BCP

Augmented reality (AR) tyrannosauruses towered on-screen as I interacted with the creatures in a mix of prehistoric and cutting edge. Or, rather, my AR double was doing the playacting. Minutes later, virtual doppelgangers of a small lineup of chip industry executives cut the ceremonial ribbon. Seemingly sweeping away the winter chill, the opening of SEMICON Japan 2019 dazzled with smart technology and the promise of lives, cities and workplaces transformed, with uber-intelligent applications in full display at Tokyo Big Sight. But what resources does the industry need to harness to drive the next era of innovation? The semiconductor industry’s unwavering passion and young talent are key, said Hiroshi Imano, Chairperson of the SEMICON Japan Initiatives Committee, in his opening keynote. And hardly any region of the world is in a better position to help realize that future than Japan, Imano said. The region supplies one third of the equipment and more than half of all materials to the global semiconductor manufacturing industry.Talent was also top of mind for SEMICON Japan 2019 keynote speaker Makiko Eda, Japan's Chief Representative Officer at the World Economic Forum (WEF). Serving as a platform for public-private partnerships, the organization's mandate is to tackle global issues such as climate change and geopolitical strife in making world more resilient to risk and, by extension, more sustainable.Spanning ecology, economy, technology, society, geopolitics and industry, that mission includes reskilling and upskilling a billion people over the next decade, a high priority for WEF, which hosts a conference every January in Davos, Switzerland. The theme of this month's conference – Stakeholders for a Cohesive and Sustainable World – reflects the vital importance of building the international partnerships and global consensus necessary to achieving WEF's goals.One key to that sustainability will be technology and Arm, a global chip design company, will play a key role, with the company’s chips touching over 70 percent of the world’s population, Arm president Yuzuru Utsumi said in his keynote. Today, Arm is driving toward an ambitious goal: Ship 100 billion chips from 2017 to 2021 – the same number produced over the previous quarter century – by powering advances in mobile computing, server and networking infrastructures, and automotive applications.Arm’s innovation ecosystem of more than 1,000 partners will deliver these chips as they continue to work together to develop differentiated technology. Arm plans to increase investments not only in its primary processor business to accelerate market share gains but in the company’s new IoT business to create new revenue streams. The goal: Deliver long-term sustainable growth, Utsumi said. SEMICON Japan 2019 showcases SMART manufacturing and transportation Billed as a showcase of smart technologies, SEMICON Japan 2019 delivered with an array of eye-grabbing exhibitions in the popular SMART Applications Zone. In the SMART Transportation area, the automatic operation pavilion featured a car equipped with open-source software for autonomous driving. The exhibitor, Tier IV, aims to help lead the early commercialization of self-driving vehicles through the adoption of its software, Autoware, which makes it easier to develop self-driving vehicle prototypes using low-power platforms.Sony Semiconductor Solutions demonstrated a vision sensing processor designed to guide autonomous drones. Using two cameras, the processor measured the changing distance between visitors moving about the exhibit and stationary objects in real time, indicating proximity in hues of red (nearby) and blue (at a distance). Many visitors were wowed, describing the multichromatic display as futuristic.Others rode a simple wooden swing hanging by two ropes, but from dizzying heights thanks to Solidray’s Duo-Sight, a virtual reality (VR) system that projects 3D images stretching from wall to floor for immersive experiences. One visitor thrilled at how riding the swing, suspended only a few feet from the floor, felt like soaring on a flying trapeze. Target applications for the technology include virtual rides at amusement parks and presenting interior design options to homeowners.In the SMART Manufacturing area, one highlight was the demonstration by the National Institute of Advanced Industrial Science and Technology (AIST) of a remote-controlled Minimal Fab System designed for low-volume, high-mix chip production with little staffing. Designed to increase production efficiency, the system allows a circuit designer to manufacture a semiconductor by singlehandedly operating equipment up and down the production line. Controlling nearly 50 pieces of equipment, the Minimal Fab System on display manufactured chips that were verified for functional operation and exhibited afterwards.On the SMART Applications stage, exhibitors DENSO and Toyota Motor Corporation announced a new joint venture to conduct research and advanced development of the next-generation in-vehicle semiconductors critical to electric and autonomous vehicle innovation. The venture, operating as MIRISE Technologies, will combine Toyota’s mobility expertise with DENSO’s in-vehicle component prowess. The goal is to build a rapid, competitive development system by 2030, said Yoshifumi Kato, executive director of the DENSO Research and Development Center, and president and representative director of the venture. On track to begin work this year, MIRISE will span three fields of technology development: power electronics, sensing and SoC (System-on-a-Chip). The name MIRISE combines word the Japanese word "mirai" (future) with "rise."Business Continuity