Companies Compete at SEMI-MSIG European MEMS & Sensors Summit, Imaging & Sensors Summit
GRENOBLE, France ─ August 20, 2018 – SEMI and Strategic Association Partner MEMS & Sensors Industry Group (MSIG) today announced finalists for its Technology Showcase at the SEMI European MEMS & Sensors and MEMS & Imaging Summits 2018. The co-located events will be September 19-21, 2018, at the World Trade Center in Grenoble.
Selected by a committee of industry experts, Technology Showcase finalists will compete for audience votes as they demonstrate new enabling components and materials that are advancing MEMS, sensors and imaging in wearables, Internet of Things (IoT), healthcare, food safety, and other consumer and industrial markets. Winners will be announced at the Gala Dinner on September 20 from 11:00 am to 12:10 pm.
Register for the SEMI-MSIG European MEMS & Sensors Summit 2018 and SEMI-MSIG European Imaging & Sensors Summit 2018 now.
Attend the Technology Showcase and vote for the MEMS, sensors and imaging technologies that will help power a new generation of consumer and industrial applications.
MEMS & Sensors Summit Technology Showcase Finalists
Bosch Sensortec’s ultra-low power MEMS acceleration sensor, BMA400
- Draws 10x less power than competitive accelerometers while delivering high performance to substantially extend the battery lifetime of wearables and IoT applications.
- Demo video: Ultra-low-power acceleration sensor BMA400 for wearables and IoT applications
VTT’s PillarHall® silicon wafers and chips
- VTT Technical Research Centre of Finland’s MEMS-based PillarHall test structures enable easy, cost-efficient and accurate measurements of thin film conformality and characterization, speeding thin film processes.
- Demo video: PillarHall – Accelerating Thin Film R&D
OnScale’s cloud-based simulation package for MEMS
- Enables designers to run hundreds of parallel simulations to achieve maximum performance in a short time frame.
- Demo video: OnScale for MEMs and 5G
DELO Industrial Adhesives’ new materials for MEMS and ASICs
- DELO’s five face coating for ASIC dies shield devices from potentially damaging infrared radiation, preventing unwanted signal noise.
- DELO’s MEMS die-attach adhesives build extremely high aspect ratios for optimal stress decoupling, potentially reducing temperature-induced stresses on devices such as MEMS microphones.
Imaging & Sensors Summit Technology Showcase Finalists
ActLight SA’s low-power dynamic photodiode (DPD) for 3D imaging
- Leverages Time-of-Flight to provide smaller pixel size, lower operating voltage and higher-background light immunity, improving optical performance in smartphones and other applications for which emitted light power is limited.
- Demo video: ActLight ToF solution
IRLYNX’s PyrOnic, the low-cost far infrared imaging sensor
- Transforms the heat that any human emits into electric signals, reducing the cost of image sensors targeting high-volume markets such as human detection, smart building, gesture recognition, and interactive objects.
XenomatiX N.V.’s single-imager 3D LIDAR and 2D camera for automated cars
Uses sensor fusion to overlay 2D and 3D data, providing high-accuracy outdoor long-range detection and tracking of obstacles and road users.
- Demo video: Object tracking based on solid-state LIDAR
Dotphoton’s image compression for professional applications
- Provides 1:10 raw image compression while satisfying the stringent image-retention accuracy required for medical diagnostics, scientific results, passenger safety and strategic decisions.
- Demo video: Dotphoton Explainer
Tusk IC’s mmWave imaging
- Enables cost-effective, fully integrated and compact mmWave imaging chips for dielectric sensing, spectroscopy, gas detection, contactless water concentration measurements, and quality control applications.
See the full shortlist here.
The Technology Showcase is chaired by Ignas van Dommelen, CSO, Sencio (MEMS & Sensors Summit) and by Andreas Bräuer, department head, Fraunhofer IOF (Imaging & Sensors Summit).
The SEMI-MSIG European Summits will take place at the WTC (5-7 Place Robert Schuman, 38000 Grenoble, France).
MEMS & Sensors Summit Premier sponsors include:
Gold Sponsors
Silver Sponsors
Event sponsors
Imaging & Sensors Summit Premier sponsors include:
Gold Sponsor
Silver Sponsor
Event sponsors
Stay in touch via Twitter: MEMS & Sensors Summit (use #MEMSEU), and Imaging & Sensors Summit: (use #imagingEU).
About SEMI
SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.
Press Contacts
Serena Brischetto, SEMI Europe
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Anja-Maria Hastenrath, Embedded PR
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