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FlexTech

Humanity has survived almost unimaginable challenges over the past 5,000 years of documented human history. From war, famine and natural disasters to the first global pandemic in the last 100 years, more often than not, people have relied on one another to survive and thrive again. As the industry association representing the global microelectronics industry, SEMI has similarly made collaboration and community integral to the fabric of its organization. From helping members to succeed through the COVID-19 pandemic to facilitating member-driven industry standards around environmental health and safety, materials, and manufacturing capabilities, this approach shows members that standing together is better than standing alone.On the eve of the 50th annual SEMICON West (July 20-23, 2020) — the first virtual edition in SEMI’s history — I spoke with SEMI’s vice president of technology communities, Michael Ciesinski, about the role of SEMI in tackling big challenges through an active member community intent on solving problems through collaboration.SEMI: How long have you worked with SEMI and in what capacity?Ciesinski: In January 2016, I started my second tour at SEMI when FlexTech, the industry consortium I’d been leading, became SEMI’s first strategic partner. Nearly two years into that role, SEMI President CEO Ajit Manocha asked me to form Technology Communities to engage members with common interests. After FlexTech, we brought on the Fab Owners Alliance, then MEMS Sensors Industry Group (MSIG), and later the Electronic System Design Alliance (ESD Alliance).SEMI now has more than 20 communities in all, including Smart MedTech, Smart Data AI, Smart Manufacturing, Electronic Materials, and Integrated Packaging, Assembly and Test.SEMI: What is your role with Technology Communities — and how do members stand to benefit?Ciesinski: The leadership of Technology Communities ensures that SEMI’s benefits and services align to our members’ interests so we can provide member benefits that matter most. This spans forming communities where people hold common interests (e.g., advanced packaging) to facilitating standards that will promote intelligence in manufacturing (e.g., data standards for AI and machine learning) as well as providing R D funding.I’m especially proud that over the past three years, SEMI has brought more than $40 million in R D funding to our members, with most grants in the $500,000-$1 million range. We’ve been especially successful in securing funding in flexible hybrid electronics (FHE) through U.S. Army Research Laboratories (ARL), a model we first developed through FlexTech.Two recent recipients of FHE funding, GE Research and ITN Energy Systems, show how the grants are spawning partnership opportunities among commercial enterprises, R D organizations and universities. In developing lightweight, non-invasive wearables, including a human-performance sweat-monitoring patch that remotely analyzes sweat to detect hydration levels and other vital signs, GE Research is using key components such as sensors and lightweight batteries in its designs.ITN Energy Systems designed a flexible all-solid-state lithium battery that’s printed on light, flexible substrates to power small and incredibly thin applications.Universities are also benefiting by plugging into the SEMI ecosystem. In fact, 40-50 percent of funded projects are seeding commercialization by universities. This is another validation that SEMI’s collaborative, community approach to microelectronics is working.SEMI: Position, Timing and Navigation (PNT) is another hot area where SEMI has secured ARL funding. What makes this funding different and why is it important?Ciesinski: The PNT grant makes ARL funding available to the MEMS Sensors Industry Group (MSIG) members through SEMI for the first time. If you’ve ever lost GPS signal while coming out of a tunnel, you know how frustrating that is. For us, that’s an inconvenience, but for a healthcare worker in a remote location who’s waiting for a delivery of medication by drone, it could be life-critical. While that’s just one example of why we need PNT to operate when GPS isn’t available, I can imagine dozens of other important dual-use cases, including autonomous driving.SEMI: How else do Technology Communities benefit under SEMI?Ciesinski: Technology Communities need access to diverse resources to spur continuous innovation. Electronic Materials Group participants, for example, need to stay informed on regulations coming out of Asia, the U.S. and Europe that may affect their businesses. Where else other than SEMI can like-minded stakeholders congregate with people up and down the supply chain to determine whether industry-wide action is needed on regulation?SEMI: What is the importance of SEMI’s global footprint?Ciesinski: I’ve worked with many associations and managed major industry consortia. The clear advantage of SEMI is our global footprint. And that’s vital because microelectronics is a global industry involving a multitude of stakeholders that play essential roles in the supply chain.Let’s say you want to discuss EU regulations on hazardous chemicals. Rather than decipher these complexities alone, you can pick up the phone to speak with someone on SEMI’s European team to learn what’s critical.What if you’d like more information on the 20-plus new fabs that are going up in China? You can explore that question with our SEMI China or SEMI Industry Research and Statistics teams.SEMI: How has SEMI evolved over the years?Ciesinski: SEMI has a long history of providing what the industry cares about. We started in trade shows and pivoted to industry standards. We began with small silicon wafers and wafer carriers, and now within the span of 50 years we’re working on data-format standards that will support the application of AI and machine learning (ML) in the semiconductor industry.While highly varied today, data-format standards will help component manufacturers refine processes to create more efficient solutions. This ARL-funded program, which