SEMI Taiwan

SEMI continues to establish new programs to address these four critical industry issues in Taiwan and support worldwide semiconductor industry growth and innovation.

In January 2022, SEMI Taiwan released SEMI E187 – Specification for Cybersecurity of Fab Equipment. What cybersecurity pain points does SEMI E187 ultimately address?

Terry Tsao, Global Chief Marketing Officer at SEMI and President of SEMI Taiwan, recently discussed technology trends with Young Liu, Chairman of Hon Hai Technology Group (Foxconn), as a prelude to SEMICON Taiwan’s five online forums.

Emerging applications powered by 5G and artificial intelligence (AI) are expected to be a boon to the semiconductor industry, but only once chipmakers overcome a key challenge: Architecting chips that meet the exacting performance, power consumption, size and cost requirements of devices for mid- to high-end applications. One technology – heterogeneous integration – promises to meet these demands and help drive future leaps in semiconductor innovation in the post-Moore era. To help the industry better grasp the technology challenges and business opportunities associated with deploying highly integrated chip and packaging technologies, SEMI and AI on Chip Taiwan Alliance recently gathered industry leaders from organizations including ASE, Unimicron, Dialog Semiconductor, Cadence and AITA to discuss technology trends and the vital importance of building a cross-industry exchange platform to advance next-generation manufacturing processes critical to heterogeneous integration. Following are key takeaways from the forum, Heterogeneous Integration Enables 5G and AI. Overcoming Heterogeneous Integration Technology Challenges Key to Advances in Taiwan High-End Semiconductor Manufacturing The introduction of the Heterogeneous Integration Roadmap (HIR) by the International Technology Roadmap for Semiconductors team in 2016 was an important first step, Dr. C.P. Hung, Vice President of ASE Group, noted in his opening remarks. The HIR is designed to stimulate pre-competitive collaboration to advance heterogeneous integration technology development and accelerate electronics innovation. The roadmap provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. Today, the HIR working group focuses on high-performance computing (HPC), 5G and other leading-edge technologies.Dr. Hung predicted that heterogenous integration will reshape traditional collaborations between the semiconductor ecosystem and supply chain in order to clear I/O bottlenecks that hamstring high-performance applications. The retooled industry connections will also need to enable high I/O pin counts, ultra-thin devices, and high-frequency signal shields. In an important step forward, the chip industry today is developing a platform that enhances wafer-level advanced packaging services and deepens cooperation with Oversea Assembly and Testing (OSAT) and substrate supply chain partners. Overcoming the current limits of IC substrates – the connection between IC chips the PCB – is one key for heterogeneous integration technology to flourish, said Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron. He noted that the industry must tackle limits to PCB thickness, substrate density, fine pitch and automation to meet the needs of high-end packaging customers. Another barrier the industry must be surmounted is to make the currently inscrutable confidentiality requirements for patents of foreign materials – key to improving chip yields – easier to access and understand for substrate engineers. Chen said partnerships across the entire industry will be necessary to break through this and other technology breakthroughs. Supply Chain and Cross-Border Ecosystem to Strengthen Partnerships for Further DevelopmentTaiwan has long invested heavily in advancing semiconductor manufacturing and application engineering technologies to become a top global chipmaking hub and, in the process, has been behind significant leaps in optimizing chip functionality, said Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany). With its semiconductor manufacturing prowess, Taiwan can also play a central role in maturing advanced heterogeneous integration packaging technology while managing development costs by partnering with its international supply chain community to overcome technical challenges more effectively, Liu said. The region can also help forge partnerships, even among competitors, to build the ecosystem essential for heterogeneous integration technology to shine.EDA tools will be critical in understanding and resolving heterogeneous integration technical issues since IC substrate, packaging and chip design all pose interdisciplinary engineering challenges, said Julian Sun, Product Marketing Director at Cadence. To help the industry navigate these challenges, Cadence has launched intelligent system design products – solutions that address a wide range of design problems with semiconductor nanometers, micrometers on packaging and testing, and PCB level micro/millimeters to Pin/Pitch, I/O models, and thermals and electricity. By supporting various technical designs, Cadence helps customers shorten the design cycle to strengthen design quality and reduce costs.Sun also pointed to the vital importance of overcoming the significant challenge of designing silicon interposers for heterogeneous integration. Today’s EDA tools are capable of optimizing the design of complex structures including 5GAiP and HBM and are instrumental in aiding Taiwan’s semiconductor ecosystem players to quickly adapt to shifts in the evolving heterogeneous integration market.Heterogeneous Integration Enables 5G and AI speakers (L-R): Julian Sun, Product Marketing Director at Cadence, Dr. Yu-Hua Chen, Vice President, Carrier SBU, RD Division of Unimicron, Dr. C.P. Hung, Vice President of ASE Group, Leroy Liu, General Manager, Asia Headquarters, of Dialog Semiconductor (Germany), Dr. Shih-Chieh Chang, AITA Executive Secretary Designing AI chips is particularly difficult as semiconductor makers struggle with high costs and low yields, said Dr. Shih-Chieh Chang, AITA’s Executive Secretary. That’s why the chip industry now uses FPGAs for small-volume production of AI chips, which makes it easier to improve manufacturing yield through redundant design. For its part, AITA has formed a special interest group (SIG) to help form connections among the chip industry, academia and research institutes. The association’s goal is to build a platform for mass production of AI chips.To get involved in SEMI Taiwan Heterogeneous Integration related events, please contact Ula Huang, outreach senior specialist, at [email protected] Fang is a coordinator and Ashley Huang is a specialist in marketing and public relations at SEMI Taiwan.

