printed electronics

SEMICON Europa, SEMICON West, SEMICON Japan, & SEMICON Taiwan welcome back exhibitors and visitors to show floors starting in mid-November as four of SEMI’s seven flagship events gather visionaries and industry leaders to explore the latest semiconductor trends and innovations by the end of 2021.

Is your company working on the next big thing in flexible, hybrid and printed electronics – a breakthrough or innovation that will make the world safer, healthier or more productive for years to come? If so, we want to hear from you.You’re invited to deliver a technical presentation at virtual FLEX 2021, February 22-26, 2021. The call for abstracts is now open! Celebrating its 20th year, the online event will gather executives, product managers, business development professionals, and engineering directors as well as leading industry analysts and media for the latest developments, trends and innovations in flexible hybrid electronics (FHE). More than 400 companies, universities, R D labs, and government agencies from around the world have participated in FLEX conferences.Technical presentations should focus on the conference theme, 20 Years of Driving Innovation to Make the World Safer, covering flexible hybrid or printed electronics products, equipment, processes, materials, and the applications they enable. FLEX 2021 also takes aim at the future of the planet, so presentations on global sustainability in areas such as impacts, strategies, tactics, successes and progress area also a great fit. To submit your abstract, please complete the online form: Upload your abstract (100-300 words) describing the topic of your presentation and how it applies to the flexible, hybrid, and printed electronics products. Preference is given to original research and advancements in process and materials as they relate to end users. We also invite students from research universities to submit posters describing their work and results for the popular FLEX Poster Competition. As in the past, a panel of industry and academic experts will evaluate the posters and recognize the top three students and their work. Here are key deadlines and dates for industry experts and students to keep in mind: September 30, 2020 – Submit your abstract. October 31, 2020 – We’ll notify you whether your presentation has been accepted by this date. November 15, 2020 – Sign a Speaker Agreement and provide a bio and headshot. February 1, 2021 – Send us an electronic copy of your presentation. We’re looking for presentations in these topic areas: Flexible Hybrid Electronics Systems Materials Processing Sustainability and Power MEMS and Sensors Applications Presentations should include the following: Why the technology presented matters and to whom Practical recommendations for addressing commercialization issues or applications. This includes providing innovative technological or market solutions driven by a use case, the integration challenges you faced, and the system-level architecture decisions you made. Descriptions of how you overcame each challenge Ideas for what as an industry we should be working on and what are you working on to demonstrate sustainability For a full rundown on topics and other information, please visit the FLEX 2021 Call for Papers web page.Michelle Fabiano is a program and event manager for SEMI Americas.

How are flexible electronics impacting the automotive sector? How will medical diagnostics and life sciences be changing with the advent of flexible, conformable electronics? How does space exploration intersect with the continued development of flexible sensors and Internet of Things (IoT) systems? The upcoming 2019FLEX Japan / MEMS SENSORS FORUM in Shinagawa, Tokyo, May 22-23, 2019, will explore these questions and more. The event, the third FLEX Japan, is expected to gather 300 designers, technologists, researchers, analyst and product developers to hear presentations, discuss their approaches, and create connections. The transformation of the automotive industry will receive special attention with speakers from Yole Développement and a deep exploration of the new sensor form factors and capabilities. Professor Shoji Kawahito of Shizuoka University will discuss the impact of image sensors on automotive LIDAR, night vision and monitors for the driver and passengers. Dr. Yoshifumi Sakamoto of IBM Japan will share his views on key trends in smart transportation and what they mean for the supply chain. Beck Oh, president and CEO of PNI Sensor, will share how parking sensors are transforming our driving – and parking – experience. Hideo Fukunaga, project manager for Velodyne LiDAR, will discuss his work using LIDAR, often seen as the most promising and the most difficult and expensive component of autonomous driving. Jerome Joimel, CTO of ISORG, will discuss integration of organic image sensor behind display.Medical and home electronics devices are moving out of their boxes and hospitals, and flexible electronics, new sensor designs and new power options are playing a major role in that transformation. Jenax, Kobe University, Toyo University, Osaka University, and Daiwa House are just some of the presenters in this area. Researchers are steadily overcoming key technology hurdles, such as electronic interconnects between soft and rigid surfaces, and energy harvesting techniques for no-power devices, as well as ultra-thin RF components, and advanced microfluidic systems. Space, the final frontier, will be the backdrop for the general keynote talk of Mayya Mayyappan, chief scientist for exploration technology at NASA’s Ames Research Center. His team is investigating new printed and flexible sensors and electronics that can be printed in zero-gravity and how these devices will enable IoT.The only event in Japan focused on flexible and printed electronics, with special focus on the complementary areas of sensors and MEMS, 2019FLEX Japan / MEMS SENSORS FORUM provides an excellent opportunity to meet with industry players considering integration and application of new form factor electronics. More than 20 exhibitors will showcase the building blocks for conceptualizing and designing new products immediately.Register now!