pairs SEMI members with the grant recipient, Cornell University, may offer dramatic gains in the productivity of semiconductor manufacturing.SEMI: How does SEMI’s approach to COVID-19 reflect core values of collaboration and community?Ciesinski: Together with Ajit Manocha, CMO Terry Tsao and other team members at SEMI, we pulled together a task force to help SEMI members navigate the pandemic.We tapped two existing groups, Environment, Health and Safety (EHS) and Information Technology Leadership (ITL) from the start, documenting their strategic and tactical approaches to help all members through the COVID-19 resource section of our website. The EHS section provides tips on facilities and meetings, employee policies, business travel and communications, while the ITL section lists insights on computing hardware for staff, licensing, networks, security and employee policies.Our EHS leadership team, which includes Entegris, Axcelis, Versum, and Intel, immediately started sharing best practices for sanitizing facilities. As a result of team meetings, SEMI EHS shared best practices on keeping the workforce remote and guidelines for returning people to work safely. From securing PPE and safeguarding employees and visitors by performing thermal scanning to outlining communications around potential employee exposures, EHS has provided meaningful resources for the benefit of all members.SEMI also took immediate steps in the area of advocacy. Our advocacy team in Washington, D.C., together with regional SEMI presidents around the world, have ensured that semiconductor facilities were and still are considered essential businesses in the U.S., Europe and Asia. That’s because microelectronics are foundational to fighting the pandemic.Microfluidics are critical to the Reverse Transcription (RT) Polymerase Chain Reaction (PCR) tests most commonly used for COVID-19. Sensors are embedded in the pulse oximeters that allow patients and healthcare professionals to monitor a vital rubric: oxygen saturation level. If oxygen saturation level drops into the low 90 percentiles or below, it may be time to go to the hospital for treatment.Microcontroller units are essential components in a wide range of hospital equipment, including the ventilators that may make the difference between life and death in the most seriously ill patients.SEMI: How can the ingenuity realized through microelectronics continue to help us tackle other big problems? Ciesinski: We have MEMS and sensors to thank for distributed intelligence, giving us the ability to put sensors anywhere, locally based in the field or in the packaging house.Food production is a prime example. Leveraging miniaturized wirelessly connected sensors, we can trace food through the entire production lifecycle, from the seed in the ground to the food in the warehouse and, ultimately, to the product that lands on the table.From larger enterprise such as IBM Food Trust to small startups, we’re using MEMS and sensors to improve crop yields so we can feed a human population that’s growing each year.There’s a sustainability piece as well. We’re using MEMS and sensors to reduce the amount of fertilizer or other nutrients or chemicals in the soil. That’s good for the environment and for the agricultural workers who labor in the fields.MEMS and sensors can also condense the time it takes to perform a specific task, conserving human resources.SEMI: Where do you think SEMI will go in the next decade?Ciesinski: Ten years from now, I believe we will still have our global footprint in place. I expect it will expand, particularly in Asia.We may also expand into new areas such as Latin America and Central America, which would provide at least two major benefits: People working in microelectronics would, I hope, have access to better quality of life. And diversifying the supply chain would allow nations and regions to have more control over the products they need, from PPE to medications, which may help us to better manage through the next pandemic.I am also hopeful that SEMI will be on the leading edge of helping our members communicate in much different fashion from what we have today. We’re already expanding beyond the paradigm of in-person meetings for standards meetings and conferences. As we move forward, I think we’ll see a hybrid solution to doing business, combining in-person meetings with virtual conferences and digital content that’s available 24/7.Whatever changes we see in SEMI, I’m confident that we will continue to see a global footprint in an industry association that prioritizes connections among members.Engage in the SEMI experience at upcoming SEMICON WestRegister today to hear from keynote speakers such as environmental advocate and former U.S. Vice President Al Gore, futurist and author Steve Brown, and IBM Research senior vice president and director Dr. John E. Kelly III, and Lea Gabrielle, special envoy of the Global Engagement Center for the U.S. State Department, at SEMICON West , July 20-23, 2020. Content will be live streamed and available on-demand. Michael Ciesinski is vice president of Technology Communities for SEMI, the global microelectronics industry association, appointed in August 2018. At SEMI, he directs activity for more than 20 industry groups, oversees the association’s R D funding program, and develops new technology initiatives to serve SEMI’s 2,400 members. Prior to re-joining SEMI, Ciesinski was president/CEO of FlexTech Alliance, an industry consortium focused on new methods of creating electronics. From 1995-2008, Ciesinski served in a similar role at the U.S. Display Consortium (USDC), a private/public partnership chartered with building the infrastructure for electronic display and flexible electronics manufacturing. Both FlexTech and USDC annually sponsor multimillion dollar technology development programs and provide industry technical, financial and market services. Ciesinski is a graduate of the University of Albany, NY, and a former member of the Dean’s Advisory Committee at California Polytechnic State University.Maria Vetrano is a PR consultant at SEMI.