As the fight against COVID-19 presses ahead, many healthcare workers, especially those on the front lines, are being pushed to their limits and beyond to ensure our health and safety. To help doctors and nurses combat the virus, SEMI Taiwan mobilized six leading Taiwan semiconductor companies last month to donate personal protective equipment (PPE) designed for industrial operation to medical staff. The gear included powered air purifying respirators (PAPR), half facepiece respirators, head tops, protective coveralls, and air filter canisters.On behalf of the semiconductor industry, SEMI Taiwan worked closely with industry leaders and the government to deploy the direly needed resources to support the domestic medical community. The Taiwan Association of Medical Technologists accepted the donations in the ceremony attended by Taiwan CDC Deputy Director-General Chuang Jen-hsiang. The largesse is the result of public-private partnership to provide medical supplies to 35 hospitals and medical laboratories across Taiwan. Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan, and six Taiwan semiconductor companies stepped up to help combat the coronavirus pandemic. TSMC Charity Foundation responded with PPE giveaways in March in a first wave of protective equipment donations to medical personnel. Before long, Vanguard International Semiconductor Corporation (VIS), ​​​​​​​​​​​Macronix, Micron, United Microelectronics Corporation (UMC), and 3M Taiwan also answered the call for more medical equipment for COVID-19 frontliners. Extending the Taiwan semiconductor industry’s rich tradition of making charitable contributions in the region, including financial assistance for emergency relief efforts, the companies donated more than 1,000 pieces of PPE after balancing the giveaway with inventory needs in their fabs. Fab workers responsible for machinery, raw materials, and other goods and gear used in semiconductor manufacturing wear the protective devices. One piece of equipment, powered air purifying respirators (PAPR), features a battery-powered that sends filtered air flowing into a hood or head top covering the wearer’s head or face to protect against respiratory hazards. In healthcare, PAPRs protect medical staff as they test blood and tissue samples for traces of COVID-19. Dr. N.S. Tsai, CEO of TSMC Charity Foundation, notes that respiratory protection equipment can offer integrated protection against multiple hazards and is comfortable for medical technologists working long shifts to wear. Medical facilities across Taiwan quickly depleted PPE supplies after the rapid response to the January outbreak by healthcare providers across the region led to quick containment. The PPE donations were critical in minimizing exposure risks to medical staff. The chip industry’s protective clothing and equipment offered another benefit: Medical technologists found the gear – designed to be worn over long periods in semiconductor manufacturing facilities – comfortable as they worked marathon shifts early in the COVID-19 outbreak. “Coronavirus testing requires a much higher level of protection than is needed in many healthcare settings,” said Chuang Jen-hsiang, the Deputy Director for the Taiwanese Centre for Disease Control (CDC) and the spokesperson of Taiwan Central Epidemic Command Center. “Medical technologists must work in a poorly ventilated labs for more than eight hours a day, causing sweating and damp heat. The high-performance PPEs provided by the industry help healthcare workers breathe more naturally without wearing a mask while greatly reducing infection risk in hot, humid environments.”For their COVID-19 response, Taiwan’s government and well-trained medical workers drew lessons from the SARS outbreak in 2003 to quickly activate emergency management structures to fend off the emerging threat – one that put the Taiwan semiconductor industry and its round-the-clock operations at risk.“Taiwan’s swift response to the COVID-19 was vital in preserving the business continuity that is the lifeblood of the semiconductor manufacturing,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “We are honored to do our part to support the heroes of this fight – the medical technologists on the front lines – as an expression of our great respect and gratitude for their extraordinary work.”SEMI Taiwan has long partnered with TSMC Charity Foundation to care for people in need, drive positive environmental and social changes, and support emergency aid in Taiwan. The goal our joint corporate social responsibility efforts is to warm the hearts of our people and build a better society.Irene Huang is a public relations and marketing specialist at SEMI Taiwan.

