FLEX Technology Summit 2026 Spotlights Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR

Milestone Event Marks 25 Years of Breakthroughs in Flexible Hybrid Electronics, Printed Electronics, and Advanced Packaging

MILPITAS, Calif. — January 22, 2026 — The FLEX Technology Summit will be held on February 24-26, 2026, at the Wigwam Arizona Resort in Phoenix, Arizona, celebrating 25 years of innovation in flexible hybrid electronics (FHE), printed electronics, and advanced packaging. This year’s theme, “Edge of Reality: Augmenting Flexible Hybrid Electronics with AI, Digital Twins, and XR,” will focus on how emerging technologies are transforming FHE and related fields. Registration is open.  

FLEX 2026 will feature keynotes, technical sessions, gap analyses, professional courses, industry tours, and a dynamic exhibit of solution providers showcasing the latest advancements in FHE, heterogeneous integration, MedTech, and more. Attendees will gain insights into cutting-edge equipment, processes, materials, and applications driving next-generation electronics. The event will also highlight innovations from public-private partnerships fostered by SEMI Technology Communities, FlexTech and Nano-Bio Materials Consortium (NMBC). 

“For 25 years, FLEX has been integral in uniting the industry, academia, and government—pushing the boundaries of what’s possible in flexible hybrid electronics,” said Gity Samadi, Senior Director of R&D Programs at SEMI. “This milestone is not just a celebration of our progress, but a look into what’s next. At FLEX Technology Summit, we’ll reflect on the innovations that built the foundation to today's technologies and explore the breakthroughs that will revolutionize the next 25 years.”

FLEX Technology Summit 2026 Keynote Presentations:

• Michael D. McCreary, PhD, Chief Innovation Officer, Senior VP, E Ink
  Flexible ePaper Displays: From University Research to Global Corporation
• Roozbeh Ghaffari, Co-Founder, Chief Executive Office, Epicore Biosystems, Inc.
  Wearable Microfluidic Systems for Personalized Hydration and Health Management
• Lindsay Pack Moll, Chief Executive Officer, InnovaFlex USA 
  From Idea to Fab
• Ani Kelkar, PhD, Partner, McKinsey & Company, Inc.
  Will Embodied AI Create Robotic Coworkers?
• John A. Rogers, Director, Northwestern University
  Flexible Bioelectronics – From Exploratory Research to Medical Translation

Join FLEX 2026 to celebrate 25 years of innovation and explore the future of electronics at the intersection of flexibility, intelligence, and connectivity. Register today at https://semi.swoogo.com/FLEX_2026. 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.