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How are flexible electronics impacting the automotive sector? How will medical diagnostics and life sciences be changing with the advent of flexible, conformable electronics? How does space exploration intersect with the continued development of flexible sensors and Internet of Things (IoT) systems? The upcoming 2019FLEX Japan / MEMS SENSORS FORUM in Shinagawa, Tokyo, May 22-23, 2019, will explore these questions and more. The event, the third FLEX Japan, is expected to gather 300 designers, technologists, researchers, analyst and product developers to hear presentations, discuss their approaches, and create connections. The transformation of the automotive industry will receive special attention with speakers from Yole Développement and a deep exploration of the new sensor form factors and capabilities. Professor Shoji Kawahito of Shizuoka University will discuss the impact of image sensors on automotive LIDAR, night vision and monitors for the driver and passengers. Dr. Yoshifumi Sakamoto of IBM Japan will share his views on key trends in smart transportation and what they mean for the supply chain. Beck Oh, president and CEO of PNI Sensor, will share how parking sensors are transforming our driving – and parking – experience. Hideo Fukunaga, project manager for Velodyne LiDAR, will discuss his work using LIDAR, often seen as the most promising and the most difficult and expensive component of autonomous driving. Jerome Joimel, CTO of ISORG, will discuss integration of organic image sensor behind display.Medical and home electronics devices are moving out of their boxes and hospitals, and flexible electronics, new sensor designs and new power options are playing a major role in that transformation. Jenax, Kobe University, Toyo University, Osaka University, and Daiwa House are just some of the presenters in this area. Researchers are steadily overcoming key technology hurdles, such as electronic interconnects between soft and rigid surfaces, and energy harvesting techniques for no-power devices, as well as ultra-thin RF components, and advanced microfluidic systems. Space, the final frontier, will be the backdrop for the general keynote talk of Mayya Mayyappan, chief scientist for exploration technology at NASA’s Ames Research Center. His team is investigating new printed and flexible sensors and electronics that can be printed in zero-gravity and how these devices will enable IoT.The only event in Japan focused on flexible and printed electronics, with special focus on the complementary areas of sensors and MEMS, 2019FLEX Japan / MEMS SENSORS FORUM provides an excellent opportunity to meet with industry players considering integration and application of new form factor electronics. More than 20 exhibitors will showcase the building blocks for conceptualizing and designing new products immediately.Register now!