High-tech industry clusters in the bustling northern Taiwan port city of Hsinchu look set for an upgrade. Long a world-class hub of the semiconductor and optoelectronic technology industries, Hsinchu City is laying out plans to work with SEMI to attract more international companies, generate more jobs, promote Hsinchu’s development and help grow Taiwan’s microelectronics industry. High-tech heavyweights such as TSMC, UMC, MediaTek, Realtek, and AUO are all headquartered in The Windy City. The Industrial Technology Research Institute (ITRI), a leading Taiwan research center and incubator, also calls Hsinchu home, and the city boasts one of the highest concentrations of educational institutions in the region, a roster that includes National Chiao Tung and National Tsing Hua universities. Hsinchu’s thriving relations with these industry, academic and research partners have made it a hotbed of innovation, with numerous large Taiwanese and foreign companies having opened local offices. No less than these partners, the city – like SEMI – is committed to innovation.In a recent visit to the SEMI Taiwan office in Taipei, a Hsinchu City government team led by mayor Lin Chih-Chien, met with Terry Tsao, global SEMI chief marketing officer and president of SEMI Taiwan, to explore collaboration opportunities in areas such as technology subsidies, policy, education, and infrastructure. The meeting built on a relationship between the city and SEMI Taiwan that sprouted after SEMI executives and Hsinchu officials joined ITRI to host the Autonomous Driving System Platform in Open Fields kick-off ceremony – an initiative to accelerate Taiwan’s adoption of smart transportation technologies – at SEMICON Taiwan 2019.At the meeting, Mayor Lin highlighted that Hsinchu has long attracted high-tech companies by cultivating a business-friendly climate through incentives such as subsidies for infrastructure buildouts. He hopes to work with SEMI to promote to members the benefits of setting up local offices in Hsinchu City.With both Hsinchu’s high-tech clusters and SEMI’s global members deeply reliant on skilled workers for sustaining innovation and growth, Tsao and Mayor Lin agreed that inspiring students to pursue an education and careers in science, technology, engineering and mathematics (STEM) is vital to building a high-tech talent pool. One collaboration opportunity SEMI Taiwan is eyeing is to launch Taiwan’s first SEMI High Tech U (HTU) program in Hsinchu to spark the interest of school-age children through STEM educational activities at school camps or art and cultural centers. SEMI’s STEM discovery program offers hands-on activities and experiential learning led by industry volunteers. Since 2002, HTU has reached some 8,000 high-school students in 12 U.S. states and nine countries.Emmy Yi is a marketing specialist at SEMI Taiwan.

Technologies promising huge growth such as Artificial intelligence (AI), 5G, machine learning, high-performance computing, and telematics are ratcheting up pressure on semiconductor manufacturers in the race among product makers to accelerate time to market and capture share. To support rapidly evolving end markets for these and other technologies that are key drivers of industry growth, chipmakers are boosting semiconductor performance, producing more wafer sizes and improving manufacturing efficiency.At the same time, chip manufacturers must enable unprecedented end-product reliability for exploding markets such as automotive and healthcare markets where, with lives at stake, products can’t afford even the slightest lapse in reliability. In response, chip suppliers are retooling their manufacturing processes to support 3D stacking, package-level integration and miniaturization. But they must do more. Bringing high efficiency to all phases of manufacturing including design and materials is the new imperative. The key to quality management is not in the traditional post-production testing and damage control but in prevention. Delivering the highest quality and reliability must start in the earliest stages of production with manufacturing and testing design – an approach that reduces not only the cost of downstream testing but minimizes product defects that can damage a supplier’s credibility and lead to lost business.To that end, SEMI has launched its Quality Assurance Special Interest Group (SIG) consisting of representatives from industry leaders such as Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE. The group's goal is to establish quality requirements spanning the supply chain to meet new, higher reliability standards and help safeguard Taiwan’s competitive edge in the global microelectronics industry. Meeting for the first time earlier this month, the companies exchanged ideas for improving quality management in semiconductor manufacturing and ultimately deliver the reliability the market needs.The company representatives unanimously agreed that the first step is to ensure a QA-friendly environment with quality requirements for various stages of chipmaking ranging from design, manufacturing, packaging and testing to even PCB and CCL production. The SEMI Quality Assurance SIG this year plans to build on its current membership by enlisting companies from various fields to address critical areas of reliability including statistical process control, surface-mount-technology-based board level reliability control, and 0 dppm quality control for automotive chips. SEMI Quality Assurance Special Interest Group consists of leading companies in the industry, including Infineon, NXP, TSMC, UMC, ASE, Unimicron, and GCE. “SEMI’s comprehensive platform of exhibitions, programs, forums, trade meetings and matchmaking events is instrumental in bringing together key industry players to enhance quality management practices and meet the growing reliability requirements of the end markets we serve,” said Terry Tsao, chief marketing officer at SEMI and president of SEMI Taiwan. “The Quality Assurance Special Interest Group is a shining example of how SEMI continues to support the crucial role of Taiwan’s semiconductor industry in the international community.”For more information about the SEMI Quality Assurance Special Interest Group or to become a member, please contact Emmy Yi at [email protected] Yi is a marketing specialist at SEMI Taiwan.