PlanningNatural disasters and other emergencies are an ongoing threat to uninterrupted business operations across the semiconductor manufacturing supply chain and particularly in earthquake-prone Japan. To better prepare for business disruptions and restore normal operations as soon as possible after disaster strikes, more companies are teaming on Business Continuity Planning (BCP).THK's Seismic Isolation Experience Car demonstrated one technology designed to help – a seismic isolation device. The car shakes like an earthquake to give people inside a taste of how a building heaves and sways during a quake with and without the device deployed. Visitors were struck by how much the isolator dampens tremors to prevent or minimize damage. In the BCP seminar, representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting shared lessons learned from actual disasters and discussed the critical importance of daily disaster drills. Yukihide Keigo, Executive Engineer in charge of Products and Development at Sony Semiconductor Manufacturing, recounted how the company’s Kumamoto Prefecture plant struggled for 96 days to restore full operations after the facility sustained heavy damage in the 2016 earthquake. Keigo said the plant lacked the structural reinforcements necessary to withstand the impact and fell prey to poor planning and accountability. The Kumamoto plant has since implemented measures – structural and procedural improvements – that more accurately account for seismic risks to ensure full recovery within 56 days. The plant’s new procedures include emergency drills for staff including night-shift workers.Innovation abounds at six SuperTHEATER forumsSEMICON Japan 2019 was held in the West and South Halls of Tokyo Big Sight as organizers of the Tokyo Olympics occupied the East Hall, the exhibition's usual home at the venue, to prepare for the 2020 games. For the first time, the main stage, SuperTHEATER, was set up in the cavernous arena near the main entrance. The SuperTHEATER featured six forums over three days. Semiconductor Executive Forum – View by Top Two in the Era of Digitalization with thought leaders from IHS Markit and Sony Semiconductor Solutions SMART Connectivity Forum – Infinite World Brought by 5G Innovation with experts from Softbank and Nokia Solutions Networks SMART Transportation Forum I – Front-line of Automated Driving featuring speakers from Intel and DENSO SMART Transportation Forum II – Revolution of Sky Transportation, supported by the U.S. Commercial Service in Japan, with presenters from Ministry of Economy, Trade and Industry (METI), Subaru and Bell Helicopter Manufacturing Innovation Summit – Issues and Innovation: What will Drive Growth to 2030 featuring thought leaders from VLSI Research, Applied Materials, KLA, Nikon and Tokyo Electron Mirai Vision Forum – Future Relation of Technology and Body 2.0 with speakers from Leave a Nest, Ory Lab and Autonomous Control Systems Laboratory The Mirai Vision Forum highlighted advanced technologies that could lead to societal improvements. One presenter, Kentaro Yoshifuji, CEO at Ory Lab, recalled how, as a child, he once stayed home from school while recovering from an illness. His imagination in full flight, the youngster imagined having a clone that could attend school and be with his classmates. The experience eventually inspired him to develop OriHime, a robot that gives socially isolated people a way to communicate with friends or colleagues remotely. Originally developed for physically impaired people, OriHime today is used to help the able-bodied. The robot is situated with the companion and the user operates OriHime remotely. A camera and monitor in OriHime’s face provide the visual and audio connection and the user controls the device with a smartphone or tablet or, for those who are paralyzed, through eye movement. One potential application: With OriHime stationed at a business office, working mothers could use OriHime to telecommute to better balance their careers with their parenting responsibilities at home. The robot would be a mother’s go-between, enabling her to communicate directly with colleagues.The next generation of innovators also took the stage as five teams presented innovative business ideas in friendly competition. The top prize in The TECH CAMP Hackathon went to the group that hatched an ingenious plan to develop a jacket that trains users to move their bodies in preprogrammed ways. For example, legendary Japanese professional baseball player Shigeo Nagashima could wear the gear while batting to program the device, then give the jacket to someone who’s never swung a baseball bat. The jacket would help the user replicate Nagashima’s swing. Now comes the real work of any innovator – executing on the vision.And then came two soccer-playing artificial intelligence (AI) robots that squared off and ... Scored! The demonstration by the Toyota National College of Technology started as a research project by Toyota National College students in 2002. The young innovators designed and developed all the robotic hardware and software from scratch. Looking ahead to SEMICON Japan 2020!SEMICON Japan 2019 not only gathered leading Japanese semiconductor materials and manufacturing equipment providers to demonstrate their latest innovations. The premiere regional event also provided insights on key trends critical to the entire electronics manufacturing supply chain. This year’s event drew more than 51,000 visitors and 695 exhibitors from 15 regions filling more than 1,700 booths.SEMICON Japan 2020 returns to East Hall at Tokyo Big Sight in December 2020. I look forward to seeing you there!Jim Hamajima is president of SEMI Japan.