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Peel-and-stick simplicity isn’t just for adhesive bandages any more. IoT and flexible hybrid electronics (FHE) are bound to change hardware business models. And flexible displays will breathe life into any surface.These were among the insights foreshadowing the future of the FHE, electronic textiles, IoT, MEMS and sensors industries at the FLEX Japan and MEMS Sensors Forum Japan 2018. At the April event, organized by SEMI-FlexTech-MSIG, nearly 200 attendees shared their observations and lessons learned in the development of processes, products and applications. Presentations and discussions revealed these five takeaways.1. Expect the unexpected with FHE developmentFlexible Hybrid Electronics (FHE) continues to shrink the size and weight of products, enabling new markets and concepts. “FHE takes printed electronics and adds ICs for getting performance out of the PE structure,” said Wilfried Bair of NextFlex, adding that “peel- and-stick electronic products are one example of unexpected new markets enabled by FHE capabilities.” One potential application is large peel-and-stick safety sensors adhered to buildings to warn of structural dangers.Another surprising turn: With new insights into OLED technology originally developed for flexible displays, Cambridge Display Technology (CDT) has devised an innovative medical diagnostic tool for markets such as biomedical and agricultural monitoring. The tool features an atmosphere-processable OLED component with a simplified OLED structure encapsulated in aluminum foil.2. IoT and FHE devices should change hardware business modelsThis is the standard business model for many new FHE products: develop a product, manufacture it, find customers and sell. FHE and IOT device developers were encouraged by Jam Kahn of Gemalto to consider flipping the script: During FHE product development, explore building an after-market revenue stream by controlling and mining the data for trends it reveals. Because of its data harvesting potential, IoT is an excellent emerging technology for this strategy.The “Experience Economy” could create 200 connectable items per person, generating strong revenue streams from the collection and analysis of massive amounts of sensor-generated data. The key is for the data to be actionable. That means hardware suppliers must extend their focus to software development. “A recent study of California investors found that by 2025, 60 percent of global business profits will be from data,“ noted Harri Kopola of VTT, who advised hardware producers to examine business models that produce continuous value by leveraging software. “With FHE, we are creating the path to digitization for non-digital industries, and these industries need complete solutions,” he said.Hardware provider Xenoma, for example, sells an electronic shirt with sensors for measuring muscle movements, heart rate and other health-related data. Xenoma’s Ichiro Amimori said the company offers its open-source software development kit for free under one condition: The developer must share the collection data with Xenoma. The idea is that the more data collected, the greater Xenoma’s ability to improve human health over the long term and achieve its long-term vision of alleviating disease.3. Roll-to-roll and sheet-to-sheet manufacturing will meet in the middleOne of the big advantages of flexible and printed electronics was its promise to enable the manufacturing of electronics on a roll-to-roll (R2R) process in atmospheric (or close) conditions, like newspaper, rather than one sheet at a time, as with displays or wafers. But as development of inks and interconnects progressed, along with the placement of discrete and thinned-die components and basic flexible substrates on a moving web, most research and development (R D) and limited-production runs moved to sheet-fed systems to control material costs for experiments and low-volume production. R D on printing electronics processes split into two camps: the simple printed components camp on R2R, and the camp backing more flexible hybrid electronics development on a sheet-by-sheet basis. But progress didn’t stop.Harri Kopola of VTT highlighted new R2R inspection and test capabilities in the VTT pilot line in Finland. R2R processing advances incorporate ideas from biology, chemistry, optics, optoelectronics, advanced inspection and test capability, illustrating the multidisciplinary nature of FHE. While accurate, high-speed, pick and place of thinned, bare die remains the domain of sheet-to-sheet manufacturing, look for more improvements in accuracy and speed.Another new manufacturing concept that turns business models on their heads – “minimal fabs” – focuses on creating limited-run equipment and processes that use 3D printing and do not require cleanrooms. With a relatively low cost of entry, the approach enables electronics to be produced affordably anywhere.4. Powering the IoT is a grand challengeThe requirement for edge devices to function without intervention for long periods raises hard questions about how to power the devices. Using organic photovoltaics (OPV) in textiles to harvest energy from light could be one solution, according to Kasimaesttro Sugino of the Suminoe Textile Technical Center. ULVAC’s answer to the IoT power issue are requirements for edge device micro-batteries to be environmentally benign, safe, flexible and compatible with semiconductor processing less than .1 mm in height. The micro-batteries must also feature a long life and support continuous power output, high power density, low self-discharge (over 10 years) and mass production, said Shunsuke Sasaki of ULVAC. The batteries are being built on silicon, glass and stainless steel with dry, thin-film vacuum processing. 5. Flexible displays bring any surface to lifeWith their durability, flexibility, low-cost processing and programmability, flexible displays can transform any surface into a content-rich display with messages that make lives healthier, simpler and safer.One example is FlexEnable’s organic thin-film transistor (OTFT), a device made possible not only by recent advances such as the ability to build organic material transistors on plastic and the increasing clarity of new film materials but by continuous manufacturing process improvements. These advances are improving switching times and the color and video capabilities of thin-film transistors while retaining their flexibility, low power consumption and communication capabilities. Simon Jone of FlexEnable gave the examples of wrapping a display around the blind spots of automobiles or replacing side-view mirrors with interior monitors showing feeds from an external camera, approaches that would improve safety while reducing wind drag and increasing fuel efficiency.E Ink’s reflective technology and flexible products are coming to market with a wider color spectrum. The company’s Michael McCreary said its designers are specifying the panels for innovative projects such as the exterior walls of the San Diego International Airport parking garage. Used to communicate with airport visitors, the installation is weather-proof, programmable and self-powered.
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