As artificial intelligence’s (AI) sprawling influence reshapes industries from logistics and healthcare to automotive and manufacturing, Taiwan is poised to leverage its cutting-edge capabilities and rich history in semiconductor manufacturing to stake out a leadership position in AI. Taiwan’s semiconductor manufacturing industry accounts for a major share of the region’s GDP and, with its manufacturing prowess, the region is fertile ground for using AI to optimize and even revolutionize chip manufacturing. In an AI and Semiconductor Smart Manufacturing Forum recently hosted by SEMI Taiwan, experts from Micronix, Advantech, Nvidia and the Ministry of Science and Technology of Taiwan (MOST) shared their insights on how deep learning, data analytics and edge computing will shape the future of semiconductor manufacturing. Here are four key takeaways.1. Monitor, Forecast, and PreventToday, tier 1 foundries use AI tools to combine equipment know-how and manufacturing statistics in managing massive Fault Detection (FD) data, much in the way that a car’s tire-pressure monitoring system helps maintain safe inflation levels and prevent accidents. For example, AI enables the real-time collection and monitoring of massive amounts of processing data, then alerts system administrators of any hardware failures or other manufacturing abnormalities.AI also makes it possible to adopt Run-to-Run (R2R) control to automate manufacturing process adjustments and corrections by providing feedback that can drive higher processing efficiency. In addition, virtual metrology replaces manual sampling inspection for comprehensive quality control, enabling foundries to improve yields, reduce costs, and strengthen their competitive advantage.2. Beyond Automation: Edge Computing The evolution of IoT is giving rise to a paradigm shift in the industry as the recognition grows that smart factories must go beyond automation to focus also on intelligence. All information – from equipment status and manufacturing process statistics to on-site environmental data – needs to be collected through sensors. In highly time-critical scenarios, returning all sensor data to the cloud for processing is time-consuming and impracticable. This is where edge computing’s real-time features and lower cost than cloud computing come into play.How does edge computing work in a smart factory? First, a rich trove of data from various devices is collected and integrated via Manufacturing Execution Systems (MES). Software analysis then produces a real-time factory production status before production data is visualized through a combination of system platforms and human-machine interfaces. In the end, the data is analyzed realtime in the cloud so failures can be predicted and prevented to help increase capacity and reduce costs. The approach is even capable of Bill of Materials (BOM) predictions, allowing better collaboration between upstream and downstream suppliers.3. Deep Learning Accelerates AI Deep learning enables autonomous driving, intelligent voice assistance and many other AI breakthroughs. The heart of deep learning is its ability to automatically process and learn data in various formats such as images, video and text with no human domain knowledge. This increases predictive accuracy and efficiency in processing massive amounts of data. Deep learning also enhances the efficiency of human-machine collaboration.4. Taiwan’s Competitive Niche: Industry 3.5Industry 4.0 is not just about improving production management. It also focuses on integrating supply chains, even among competitive companies. For Industry 4.0 to thrive, rival companies must grow together. The first and third industrial revolutions centered on disruptive technologies like steam engines, transistors and digital, while the second and fourth revolutions homed in on competition among various business models, platforms and industry ecosystems.While Taiwan’s strengths include innovation, short time-to-market, low manufacturing costs, and high supply chain management efficiency, the region still lags advanced countries in basic industry and research capabilities. Squeezed by Chinese supply chains and high-end manufacturers in advanced countries, Taiwan should start by carving out an Industry 3.5 niche for the island’s manufacturers. SEMI will continue to facilitate cross-industry connection, collaboration and innovation to help manufacturers seeking higher production efficiency and lower costs incorporate AI as a core competitive advantage. At SEMICON Taiwan 2018, SEMI will unveil its Smart Manufacturing Journey, an exhibition that gathers leading AI companies such as ABB, Advantech, Nvidia, Sony and UPS to demonstrate a comprehensive roadmap for smart manufacturing technologies and applications. For more information, please visit the SEMICON Taiwan website.Emmy Yi is a marketing specialist at SEMI Taiwan.