Wedged among four major tectonic plates, Japan is at the mercy of their abrupt herculean shifts and the earthquakes and tsunamis they can trigger. The fallout can be devastating. The magnitude 9 Great East Japan (Tohoku) temblor in 2011 and ensuing tsunami took nearly 20,000 lives, destroyed 138,000 buildings and cost $360 billion in economic damage.Factories including silicon wafer production facilities owned by Shin-Etsu Chemical and MEMC Electronic Materials – together accounting for 25 percent of the global silicon wafer production – sustained heavy damage. Operations were suspended. The Kumamoto earthquake in 2016 also caused significant damage. The economic cost: as much as $7.5 billion.With disaster risk rising on a global scale, these calamities offer valuable lessons in disaster preparedness and how companies can draw from their experiences to strengthen business continuity planning (BCP).Earthquake experiences and lessons in BCP were the focus of the recent SEMI Japan Members Day as speakers from five semiconductor device and equipment manufacturers offered their BCP strategies to about 150 SEMI members. Following are key takeaways from their presentations. Renesas: Create a robust production plant that is hard to break and easy to fixRenesas Semiconductor Manufacturing’s Naka plant took about 80 days to resume production while its ability to deliver semiconductors was delayed even longer as it recovered from damage caused by the Tohoku earthquake, said Yoshiyuki Miyamoto, Representative Director and President at Renesas. Operations at the company’s Kawajiri plant were disrupted by the Kumamoto earthquake.A key lesson from both earthquakes: The company needed to promote risk visualization from top-to-bottom in the supply chain. With the goal of making its plants easy to repair but hard to break down, Renesas implemented a risk management plan for earthquake preparedness plan to ensure stronger production line resistance and a stable supply to customers. The company ran simulations of multiple earthquake scenarios including aftershocks, enabling it to develop new BCP training and preparedness measures. Sony: Staying transparent about the disaster, sharing and interacting with related companiesYukihide Keigo, a representative from the Sony Semiconductor Manufacturing, showed footage taken the day the Kumamoto earthquake damaged a production line at its Kumamoto Technology Center. Sony is the top manufacturer of imaging sensors worldwide, and the Kumamoto plant is the backbone of that production. The magnitude of the foreshock fell within levels Sony had accounted for in its BCP at that time, and the line was expected to return to full production within a week. However, the magnitude of the earthquake that followed outstripped expectations, and the company’s BCP didn’t hold up. Three and a half months later, the plant had finally fully recovered. The protracted recovery prompted Sony to develop an earthquake preparedness plan using a model that assumed double the magnitude of expectations. For full restoration, the company identified challenges to returning to full operation at each stage of the production line. Then it went even further, developing in-house diagnostics, implementing critical path methods and strengthening earthquake resistance of equipment that manages bottlenecks for the restart of the plant. The revision of its BCP plan led to the establishment of a system to shorten the resumption of production after a major earthquake to just two months.Sony shared the contents of its BCP review with other companies to solicit help identifying any gaps and highlighted its partnership with Renesas in the Semiconductor Industry Association in Japan (JSIA), a committee of the Japan Electronics and Information Technology Industries Association (JEITA), to share materials procurement resources for the purposes of disaster preparedness and business continuity. HORIBA STEC: Steady daily practices protect hundreds of millions of yen worth of products HORIBA STEC’s Aso plant, near the epicenter of the Kumamoto earthquake, suffered heavy damage that cut off electricity and the water supply, yet production in its clean room resumed in just 10 days, said Hiroyuki Koyama, a factory manager at the plant. The plant’s quick recovery stemmed from daily preventive measures implemented before the quake such as connecting freestanding shelves for greater stability, applying thick rubber bands as rails to prevent manufactured goods from falling to the floor, and placing equipment on rolling carriages instead of fixed shelves.The practices saved the Aso plant hundreds of millions of yen in products and materials that otherwise could have been lost in the earthquake. Koyama also offered the reminder that, with regulations governing factory layout and construction differing widely depending on factors such as a building’s age, companies need to tailor their BCPs to the unique characteristics of each building. THK: The key point of dampening earthquakesTHK’s ACE Division develops earthquake dampening and vibration control devices designed to absorb the vibrational energy of an earthquake, though the devices must also be designed for precise analysis of that energy, said Hidemi Murao. Murao provided an overview of the latest technologies and products for dampening earthquake vibrations and shared test results from experimental devices.Murao described how THK’s recently introduced Linear Motion (LM) Guide, an earthquake vibration dampening technology, can significantly reduce building vibrations during a temblor. In a video Murao showed to demonstrate how the guide works, a shelf loaded with equipment rests on a platform equipped with THK’s LM Guide equipment. Simulating an earthquake, the platform shakes vigorously in every direction but the shelf remains steady as the LM Guide dampens the vibrations. The platforms can be installed on floors or underground in buildings or factories to prevent shelves from toppling. Tokyo Electron: The ideal BCP management systemOne risk associated with BCP training is that it can become overly routine, dulling the response of employees in actual disasters, said Tokyo Electron Vice President Tatsuya Aso. To help keep its workers’ skills sharp, TEL held surprise drills with employees assigned to particular BCP roles to test their ability to adapt quickly to when disaster strikes. In addition, TEL has launched surveys in more than 70 overseas locations to optimize safety in these high-hazard facilities.The SEMI Japan Members Day presentations made clear that the issue of BCP transcends boundaries between individuals, manufacturers, regions, and sectors within the global electronics supply chain. Disaster preparedness requires problem-solving across the entire supply chain, with companies sharing technical knowledge, offering mutual aid, and striving for continual improvement. Collaborative is essential. At SEMICON Japan 2019, SEMI will continue to bring companies together to address BCP initiatives and share their technical knowledge with members. Jim Hamajima is president of SEMI Japan.