that are essential for chip innovation.”
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About SEMI
SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
Association Contact
Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]