Request for Proposals Open Until July 6; Informational Webinar on May 20
MILPITAS, Calif. – May 19, 2026 – FlexTech, a SEMI Technology Coalition, today issued a request for proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $500,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover total project cost.
The RFP seeks proposals targeting FHE advances in the following areas:
- Flexible, Moldable Electronics
- Advanced Bonding Reliability
- Novel Flexible Energy Storage Beyond Conventional Architectures
- 2D Materials
Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2026 RFP for more details on the evaluation process.
Proposal Submissions
Full proposal submissions are due July 6, 2026. Awardees will be notified following the review of proposals by the RFP committee. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:
- Rationale
- Budget
- Collaboration value
- Dual-use (industry and military) applicability
- Relevance to the topics and the FHE ecosystem
- Schedules and milestones
- Reasonable and stretch deliverables
- Overall proposal quality
Informational Webinar on May 20, 2026
To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 20, 2026 at 10:00 a.m. PDT. A recording will be available for registrants unable to attend the event. Register for the webinar.
About FlexTech RFPs
FlexTech RFPs support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals.
FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. Development partners retain ownership of intellectual property developed under FlexTech agreements. If you have any questions, please contact [email protected].
About FlexTech
FlexTech is an industry-led public/private partnership that brings together scientists, engineers, and business development professionals from industry, government, and universities to collaboratively initiate research and the development of the infrastructure required to develop world-class FHE devices and products. Learn more.
About SEMI
SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology coalitions, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.